EP4SGX70HF35C3G - Stratix IV GX 72.6K LE FPGA, 1152-FBGA | Intel
N.º da peça: EP4SGX70HF35C3G ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $1850 | $1.850,00 |
| 10 | $1750 | $17.500,00 |
| 100 | $1620 | $162.000,00 |
| 500 | $1495 | $747.500,00 |
| 1.000 | $1380 | $1.380.000,00 |
EP4SGX70HF35C3G Visão geral
An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) belonging to the broader category of integrated circuits (ICs) > semiconductor devices. Within the digital logic hierarchy, FPGAs sit between ASICs (Application-Specific Integrated Circuits) and CPLDs (Complex Programmable Logic Devices), offering the highest logic density, the most flexible I/O architecture, and on-chip memory blocks, DSP blocks, and high-speed serial transceivers. FPGA hierarchy: FPGA > PLD > logic IC > integrated circuit > semiconductor. FPGAs are widely used as prototyping platforms, custom compute accelerators, and production-volume silicon in networking, defense, industrial imaging, and test equipment.
Key features of the EP4SGX70HF35C3G include dedicated on-chip memory of 7.5 Mbit, 488 user I/Os, embedded 8B/10B-compatible transceivers supporting PCI Express Gen1, Gigabit Ethernet, Serial RapidIO, and basic SerialLite II protocols. The HF35 speed grade targets higher Fmax performance for time-critical paths. The C3 suffix denotes a commercial temperature grade (0°C to 85°C). Built-in configuration options include Passive Serial, Fast Passive Parallel, Active Serial, and JTAG, supported by the Quartus II design toolchain.
Typical applications include high-speed serial interface bridging (PCIe Gen1, GbE, CPRI/OBSAI backhaul), broadcast video processing, military and avionics signal processing, ASIC prototyping, and high-throughput data-acquisition systems. When designing with the EP4SGX70HF35C3G, engineers should plan PCB layer stack-up for the 35 mm FC-FBGA with at least 12 layers for proper transceiver signal integrity. Thermal management via heatsink or chassis airflow is required for sustained high-utilization workloads.
This page synthesizes distributor pricing, drop-in alternatives from the Stratix IV GX family, and practical design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para EP4SGX70HF35C3G — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP4SGX70HF35C3G (mesmo formato e footprint) — diferindo em Package, Speed Grade, Logic Elements, Operating Temperature, Mounting Type.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP4SGX70HF35C2G
✅ Drop-In✓ Em estoque
$1490 / unidade
Ver ficha técnica →EP4SGX110HF35C3G
✅ Drop-In✓ Em estoque
$3128.75 / unidade
Ver ficha técnica →EP4SGX230HF35I4G
✅ Drop-In✓ Em estoque
$7900 / unidade
Ver ficha técnica →EP4SGX360HF35C3
✅ Drop-In✓ Em estoque
$6850 / unidade
Ver ficha técnica →EP4SGX70DF29I3G
✅ Drop-In✓ Em estoque
$1080 / unidade
Ver ficha técnica →EP4SGX70HF35C3G Classificações máximas e características elétricas
| Series | Stratix IV GX |
| Logic Elements | 72,600 |
| LABs/CLBs | 2,904 |
| Total RAM Bits | 7,564,880 |
| User I/O Count | 488 |
| Number of Transceivers | 8 |
| Transceiver Data Rate (max) | 3.125 Gbps |
| Encapsulamento | 1152-BBGA, FCBGA (35 mm × 35 mm) |
| Process Technology | 40 nm |
| Core Supply Voltage | 0.87 V to 0.93 V |
| Operating Temperature (Junction) | 0°C to 85°C |
| Temperature Grade | Commercial (C3) |
| Tipo de montagem | Surface Mount |
| Speed Grade | HF35 |
| Configuration Method | Passive Serial, Fast Passive Parallel, Active Serial, JTAG |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do EP4SGX70HF35C3G 1152-bbga, fcbga (35 mm × 35 mm)
Configuração de pinos para EP4SGX70HF35C3G (pacote 1152-bbga, fcbga (35 mm × 35 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP4SGX70HF35C3G.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP4SGX70HF35C3G é adequado para 6 aplicaçãos: High-Bandwidth Serial Interface Bridging, Broadcast Video Processing, Military and Avionics Signal Processing, ASIC Prototyping, High-Throughput Data Acquisition Systems, Industrial Control and Factory Automation.
