EPF6016BC256-2 - FLEX 6000 FPGA, 16K Gates, 204 I/O | Altera
N.º da peça: EPF6016BC256-2 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $13.95 | $1.395,00 |
| 500 | $12.1 | $6.050,00 |
| 1.000 | $10.85 | $10.850,00 |
EPF6016BC256-2 Visão geral
A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines programmable logic elements, configurable interconnect, and I/O blocks into a single silicon die. FPGAs sit above CPLDs in the programmable logic hierarchy and below ASICs in NRE cost; SRAM-based devices like the FLEX 6000 family are reconfigurable in-system, allowing rapid prototyping, field updates, and design reuse across product revisions without retooling.
Key features include up to 1320 logic elements, 204 user I/Os, embedded array blocks for memory implementation, and JTAG-based in-system programmability via the IEEE 1149.1 boundary-scan interface. The device operates across the commercial 0C to 85C temperature range and supports fast synchronous state machines, register-intensive datapaths, and glue-logic replacement.
The FLEX 6000 architecture is built on a 0.42-micron SRAM process with a four-input look-up table (LUT) per logic element and a continuous FastTrack interconnect. This delivers predictable timing, low static power, and deterministic place-and-route results - ideal for bus-interface bridging, peripheral controllers, and custom I/O expansion.
Typical applications include industrial glue-logic, communication bridging between legacy microcontrollers and modern peripherals, ASIC prototyping, low-volume custom controllers, and DSP co-processing front-ends. The 204 I/O count makes it well-suited for parallel bus interfacing and bus-width conversion.
When designing with this FPGA, ensure the 5V VCCIO and VCCINT rails share a clean power source and that decoupling follows the reference design. Quartus II (legacy) or MAX+PLUS II toolchains are used for place-and-route, and JTAG programming requires the ByteBlasterMV download cable.
This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design notes not found on the manufacturer datasheet alone - providing engineers with the cross-reference intelligence needed to manage the FLEX 6000 lifecycle.
Alternativas drop-in para EPF6016BC256-2 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPF6016BC256-2 (mesmo formato e footprint) — diferindo em Package, Process Technology, Operating Temperature, Device Type, Configuration Method.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPF6016AFC256-2
✅ Drop-In✓ Em estoque
$33.05 / unidade
Ver ficha técnica →EPF6016AFC256-3
✅ Drop-In✓ Em estoque
$22.1 / unidade
Ver ficha técnica →EPF6016BC256-2 Classificações máximas e características elétricas
| Family | FLEX 6000 |
| Logic Elements | 1320 |
| Typical Gates | 16,000 |
| Maximum Logic Gates | 24,000 |
| User I/O Pins | 204 |
| Supply Voltage (VCCINT / VCCIO) | 4.75 V to 5.25 V |
| Encapsulamento | 256-FBGA (FineLine BGA, 17x17 mm) |
| Temperatura de operação | 0C to +85C (Commercial) |
| Speed Grade | -2 |
| Process Technology | 0.42 um SRAM |
| Programmability | SRAM-based, in-system reconfigurable |
| Configuration Interface | JTAG (IEEE 1149.1) + serial |
| Internal Memory | Embedded array blocks (EABs) |
| Tipo de montagem | Surface Mount (BGA) |
Configuração de pinos do EPF6016BC256-2
| Pino A1 | IO — User I/O ball (pin assignment depends on configuration) |
| Pino A2 | IO — User I/O ball |
| Pino A3 | IO — User I/O ball |
| Pino A4 | VCCINT — Core supply voltage (4.75-5.25V) |
| Pino A5 | GND — Ground |
| Pino A6 | VCCIO — I/O supply voltage (4.75-5.25V) |
| Pino A7 | IO — User I/O ball |
| Pino A8 | IO — User I/O ball |
| Pino B1 | IO — User I/O ball |
| Pino B2 | nCONFIG — Configuration control (active-low reset) |
| Pino B3 | IO — User I/O ball |
| Pino B4 | IO — User I/O ball |
| Pino B5 | IO — User I/O ball |
| Pino B6 | IO — User I/O ball |
| Pino B7 | nSTATUS — Configuration status (active-low) |
| Pino B8 | CONF_DONE — Configuration complete indicator |
| Pino C1 | IO — User I/O ball |
| Pino C2 | IO — User I/O ball |
| Pino C3 | TDI — JTAG Test Data In |
| Pino C4 | TCK — JTAG Test Clock |
| Pino C5 | TMS — JTAG Test Mode Select |
| Pino C6 | TDO — JTAG Test Data Out |
| Pino C7 | DCLK — Configuration clock input |
