EPF81188ARI240-4 - FLEX 8000 FPGA, 12K Gates, 240-RQFP | Intel
N.º da peça: EPF81188ARI240-4 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $33.2 | $332,00 |
| 100 | $27.8 | $2.780,00 |
| 500 | $23.1 | $11.550,00 |
| 1.000 | $19.95 | $19.950,00 |
EPF81188ARI240-4 Visão geral
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit containing an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that the user can define after manufacture. Within the broader taxonomy, FPGAs sit alongside CPLDs (Complex Programmable Logic Devices) as the two main classes of programmable logic; the FLEX 8000 family is positioned as a low-cost, high-density, register-rich SRAM-based PLD targeting data-path and DSP workloads. The EPF81188ARI240-4 is the largest density member of the FLEX 8000 family, and like all SRAM FPGAs in this family it is in-circuit reconfigurable (ICR) via an external configuration EPROM such as the EPC1 or EPC2.
Key features include 12K usable gates, 1,008 logic cells (each containing a compact 4-input LUT and a programmable register), 184 user I/O pins, dedicated high-speed carry chains for arithmetic, and a continuous FastTrack interconnect routing network. The architecture supports cascaded adders, multipliers, and wide datapath functions in a single device. Configuration can be loaded serially or in parallel modes, and JTAG (IEEE 1149.1) boundary-scan test is supported.
The FLEX 8000 architecture uses a continuous routing network that delivers predictable timing across the device. Logic elements (LEs) pair a 4-input LUT with a programmable register and dedicated carry logic, allowing efficient implementation of adders, counters, and state machines. The 0.42 µm CMOS SRAM-based configuration memory enables unlimited re-programmability but requires a configuration EPROM on every power-up. MultiVolt I/O supports 5.0 V and 3.3 V interface signaling to surrounding ASICs and microprocessors.
Typical applications include digital signal processing (DSP) datapaths, wide-data-path manipulation, glue logic replacement, bus interface bridging, and prototype ASIC emulation. The 240-pin RQFP package provides enough I/O to integrate multiple 32-bit buses in a single device, making the part suitable for telecommunications backplane glue logic and industrial control boards.
When designing with this device, remember that it is an older 5 V SRAM FPGA that requires a configuration EPROM on every board and does not support modern JTAG-based on-the-fly reconfiguration from a microcontroller. Engineers migrating to newer designs should evaluate Cyclone, MAX II, or Lattice ispMACH equivalents for active projects.
This page synthesizes distributor pricing, drop-in same-package alternatives from the Site MPN library, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para EPF81188ARI240-4 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPF81188ARI240-4 (mesmo formato e footprint) — diferindo em Process Technology, Package, Operating Temperature, Speed Grade, Configuration Method.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPF81188ARC240-4AA
✅ Drop-In✓ Em estoque
$47.8 / unidade
Ver ficha técnica →EPF81188ARC240-4
✅ Drop-In✓ Em estoque
$30.1 / unidade
Ver ficha técnica →EPF81188ARC240-5
✅ Drop-In✓ Em estoque
$41.85 / unidade
Ver ficha técnica →EPF81188ARC240-3
✅ Drop-In✓ Em estoque
$55.4 / unidade
Ver ficha técnica →EPF81188ARC240-2
✅ Drop-In✓ Em estoque
$178.34 / unidade
Ver ficha técnica →EPF81188ARC240-6
✅ Drop-In✓ Em estoque
$9.75 / unidade
Ver ficha técnica →EPF81188ARI240-4 Classificações máximas e características elétricas
| Family | FLEX 8000 |
| Usable Gates | 12,000 |
| Logic Elements (LEs) | 1,008 |
| Logic Cells | 1,008 |
| User I/O Pins | 184 |
| Encapsulamento | 240-pin RQFP (BFQFP exposed pad) |
| Process Technology | 0.42 µm CMOS SRAM |
| Tensão de alimentação | 5 V |
| Maximum Internal Frequency | 125 MHz |
| Speed Grade | -4 |
| Temperatura de operação | Industrial (-40 °C to +85 °C) |
| Configuration Method | SRAM, in-circuit reconfigurable (ICR) via external EPC1/EPC2 |
| Tipo de montagem | Surface Mount |
| Configuration Memory Type | SRAM (volatile - requires external boot device) |
Guia de Configuração de Pinos do EPF81188ARI240-4 240-pin rqfp (bfqfp exposed pad)
Configuração de pinos para EPF81188ARI240-4 (pacote 240-pin rqfp (bfqfp exposed pad)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EPF81188ARI240-4.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EPF81188ARI240-4 é adequado para 6 aplicaçãos: Digital Signal Processing (DSP) Datapath, Wide-Bus Glue Logic / ASIC Replacement, Industrial Control and Factory Automation, Telecommunications Backplane Interface, Prototype ASIC Emulation, Legacy Avionics and Military Systems.