High-Bandwidth Serial Interface Bridging
The EP4SGX70HF35C3G's 8 transceivers at 3.125 Gbps make it well suited for protocol bridging between PCIe Gen1, Gigabit Ethernet, Serial RapidIO, and CPRI links. With 72,600 logic elements and 7.5 Mbit of embedded RAM, the device has sufficient resources for protocol stack processing on each lane plus a host CPU interface. Engineers commonly use this part in wireless backhaul radios where CPRI traffic from a baseband ASIC must be aggregated and forwarded to a backhaul Ethernet network; the FPGA handles CPRI-to-Ethernet conversion with deterministic latency that software-based bridging cannot match.
Recomendado
Broadcast Video Processing
The 488 user I/O pins and 7.5 Mbit block RAM suit the EP4SGX70HF35C3G to SDI/HD-SDI/3G-SDI video routers, format converters, and on-screen-display overlay engines used in broadcast studios. The 3.125 Gbps transceivers support SMPTE 424M 3G-SDI directly without external serializer/deserializer parts. The 40 nm Stratix IV fabric delivers the DSP blocks needed for color-space conversion and scaling, while the large I/O count accepts multiple parallel video buses plus genlock and ancillary data interfaces on a single device.
Recomendado
Military and Avionics Signal Processing
Although the EP4SGX70HF35C3G is commercial temperature grade (0°C to 85°C), the same silicon in industrial or military temperature variants (EP4SGX70HF35I3G, EP4SGX70HF35I4G) is widely used in defense signal-processing applications including electronic warfare, radar pre-processing, and secure communications. The 8 transceivers support MIL-STD-1553B bridging, ARINC 429 aggregation, and digitized-RF links. Conformal-coated boards using this part routinely appear in unmanned aerial vehicle (UAV) payloads, where the FPGA's parallel DSP resources replace multiple DSP chips.
Recomendado
ASIC Prototyping
With 72,600 logic elements and 488 I/O, the EP4SGX70HF35C3G fits mid-complexity ASIC prototyping where designers map gate-level netlists to the FPGA for hardware-software co-validation. The 7.5 Mbit block RAM emulates SRAM blocks, while the 8 transceivers let the prototype validate serial I/O without external PHYs. Quartus II DesignPro provides automatic ASIC-to-FPGA partitioning and time-budget-driven synthesis, and multiple FPGAs of this part can be cascaded on a single prototyping board for larger ASIC designs.
Recomendado
High-Throughput Data Acquisition Systems
Scientific instrumentation and medical imaging systems use the EP4SGX70HF35C3G as the central aggregator for multi-channel ADC data streams. The 488 user I/Os accept parallel LVDS interfaces from multiple ADCs, while 8 transceivers forward processed samples over 10 Gigabit Ethernet to host servers. The 7.5 Mbit embedded RAM buffers incoming ADC bursts before DSP pipelines compress and packetize data. Compared with a discrete FIFO plus DSP chip approach, this single-FPGA implementation reduces board area and lowers BOM cost.