| Pino C8 | IO — User I/O ball |
| Pino D1 | IO — User I/O ball |
| Pino D2 | IO — User I/O ball |
| Pino D3 | IO — User I/O ball |
| Pino D4 | GND — Ground |
| Pino D5 | VCCINT — Core supply voltage |
| Pino D6 | GND — Ground |
| Pino D7 | IO — User I/O ball |
| Pino D8 | IO — User I/O ball |
| Pino E1 | IO — User I/O ball |
| Pino E2 | IO — User I/O ball |
| Pino E3 | IO — User I/O ball |
| Pino E4 | VCCIO — I/O supply voltage |
| Pino E5 | GND — Ground |
| Pino E6 | VCCIO — I/O supply voltage |
| Pino E7 | IO — User I/O ball |
| Pino E8 | IO — User I/O ball |
| Pino F1 | IO — User I/O ball |
| Pino F2 | IO — User I/O ball |
| Pino F3 | IO — User I/O ball |
| Pino F4 | GND — Ground |
| Pino F5 | VCCINT — Core supply voltage |
| Pino F6 | GND — Ground |
| Pino F7 | IO — User I/O ball |
| Pino F8 | IO — User I/O ball |
| Pino G1 | IO — User I/O ball |
| Pino G2 | IO — User I/O ball |
| Pino G3 | IO — User I/O ball |
| Pino G4 | VCCIO — I/O supply voltage |
| Pino G5 | GND — Ground |
| Pino G6 | VCCIO — I/O supply voltage |
| Pino G7 | IO — User I/O ball |
| Pino G8 | IO — User I/O ball |
| Pino H1 | IO — User I/O ball |
| Pino H2 | IO — User I/O ball |
| Pino H3 | IO — User I/O ball |
| Pino H4 | GND — Ground |
| Pino H5 | VCCINT — Core supply voltage |
| Pino H6 | GND — Ground |
| Pino H7 | IO — User I/O ball |
| Pino H8 | IO — User I/O ball |
Aplicações típicas
EPF6016BC256-2 é adequado para 6 aplicaçãos: Industrial Glue Logic Replacement, Legacy Communication Bus Bridging, ASIC Prototyping and Validation, DSP Front-End Co-Processing, Low-Volume Custom Controllers, Test and Measurement Equipment.
Industrial Glue Logic Replacement
The EPF6016BC256-2 replaces multiple discrete 74-series logic ICs (gates, muxes, latches, buffers) on legacy industrial PCBs. With 1320 logic elements and 204 user I/Os in the 256-FBGA package, it absorbs up to ~50 standard-logic chips into one device, drastically reducing board area, BOM count, and assembly cost. The 5V tolerant I/O makes it ideal for industrial 5V backplanes. Designers typically describe their logic in VHDL/Verilog using MAX+PLUS II, then synthesize to the FLEX 6000 LUT-based architecture, replacing 7400-series glue logic and freeing PCB real estate for new functionality.
Recomendado
Legacy Communication Bus Bridging
The EPF6016BC256-2 is widely used as a bridge between legacy parallel buses (ISA, PC/104, VME) and modern high-speed serial interfaces. Its 204 I/Os comfortably handle 16-bit and 32-bit wide bus widths plus handshaking signals, while internal logic elements implement protocol conversion state machines. The 1320-LE fabric fits typical bridge designs with margin for debug logic. The 5V VCCIO directly interfaces legacy 5V peripherals without level shifters, simplifying PCB design and reducing BOM. Speed grade -2 supports bus clocks up to 60 MHz typical, sufficient for most legacy bus applications.
Recomendado
ASIC Prototyping and Validation
Designers use the EPF6016BC256-2 as a low-cost prototyping vehicle for ASIC designs targeting 5V-rail industrial or consumer ASICs. Its 1320 logic elements are sufficient to validate control logic, glue logic, and basic datapath blocks before committing to mask costs. FPGAs in the FLEX 6000 family have predictable timing that closely emulates ASIC behavior for control-dominated designs, and JTAG-based in-system reconfigurability enables rapid iteration. The 204 I/Os expose enough test points for real-time logic-analyzer probing of internal nets, making FPGA prototypes a powerful validation step before silicon spin.
Recomendado
DSP Front-End Co-Processing
The EPF6016BC256-2 can serve as a co-processor for DSP front-end tasks including FIR filtering, FFT preprocessing, and digital up/down-conversion in cost-sensitive applications. Its embedded array blocks (EABs) implement small distributed RAMs for coefficient storage, and the LUT-based logic elements run parallel multiply-accumulate structures. The 256-FBGA package's short traces preserve signal integrity at DSP clock rates, and the 204 I/Os provide enough bandwidth for parallel data paths. While modern designs use dedicated DSP blocks in Cyclone/Stratix families, FLEX 6000 remains viable for legacy DSP subsystems.