Digital Signal Processing (DSP) Datapath
The EPF81188ARI240-4 fits DSP datapath applications because its 1,008 four-input LUTs, dedicated high-speed carry chains, and 184 user I/Os let designers cascade wide adders and multipliers in a single device. The 125 MHz internal frequency supports audio-rate FIR/IIR filters and basic video line buffers, while the industrial temperature grade suits outdoor or factory-floor installations. A typical configuration places an EPC2 serial configuration EPROM next to the FPGA and uses the 5 V core to drive 3.3 V or 5 V peripheral ADC/DAC buses via MultiVolt I/O. Compared with a discrete TTL datapath, this part reduces board area by integrating the entire ALU and control state machine in one package.
Recomendado
Wide-Bus Glue Logic / ASIC Replacement
With 184 user I/Os in a 240-RQFP package, the EPF81188ARI240-4 is ideal for replacing multiple 74-series TTL/CMOS glue-logic chips and small gate arrays on legacy backplane designs. The part integrates multiple 32-bit buses plus protocol-conversion state machines in one package, eliminating board layers and improving signal integrity. The 5 V MultiVolt I/O banks interface directly to legacy 5 V ASICs and microprocessors, and the FastTrack continuous routing fabric delivers predictable timing across the die. Compared with a discrete 74AS/74F logic implementation, this FPGA typically reduces chip count by 5-10x and simplifies PCB layout.
Recomendado
Industrial Control and Factory Automation
The industrial temperature grade (-40 °C to +85 °C) of the EPF81188ARI240-4 makes it suitable for factory-floor PLCs, motor-control front-ends, and ruggedized industrial controllers. Its 184 I/Os handle multiple encoder inputs, PWM outputs, and isolated field-bus interfaces (RS-485, CAN, SPI) in parallel. The 5 V supply tolerance aligns with industrial 24 V→5 V downstream rails. Designers typically pair the FPGA with optocouplers and isolated transceivers on each I/O bank, while the EPC2 boot EPROM guarantees deterministic cold-start behavior after a factory power cycle. Compared with a microcontroller-only solution, the parallel datapath offers deterministic latency for real-time control loops.
Recomendado
Telecommunications Backplane Interface
The EPF81188ARI240-4 is widely used as a backplane interface bridge in telecommunications equipment, where it converts between parallel telecom buses (H.110, SCSA, MVIP) and serializer/deserializer (SERDES) ASICs. Its 184 I/Os and 125 MHz internal frequency support 8-bit parallel TDM streams at standard telecom clock rates, while the 240-RQFP package accommodates the high pin count required for full 32-bit bus bridging. JTAG boundary-scan allows in-system test of the entire backplane. Compared with a discrete bus-switch implementation, the FPGA adds programmable protocol conversion without board re-spins.
Recomendado
Prototype ASIC Emulation
Engineers use the EPF81188ARI240-4 to emulate gate-array and cell-based ASIC prototypes before committing to mask costs, especially for designs targeting 10K-15K gate-equivalent density. The FLEX 8000 architecture supports iterative design changes via SRAM reconfiguration, allowing firmware/hardware co-design over multiple board spins. The 5 V MultiVolt I/O matches common ASIC pad libraries, simplifying board bring-up. Compared with ASIC NRE charges, the FPGA emulation path reduces time-to-prototype from months to weeks, with the trade-off that the FPGA cannot run at the final ASIC clock frequency.
