EPF6016AFC256-3 - 16K Gates FLEX 6000 FPGA, 171 I/O | Intel
N.º da peça: EPF6016AFC256-3 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $29.85 | $2.985,00 |
| 500 | $25.4 | $12.700,00 |
| 1.000 | $22.1 | $22.100,00 |
EPF6016AFC256-3 Visão geral
A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device containing an array of programmable logic blocks, interconnect, and I/O cells that can be customized after manufacturing via a configuration bitstream. The FLEX 6000 belongs to the older Altera/Intel hierarchy: FPGA -> programmable logic -> SRAM-based PLD -> integrated circuit. It sits below the APEX and Stratix families in capacity but offers low-cost, fast prototyping for designs that would otherwise require a masked gate array.
Key features include 1320 logic elements distributed across 132 LABs, embedded SRAM distributed throughout the fabric, multi-voltage I/O support, and in-system programmability through the IEEE 1149.1 JTAG interface. The 256-ball FineLine BGA package enables dense board placement and provides 171 usable I/O pins for high pin-count glue-logic designs. Power consumption is governed by CMOS static current, making the part suitable for power-sensitive embedded platforms.
The FLEX 6000 architecture uses a continuous interconnect backbone with row-and-column routing channels feeding each LAB, which contains ten LEs with carry-chain and cascade support. Configuration is loaded from an external serial or parallel PROM into on-chip SRAM; this SRAM-based approach makes the device volatile and requires reconfiguration on every power-up. The part is fabricated on a 0.42 µm four-layer-metal CMOS process tuned for predictable timing closure.
Typical applications include industrial control glue-logic, telecommunications interface bridging, ASIC prototyping and emulation, low-cost DSP co-processing, and legacy system replacement where existing PCBs require a drop-in FLEX 6000 footprint. The device is also widely used in educational platforms and FPGA design training kits.
When designing with this part, plan the configuration PROM selection carefully: the EPF6016 will not retain its bitstream without external memory. Use the Quartus II (or MAX+PLUS II) toolchain for design entry, and verify I/O bank voltage compatibility when interfacing with 5 V logic.
This page synthesizes Intel/Altera datasheet specifications, current distributor inventory, and engineering design notes that go beyond the manufacturer datasheet to support sourcing, replacement, and lifecycle decisions.
Alternativas drop-in para EPF6016AFC256-3 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPF6016AFC256-3 (mesmo formato e footprint) — diferindo em Package, Process Technology, Operating Temperature, Speed Grade, Device Type.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPF6016AFC256-3N
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EPF6016AFC256-2
✅ Drop-In✓ Em estoque
$33.05 / unidade
Ver ficha técnica →EPF6010ATC100-3
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$18.9 / unidade
Ver ficha técnica →EPF6010ATC144-3
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$9.75 / unidade
Ver ficha técnica →EPF10K30EFC256-3
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$24.6 / unidade
Ver ficha técnica →EPF6016AFC256-3 Classificações máximas e características elétricas
| Family | FLEX 6000 |
| Device Type | FPGA (Field Programmable Gate Array) |
| Equivalent Gates | 16K |
| Logic Elements (LEs) | 1320 |
| Logic Array Blocks (LABs) | 132 |
| User I/Os | 171 |
| Maximum Internal Frequency | 142.86 MHz |
| Edge Rate | 172 MHz |
| Process Technology | 0.42 µm CMOS |
| Core Supply Voltage | 3.3 V |
| Encapsulamento | 256-ball FineLine BGA (FBGA) |
| Contagem de pinos | 256 |
| Speed Grade | -3 |
| Configuration Method | SRAM (volatile, requires external PROM) |
| Programming Interface | JTAG (IEEE 1149.1) |
| Temperatura de operação | 0 °C to +85 °C (commercial) |
| Tipo de montagem | Surface Mount (BGA) |
Guia de Configuração de Pinos do EPF6016AFC256-3 256-ball fineline bga (fbga)
Configuração de pinos para EPF6016AFC256-3 (pacote 256-ball fineline bga (fbga)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EPF6016AFC256-3.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EPF6016AFC256-3 é adequado para 6 aplicaçãos: Industrial Glue-Logic and Protocol Bridging, ASIC Prototyping and Emulation, Telecommunications Interface Bridging, Legacy System Replacement and Field Upgrades, FPGA Education and Design Training, Low-Cost DSP Co-Processing.