Recomendado
Low-Volume Custom Controllers
For low-volume production runs (hundreds to a few thousand units) where ASIC NRE costs are prohibitive, the EPF6016BC256-2 delivers ASIC-like integration with FPGA programmability. Designers implement custom motor-control, sensor-fusion, or peripheral controllers in VHDL, burn the configuration into the SRAM via JTAG at production, and deploy. With 1320 logic elements and 204 I/Os, it supports substantial state-machine complexity plus multiple peripheral interfaces. The FLEX 6000 family's mature toolchain (MAX+PLUS II) and broad IP library shorten development time, while Altera/Intel's long-term supply program supports end-of-life bridging.
Recomendado
Test and Measurement Equipment
Test equipment manufacturers use the EPF6016BC256-2 to implement pattern generators, custom timing controllers, and signal-conditioning logic in bench-top instruments. Its 204 user I/Os drive multiple DUT parallel interfaces simultaneously, while 1320 logic elements implement timing/state-machine cores. The 5V VCCIO directly interfaces legacy instrumentation signal levels without level translation, simplifying the analog front-end design. SRAM-based reconfigurability allows field upgrades to add new test patterns or fix bugs without hardware recall - a major advantage over fixed-function ASIC solutions in T&M markets.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPF6016BC256-2 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPF6016AFC256-2 | EPF6016AFC256-3 |
|---|---|---|---|
| Brand | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) |
| Package | 256-FBGA FineLine (17x17 mm) | 256-FBGA FineLine - same | 256-FBGA FineLine - same |
| Logic Elements | 1320 | 1320 | 1320 |
| Typical Gates | 16,000 | 16,000 | 16,000 |
| User I/Os | 204 | 204 | 204 |
| Speed Grade | -2 (mid) | -2 (mid) | -3 (fastest) |
| Supply Voltage | 4.75V to 5.25V | 4.75V to 5.25V | 4.75V to 5.25V |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Drop-in Compatible | N/A (reference) | Yes (100% pin-compatible) | Yes (pin-compatible, faster fMAX) |
Principais diferenciais
- True second-source availability with identical silicon (vs EPF6016AFC256-2)
- Mid-tier speed grade balances cost and performance (vs EPF6016AFC256-3)
- 204 user I/Os versus smaller density competitors (vs EPF6016AQC208-2)
Notas de projeto
The EPF6016BC256-2 requires separate VCCINT (core) and VCCIO (I/O) rails, both within 4.75V to 5.25V. Place 0.1uF ceramic decoupling capacitors adjacent to every pair of VCC/GND balls, with bulk 10uF tantalum or ceramic caps at board entry. Estimated: with 1320 LEs at 100% utilization and 50 MHz toggle, expect ICCINT ~150 mA and ICCIO ~100 mA - plan power budget and thermal dissipation accordingly. For mixed-voltage designs, drive 5V outputs into 3.3V loads only with series resistors or level shifters; the FLEX 6000 I/O is 5V tolerant but not 3.3V compatible without design care.
While the FLEX 6000 family is not high-power, sustained operation near the 85C commercial limit requires thermal management. Theta-JA for the 256-FBGA package is approximately 25 C/W typical with a JEDEC-standard test board. Estimated: at 1W total dissipation, junction temperature rise is ~25C above ambient. In enclosed industrial cabinets with ambient near 70C, consider 100 LFM airflow or a heat spreader to maintain reliability. Avoid placing the FPGA directly next to high-power components like DC-DC converters; route ground plane unbroken beneath the BGA for heat spreading.
Do not assume 3.3V peripherals work directly with the FLEX 6000 - the 5V VCCIO and TTL/CMOS-compatible I/O standards can damage 3.3V-only inputs. Use bidirectional level shifters (e.g., 74LVC245) when bridging to 3.3V devices. Also note: SRAM-based FPGAs require configuration at every power-up; ensure the JTAG chain is properly terminated and the ByteBlasterMV header is accessible for field updates. Estimated: in production, configure from a serial configuration PROM (e.g., EPC1) for one-time setup. Finally, this part is OBSOLETE - new designs should target Cyclone IV or Cyclone 10 LP for long-term supply.
Informações de conformidade
RoHS and lead-free status not explicitly stated in verified distributor data; marked unknown. Commercial temperature grade (0C to 85C); no AEC-Q100 automotive qualification. For automotive or medical applications, verify compliance directly with Intel/Altera material declarations before design-in.
