LAN9355I/PT - 3-Port Managed 10/100 Ethernet Switch | Microchip
N.º da peça: LAN9355I/PT ✓ AtivoLAN9355I/PT Visão geral
A managed Ethernet switch is a networking semiconductor that coordinates frame forwarding among multiple Ethernet ports while providing centralized control, status monitoring, and configuration functions. In the product hierarchy, it belongs to Ethernet interface controllers and embedded Ethernet switches, where it combines multiple physical-layer ports and switching logic into one compact device. This integration reduces the number of separate network components required in consumer, embedded, and industrial equipment.
The LAN9355 family provides 10 Mbps and 100 Mbps Ethernet operation across three ports. Its interface options include MDI, MDIX, MII, MIIM, RMII, and Turbo MII, allowing the device to connect through copper Ethernet ports or interface with an external host processor. The I2C interface gives an embedded controller a management path for configuration and status functions rather than requiring dedicated discrete Ethernet hardware for each port.
The LAN9355I/PT integrates three-port switching with multiple host-facing bus options, making it useful where a system must combine several wired network connections with an embedded processor. Its supported MDI and MDIX modes allow direct connection to both straight-through and crossover cabling arrangements, while automatic crossover support simplifies installation. The 12 mm by 12 mm exposed-pad TQFP also permits a comparatively compact PCB footprint without distributing three separate physical-layer interfaces across the board.
Typical applications include industrial control equipment, embedded gateways, consumer appliances, test systems, and compact network interfaces. In an industrial controller, the switch can connect machine-network devices to a main processor while keeping port configuration under software control. In a consumer product, it can consolidate multiple 10/100 Ethernet connections behind a host using MII, RMII, or Turbo MII. It is also appropriate for embedded systems that require managed traffic prioritization rather than a simple two-port repeater.
Designers should treat the exposed pad as a thermal and electrical connection to the PCB, not as an optional mechanical feature. Follow the Microchip LAN9355 datasheet for the exact land pattern, pin assignments, external magnetics requirements, clock requirements, and decoupling network. In particular, Ethernet implementations should follow the prescribed reference layout because controlled impedance, short return paths, isolation spacing, and component placement materially affect signal integrity and EMI performance.
This page combines the verified product identity and package information with interface guidance, a focused engineering comparison, and practical implementation considerations. It is intended to help engineers determine whether the LAN9355I/PT fits a three-port embedded-network design and to plan sourcing through the Request a Quote form on this page.
Alternativas drop-in para LAN9355I/PT — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com LAN9355I/PT (mesmo formato e footprint) — diferindo em Package.
Nenhuma alternativa drop-in disponível para este produto.
Solicitar alternativasLAN9355I/PT Classificações máximas e características elétricas
| Device Type | 3-port managed Ethernet switch |
| Ethernet Speed | 10 Mbps and 100 Mbps |
| Port Configuration | 3 ports |
| Copper Ethernet Support | 10/100 Base-T/TX |
| Crossover Support | MDI and MDIX |
| Host Interface | MII, MIIM, RMII, and Turbo MII |
| Management Interface | I2C |
| Encapsulamento | 80-lead TQFP with exposed pad, 12 mm x 12 mm |
| Tipo de montagem | Surface mount |
| Temperature Grade | Industrial |
| Maximum Ethernet Data Rate | 100 Mbps |
Guia de Configuração de Pinos do LAN9355I/PT 80-lead tqfp with exposed pad, 12 mm x 12 mm
Configuração de pinos para LAN9355I/PT (pacote 80-lead tqfp with exposed pad, 12 mm x 12 mm). A numeração dos pinos, funções e diagramas de conexão estão definidos no datasheet do fabricante. Consulte-o para o footprint exato e diretrizes de soldagem.
Nenhum dado detalhado de pinagem disponível para LAN9355I/PT.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
LAN9355I/PT é adequado para 6 aplicaçãos: Industrial Control Equipment, Embedded Network Gateway, Consumer Appliance Networking, Test and Measurement Equipment, Machine-to-Machine Communication, Compact Network Interface.
Industrial Control Equipment
The LAN9355I/PT fits industrial controllers that need multiple wired Ethernet connections without allocating a separate physical-layer interface for every port. Its three 10/100 ports support MDI and MDIX, while MII, MIIM, RMII, or Turbo MII can connect the switch fabric to an embedded processor. I2C provides a management path for configuration and status functions. The integrated 80-lead TQFP exposed-pad package, measuring 12 mm by 12 mm, also reduces board area compared with three discrete copper interfaces. Design the Ethernet magnetics, controlled-impedance routing, exposed-pad connection, and isolation spacing according to the Microchip reference implementation.
Recomendado
Embedded Network Gateway
An embedded gateway can use the LAN9355I/PT to combine three 10/100 Ethernet links with a host processor in one compact design. The processor may communicate through RMII or one of the MII-family interfaces, depending on the required clocking and signal implementation, while I2C handles configuration and monitoring functions. MDI and MDIX support improves installation flexibility across standard copper-cable arrangements. Because the device is industrial-temperature grade, it is also suitable for gateway platforms deployed in controlled industrial environments. Validate magnetics selection, clock generation, impedance-controlled routing, and thermal performance of the exposed pad against the manufacturer guidance.