Recomendado
Legacy Avionics and Military Systems
The EPF81188ARI240-4 remains deployed in legacy avionics, naval, and ground-military systems where its industrial temperature range, 5 V tolerance, and long-form-factor lifecycle align with strict certification baselines. The 240-RQFP package and through-hole-friendly gull-wing leads withstand vibration and thermal-shock profiles better than finer-pitch BGAs. System integrators pair the FPGA with MIL-STD-1553 transceivers and ARINC 429 bus interfaces, using JTAG for in-system verification per DO-254 design assurance guidance. Compared with newer fine-pitch BGA FPGAs, this part simplifies repair and re-work in depot maintenance environments.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPF81188ARI240-4 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPF81188ARC240-4AA | EPF81188ARC240-4 | EPF81188ARC240-5 | EPF81188ARC240-3 | EPF81188ARC240-2 | EPF81188ARC240-6 |
|---|---|---|---|---|---|---|---|
| Package | 240-RQFP (BFQFP exposed pad) | 240-RQFP - same | 240-RQFP - same | 240-RQFP - same | 240-RQFP - same | 240-RQFP - same | 240-RQFP - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 |
| Logic Elements | 1,008 | 1,008 | 1,008 | 1,008 | 1,008 | 1,008 | 1,008 |
| Usable Gates | 12,000 | 12,000 | 12,000 | 12,000 | 12,000 | 12,000 | 12,000 |
| User I/O Pins | 184 | 184 | 184 | 184 | 184 | 184 | 184 |
| Speed Grade | -4 | -4 | -4 | -5 (faster) | -3 (slower) | -2 (slowest) | -6 (fastest) |
| Temperature Grade | Industrial (-40 to +85 °C) | Industrial | Commercial (0 to +70 °C) | Commercial (0 to +70 °C) | Commercial (0 to +70 °C) | Commercial (0 to +70 °C) | Commercial (0 to +70 °C) |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Principais diferenciais
- Highest-density FLEX 8000 member with 184 user I/Os in 240-RQFP (vs EPF81188AQC208-4)
- Industrial temperature grade on the -4 speed bin (vs EPF81188ARC240-4)
- 125 MHz maximum internal frequency at the -4 speed grade (vs EPF81188ARC240-3)
Notas de projeto
The EPF81188ARI240-4 requires three supply rails: VCCINT (5 V core), VCCIO (3.3 V or 5 V I/O banks), and VCCP (5 V configuration). Decouple each VCCINT pin with a 0.1 µF ceramic plus a 10 µF tantalum bulk capacitor placed within 5 mm of the package. Estimated: with all 1,008 LEs toggling at 125 MHz, ICCINT peaks around 200 mA and ICCIO around 50 mA per bank, so plan a 5 V regulator rated for at least 1.5 A with adequate thermal margin.
The 240-RQFP exposed thermal pad must be soldered to a continuous ground plane with at least 9 thermal vias (0.3 mm drill, 1 mm pitch) for heat dissipation. All 184 user I/O signals should be routed on the top layer with matched-length groups for parallel buses; route the FastTrack clock nets (DCLK, nCONFIG, nSTATUS, CONF_DONE) as short as possible to avoid configuration failures. Per Altera FLEX 8000 design guidelines, keep configuration EPROM traces under 50 mm to preserve signal integrity at boot.
Do not assume the FLEX 8000 SRAM configuration is non-volatile - the FPGA loses its bitstream every power-down and must boot from an external EPC1, EPC2, or EPC8 configuration EPROM. Never leave MSEL pins floating; they select the configuration mode and must be tied to VCC or GND per the datasheet. Common pitfalls include forgetting the pull-up on nCONFIG, omitting the decoupling on VCCINT pins, and using 3.3 V-only configuration EPROMs with a 5 V VCCINT (EPC2 is required for 5 V designs).
Informações de conformidade
RoHS, REACH, lead-free, and halogen-free status not specified in the verified web data; the part predates RoHS Directive 2002/95/EC and was originally released in 5 V / SnPb configurations. AEC-Q100 not relevant because automotive qualification was not pursued for the FLEX 8000 family.