Industrial Glue-Logic and Protocol Bridging
The EPF6016AFC256-3 is well suited for industrial glue-logic, protocol bridging, and machine-control signal conditioning with its 171 user I/Os and 16K gates of programmable logic. The 256-ball FineLine BGA delivers high pin density for designs that aggregate multiple asynchronous interfaces (UART, SPI, parallel bus) into a unified control plane. Its 142.86 MHz fMAX handles real-time control loops at typical industrial cycle rates of 1-10 kHz without timing closure issues, while 1320 LEs provide headroom for state-machine decoding. Engineers should note the 0 °C to +85 °C commercial temperature range and obsolete lifecycle when planning long-term industrial deployments.
Recomendado
ASIC Prototyping and Emulation
With 1320 LEs and 132 LABs, the EPF6016AFC256-3 enables ASIC prototyping and emulation of medium-complexity designs before committing to mask tooling. The SRAM-based architecture supports rapid design iteration: a new bitstream can be loaded in milliseconds via JTAG, allowing design teams to validate register-transfer logic, bus arbitration, and peripheral interfaces. Quartus II timing analysis provides realistic performance estimates for the target ASIC. The 171 I/Os expose enough signal pins to emulate multi-peripheral SoC blocks while staying within the device's 142.86 MHz timing envelope.
Recomendado
Telecommunications Interface Bridging
Telecommunications interface bridging between legacy and modern buses benefits from the EPF6016AFC256-3's 171 I/Os and configurable I/O voltage standards. The FLEX 6000 family supports LVTTL, LVCMOS, PCI, and other standards, enabling direct bridging between 3.3 V and 5 V domains without external transceivers for many signal classes. At 142.86 MHz internal fMAX, the part handles T1/E1 framing logic, HDLC controllers, and parallel telecom backplanes comfortably. SRAM volatility means telecom equipment using this part must include a reliable configuration PROM in the boot path.
Recomendado
Legacy System Replacement and Field Upgrades
The EPF6016AFC256-3 is the canonical drop-in choice for legacy system replacement when original FLEX 6000 parts fail or are unobtainable. With the same 256-ball FineLine BGA footprint and pinout as the original EPF6016AFC256 family, this part installs directly onto existing PCBs without rework. Its -3 speed grade is the slowest of the family, matching the timing of the most widely deployed legacy designs and avoiding timing-margin surprises. Long-term field support planning should account for the obsolete lifecycle status and limited authorized stock.
Recomendado
FPGA Education and Design Training
Educational institutions and training labs favor the EPF6016AFC256-3 for teaching FPGA fundamentals because of its mature toolchain (MAX+PLUS II and Quartus II), abundant tutorial materials, and forgiving timing characteristics at -3 speed grade. The 1320 LEs provide enough complexity for meaningful coursework on state machines, pipelining, and bus architectures without overwhelming beginners. The 171 user I/Os expose students to real-world pin-count and bank-voltage constraints. Its obsolete status means labs should procure multiple units while stock remains.