Recomendado
Industrial Control and Factory Automation
Factory automation controllers use the EP4SGX70HF35C3G for EtherCAT, PROFINET, and SERCOS III master implementations where deterministic latency and protocol conversion are required. The 8 transceivers link multiple industrial Ethernet segments at 1 Gbps, while the 488 I/Os provide digital and analog interface glue logic. The commercial temperature grade is suitable for IP65-rated control cabinets, and the 40 nm low-power process keeps junction temperatures well below limits during continuous factory-floor operation at moderate ambient temperatures.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP4SGX70HF35C3G — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP4SGX70HF35C2G | EP4SGX110HF35C3G | EP4SGX230HF35I4G | EP4SGX360HF35C3 | EP4SGX70DF29I3G |
|---|---|---|---|---|---|---|
| Package | 1152-BBGA FCBGA (35x35) | 1152-BBGA FCBGA (35x35) - same | 1152-BBGA FCBGA (35x35) - same | 1152-BBGA FCBGA (35x35) - same | 1152-BBGA FCBGA (35x35) - same | 780-BBGA FCBGA (29x29) - smaller |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 72,600 | 72,600 | 105,600 | 228,000 | 353,600 | 72,600 |
| Transceivers | 8 @ 3.125 Gbps | 8 @ 3.125 Gbps | 8 @ 3.125 Gbps | 16 @ 3.125 Gbps | 24 @ 3.125 Gbps | 8 @ 3.125 Gbps |
| User I/O | 488 | 488 | 488 | 564 | 564 | 372 |
| Embedded RAM | 7,564,880 bits | 7,564,880 bits | 9,564,480 bits | 17,133,440 bits | 20,831,744 bits | 7,564,880 bits |
| Speed Grade | HF35 (C3 commercial) | HF35 (C2 commercial) | HF35 (C3 commercial) | HF35 (I4 industrial) | HF35 (C3 commercial) | DF29 (I3 industrial) |
| Operating Temperature | 0°C to 85°C (commercial) | 0°C to 85°C (commercial) | 0°C to 85°C (commercial) | -40°C to 100°C (industrial) | 0°C to 85°C (commercial) | -40°C to 100°C (industrial) |
| Lifecycle Status | NRNR (as of 2026-09-10) | NRNR | NRNR | NRNR | NRNR | NRNR |
Principais diferenciais
- Highest-density 1152-ball FCBGA Stratix IV GX with 488 user I/Os and 8 transceivers in the 70K-LE class (vs EP4SGX70DF29I3G)
- C3 speed grade offers higher Fmax than C2 grade (vs EP4SGX70HF35C2G)
- Integrated 8B/10B encoders and protocol hard-IPs reduce soft-logic usage (vs Stratix IV E (no transceivers))
- Same silicon family as higher-density siblings for PCB reuse (vs EP4SGX110HF35C3G)
Notas de projeto
Estimated: the 1152-FCBGA package at 1.0 mm pitch requires a 12-layer PCB stack-up with 4-6 routing layers plus dedicated ground and power planes. Microvia (laser-drilled) technology is mandatory for inner-row breakout; through-hole vias cannot escape the inner balls without exceeding manufacturing limits. Plan the stack-up with the PCB fab house before schematic capture.
Estimated: at 100% logic utilization with all 8 transceivers active, the EP4SGX70HF35C3G can dissipate 8-12 W. The FCBGA exposes its die through the top surface for heatsink attachment; use a thermal interface material rated for 1.0 W/m-K or better and provide 1.0 m/s minimum airflow across the heatsink for sustained operation in the upper commercial temperature range.
Estimate: 100-ohm differential impedance controlled routing is required for all 8 transceiver channels. Maintain length matching within 5 mils per pair and across pairs of the same protocol group. Reference plane continuity must not be broken under any differential pair; use ground fill voids to maintain return-path integrity.
Do not confuse the EP4SGX70HF35C3G (1152-FCBGA) with the EP4SGX70DF29C3G (780-FCBGA) - they share the same die but require different PCB layouts. The 'H' field in the ordering code denotes the 1152-ball high-I/O package while 'D' denotes the 780-ball mid-density package. Verify the marking on the device top before PCB assembly rework.
Estimated: the Stratix IV GX core requires 0.87-0.93 V at peak currents exceeding 20 A. Use a multi-phase synchronous buck regulator with at least 6 phases; monolithic single-phase solutions will fail to maintain regulation under transients. Decoupling requires 200+ bulk ceramic capacitors distributed under the BGA plus on-package decoupling for high-frequency transients.
Informações de conformidade
RoHS compliance indicated by 'G' suffix in ordering code. AEC-Q100 not applicable for FPGA logic devices. Halogen-free status not explicitly listed in available data.
