Altera

EPF10K10AQC208-3 - FLEX 10KA FPGA, 10K Gates, 208-PQFP | Altera

N.º da peça: EPF10K10AQC208-3 ✗ Fim de vida

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3.3 V Vdss 208-BQFP / 208-PQFP, 0.5 mm pitch, gull-wing Package -3 (slowest commercial) Speed 6,144 bits Memory

A partir de $31.4 USD / unidade

MOQ: 1 |

Preço atualizado: 2026-09-11

Preços por volume

Qtd.	Preço unitário	Total
1	$48.98	$48,98
10	$46.5	$465,00
100	$41.2	$4.120,00
500	$36.75	$18.375,00
1.000	$31.4	$31.400,00

ℹ️ Todos os preços estão em USD

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EPF10K10AQC208-3 Visão geral

The Altera EPF10K10AQC208-3 is a member of the FLEX 10KA embedded programmable logic family, delivering 10,000 typical gates (5,000 logic elements) of programmable logic capacity in a 208-pin Plastic Quad Flat Pack (PQFP / 208-BQFP) package with 134 user I/Os. It is a CMOS SRAM-based Field Programmable Gate Array (FPGA) designed for high-volume glue-logic, bus-interface, and state-machine applications that benefit from embedded array blocks (EABs) for on-chip memory and DSP functions. The "-3" speed grade corresponds to the slowest commercial FLEX 10KA timing bin (typical propagation delay of about 0.6 ns per LUT, internal clock rates typically below 100 MHz) and the "QC" suffix denotes the commercial 0 to 70 °C operating range.

An FPGA is a semiconductor device whose digital logic function is defined after manufacture by a customer-supplied configuration bitstream stored in external SRAM or an on-board PROM. FPGAs sit hierarchically under programmable logic devices (PLD) and complement fixed-function ASICs by offering rapid prototyping, in-field re-programmability, and lower NRE cost for low-to-medium volumes. The FLEX 10KA family was the industry's first embedded programmable logic device family to provide System-on-a-Programmable-Chip (SOPC) integration through Embedded Array Blocks (EABs) that can implement on-chip RAM, ROM, FIFO or multiplier functions without consuming general-purpose logic.

Key features of the EPF10K10AQC208-3 include 576 logic elements, 72 Logic Array Blocks (LABs), 6144 RAM bits distributed across the EABs, 3.3 V core supply, and 134 user I/O pins routed through Altera's MultiVolt I/O interface, which supports interfacing with 2.5 V, 3.3 V and 5 V devices on the same die. The EAB-based embedded memory subsystem provides true dual-port RAM, ROM and FIFO capability, eliminating the need for an external memory chip in many glue-logic designs.

Architecturally, the device is built on a 0.42 µm CMOS SRAM process with four-level routing hierarchy and continuous InterconnectArray™ fast-path lines between adjacent LABs, which minimizes interconnect delay for near-neighbor logic. Each LAB contains eight Logic Elements (LEs), each with a 4-input look-up table, a programmable register, and a carry chain, so 8-bit counters, adders and arithmetic units can be packed densely. Configuration is loaded via the Altera ByteBlaster or BitBlaster cable into the on-chip SRAM configuration latches, which means the device is volatile and must be re-configured at every power-up from a serial PROM or system controller.

Typical applications for the EPF10K10AQC208-3 include peripheral bus bridges (PCI, ISA, VME), telecom glue logic, industrial control state machines, prototype ASIC replacement, video and image processing front-ends, and test-and-measurement fixtures. Designers often drop this part in when migrating off older 5 V PLDs or when a quick-turn development cycle is required before committing to a gate-array.

When designing with this device, ensure that your JTAG chain order, configuration scheme (PS, AS, or JTAG), and I/O bank voltages are correctly assigned in the Quartus or MAX+PLUS II project. The 208-pin PQFP has a relatively large 30.6 mm body footprint with 0.5 mm lead pitch and gull-wing terminations that require careful solder-pad design to avoid bridges during reflow.

This page synthesizes distributor pricing from DigiKey, Mouser, Heisener and Octopart, surfaces drop-in and speed-grade alternatives from the same Altera / Intel FLEX 10KA family, and adds design notes that go beyond the bare datasheet summary.

Alternativas drop-in para EPF10K10AQC208-3 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com EPF10K10AQC208-3 (mesmo formato e footprint) — diferindo em Package, Family, Process Technology, Speed Grade, Operating Temperature.

EPF10K10AQC208-2

Intel

Package: 208-Pin PQFP (BFQFP) 28x28 mm

Family: FLEX-10KA

Process Technology: 0.3 um CMOS SRAM