Recomendado
Low-Cost DSP Co-Processing
Low-cost DSP co-processing tasks such as FIR filtering, FFT preprocessing, and custom peripheral control are well within the EPF6016AFC256-3's envelope. The 132 LABs and dedicated carry-chain support enable efficient multiply-accumulate structures for parallel DSP arithmetic. At 142.86 MHz fMAX, the device performs 16-tap FIR filters at sample rates exceeding 5 MHz across parallel channel arrays. The SRAM-based fabric lets designers update coefficients in real time via JTAG or parallel peripheral writes, supporting adaptive filter applications.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPF6016AFC256-3 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPF6016AFC256-3N | EPF6016AFC256-2 | EPF10K30EFC256-3 | EPF6010ATC100-3 | EPF6010ATC144-3 |
|---|---|---|---|---|---|---|
| Package | 256-ball FineLine BGA (FBGA-256) | 256-ball FineLine BGA (FBGA-256) - same | 256-ball FineLine BGA (FBGA-256) - same | 256-ball FineLine BGA (FBGA-256) - same | 100-pin TQFP - different | 144-pin TQFP - different |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Family | FLEX 6000 | FLEX 6000 - same | FLEX 6000 - same | FLEX 10K - upgrade | FLEX 6010 - upgrade | FLEX 6010 - upgrade |
| Equivalent Gates | 16K | 16K | 16K | 30K | 10K | 10K |
| Logic Elements | 1320 | 1320 | 1320 | 2460 | 880 | 880 |
| User I/Os | 171 | 171 | 171 | 246 | 71 | 102 |
| Speed Grade | -3 | -3 | -2 (faster) | -3 | -3 | -3 |
| Process | 0.42 µm CMOS | 0.42 µm CMOS | 0.42 µm CMOS | 0.42 µm CMOS | 0.42 µm CMOS | 0.42 µm CMOS |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 5.0 V | 3.3 V | 3.3 V |
Principais diferenciais
- Pin-compatible lead-free upgrade path (vs EPF6016AFC256-3N)
- Faster speed-grade option in same footprint (vs EPF6016AFC256-2)
- Higher logic capacity in same footprint (vs EPF10K30EFC256-3)
Notas de projeto
The EPF6016AFC256-3 is SRAM-based and volatile; it cannot retain its bitstream without power and must be reconfigured on every power-up. Provide a stable 3.3 V core supply and a configuration PROM (such as EPC2 or EPC16) wired in passive-serial, passive-parallel, or JTAG mode. The configuration interface must complete bitstream load before any user I/O becomes active; budget 100-200 ms for typical 16K-gate designs. Add a reset supervisor to delay system release until CONF_DONE asserts.
Use a multi-layer PCB with dedicated ground and power planes for the 256-ball FineLine BGA footprint. The BGA ball pitch (typically 1.0 mm for FineLine BGA) requires laser-drilled microvias or via-in-pad for breakout. Place 0.1 µF decoupling capacitors on each VCCIO and VCCINT pin within 5 mm of the ball. Add 10 µF bulk capacitors near the device. Match trace lengths on high-speed clock and JTAG signals to avoid skew across the array.
Do not assume the EPF6016AFC256-3 is in active production: it is obsolete as of 2026-09-11. Stock is limited and pricing volatile; place orders with multiple qualified distributors to mitigate supply risk. Avoid mixing speed grades -3 and -2 on the same PCB bus: timing analysis must be redone for the new grade. I/O bank voltages must match the peripheral supply; mixing 3.3 V and 5 V on the same bank violates absolute maximum ratings.
Estimated: at 142.86 MHz internal fMAX with 100% logic utilization, the EPF6016AFC256-3 dissipates approximately 0.5-1.0 W dynamic power, plus a static component of typically 50-100 mW. With FineLine BGA theta_JA of approximately 25-30 °C/W on a 4-layer JEDEC test board, junction temperature rise above ambient is 15-30 °C. Commercial temperature range is 0 °C to +85 °C; the junction must remain below 125 °C absolute maximum. Adequate PCB copper area (at least 1 sq inch of unbroken ground plane under the BGA) provides sufficient cooling without a heatsink.
Informações de conformidade
Original EPF6016AFC256-3 uses lead-bearing finish (non-RoHS). The '-3N' suffix variant is lead-free RoHS compliant. AEC-Q100 not applicable for legacy FPGAs. Reach and conflict-mineral data not available in verified sources.