Recomendado
Consumer Appliance Networking
The LAN9355I/PT can consolidate several 10/100 Ethernet connections in a consumer appliance while exposing the switching function to an embedded host controller. The three-port configuration is useful for products that must connect a service interface, an access point, and another wired device. RMII, MII, MIIM, or Turbo MII provides options for matching the processor interface, and I2C supports centralized control. MDI and MDIX operation simplifies cabling compatibility. Keep the Ethernet copper channels within the manufacturer’s layout recommendations and provide the specified external magnetics and decoupling components to maintain signal integrity.
Recomendado
Test and Measurement Equipment
The LAN9355I/PT can provide multiple 10/100 network connections in compact test equipment where panel space and component count are constrained. An embedded controller can use RMII or another supported MII-family connection to the switching core, while I2C supports configuration and status monitoring. The three ports allow instruments to connect a control network, service interface, or external device through one integrated component. The 12 mm by 12 mm TQFP exposed-pad package helps reduce footprint, although proper pad bonding and copper thermal design remain essential. Follow the manufacturer’s reference layout and magnetics requirements to preserve link performance and minimize emissions.
Recomendado
Machine-to-Machine Communication
The LAN9355I/PT is suitable for machine-to-machine communication equipment that must bridge several industrial Ethernet endpoints to an embedded controller. Three 10/100 ports provide more connectivity than a basic two-port interface, while MDI and MDIX support simplifies physical cable integration. MII, MIIM, RMII, and Turbo MII allow the host interface to be selected according to processor resources and timing requirements. I2C enables software management of switch functions. Because industrial systems can impose strict EMC and temperature requirements, incorporate the manufacturer’s copper-channel layout, external magnetics, decoupling, and exposed-pad recommendations into the PCB design before fabrication.
Recomendado
Compact Network Interface
The LAN9355I/PT can act as a concentrated network interface for embedded systems that need more than one 10/100 copper port. A host processor can attach through a supported MII-family interface, while I2C supplies a separate control path for switch configuration and monitoring. The three-port arrangement can reduce board-level routing and component count compared with separate Ethernet physical layers. MDI and MDIX capability allows deployment with common straight-through or crossover cable arrangements. Ensure that the selected host clocking scheme is compatible, use the specified Ethernet magnetics, and preserve controlled impedance and return-path continuity throughout the board layout.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para LAN9355I/PT — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto |
|---|---|
| Package | 80-lead TQFP with exposed pad, 12 mm x 12 mm |
| Brand | Microchip Technology |
| Port Count | 3 ports |
| Ethernet Speed | 10 Mbps and 100 Mbps |
| Copper Interface | 10/100 Base-T/TX with MDI and MDIX |
| Host Interfaces | MII, MIIM, RMII, and Turbo MII |
| Management Interface | I2C |
| Temperature Grade | Industrial |
| Mounting Type | Surface mount |
Principais diferenciais
- Three managed copper Ethernet ports in one device (vs LAN9353T/PT)
- Multiple host-interface choices (vs LAN9353T/PT)
- Industrial-temperature ordering option (vs LAN9353T/PT)
Notas de projeto
Use the Microchip LAN9355 reference layout and land-pattern dimensions for the 80-lead TQFP exposed-pad package. The 12 mm by 12 mm body does not define a generic 80-pin footprint safely; pad length, width, pitch, exposed-pad geometry, and solder-mask clearance must match the manufacturer drawing. Keep the Ethernet copper routes short, provide a continuous return path, and follow the specified magnetics and decoupling placements.
Bond the exposed pad to a properly sized ground copper area using the thermal-via pattern specified by Microchip. The pad provides electrical connection as well as heat-spreading capability, so removing it or leaving the region nearly free of copper can impair both return-current continuity and thermal performance. Check the final assembly’s copper density and solder coverage, and use the manufacturer package information when assessing temperature rise.
Route all 10/100 Ethernet channel signals as controlled-impedance pairs with minimized stubs and uninterrupted reference planes. Position the prescribed external magnetics, isolation components, and termination network according to the reference design rather than improvising a generic Ethernet layout. Avoid placing high-current or switching-node copper beneath the sensitive channel traces, and use the manufacturer’s MII, RMII, and Turbo MII clocking guidance for the selected host interface.
Ethernet magnetics and controlled-impedance routing are central to emissions and immunity performance. Maintain the isolation distance specified by the manufacturer, keep copper and components out of the isolation barrier, and observe common-mode-component placement guidance. Review the complete board with the selected magnetics and enclosure in place because switching equipment around the network port can change the emissions margin even when the IC and its decoupling are correct.
Do not treat the related LAN9353 family as a drop-in substitute for the LAN9355I/PT. Port count, package construction, exposed-pad connections, host-interface behavior, and management registers must all be verified against the manufacturer documentation. Likewise, do not assign signals from an unrelated 80-lead TQFP pinout. Check the current LAN9355 errata and confirm the ordered package suffix before releasing schematic, layout, or firmware documentation.
Informações de conformidade
The product identity, industrial temperature grade, interfaces, and package are confirmed. Specific environmental and material-compliance declarations require confirmation from the current manufacturer product documentation.
