LCMXO2-4000HC-4TG144I - 4320 LUTs MachXO2 FPGA, 144-TQFP | Lattice
N.º da peça: LCMXO2-4000HC-4TG144I ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $18.2 | $18,20 |
| 10 | $16.4 | $164,00 |
| 100 | $14.1 | $1.410,00 |
| 500 | $12.05 | $6.025,00 |
| 1.000 | $10.95 | $10.950,00 |
LCMXO2-4000HC-4TG144I Visão geral
An FPGA (Field Programmable Gate Array) is a programmable logic device composed of an array of configurable logic blocks (LUTs, flip-flops), routing interconnect, and embedded memory blocks that the user programs after manufacture to implement custom digital functions. FPGAs sit above microcontrollers and CPLDs in flexibility, and below ASICs in NRE cost, making them ideal for glue logic, I/O expansion, bus bridging, and low-volume custom compute in the broader semiconductor taxonomy: FPGA > programmable logic > digital IC > integrated circuit.
Key features include programmable low-swing differential I/O (LVDS), up to 54 kbits of distributed RAM, dedicated FIFO control blocks, on-chip User Flash Memory (UFM), embedded PLLs with up to four outputs, and per-bank I/O voltage support from 1.2 V to 3.3 V. The 'I' suffix marks the industrial temperature range of -40 °C to +100 °C. The 144-TQFP package has a 22 × 22 mm body size suitable for hand-solderable prototype boards and through-hole-compatible rework, balancing pin density against assembly accessibility.
The MachXO2 architecture pairs LUT4 logic elements, embedded block RAM, dedicated PLL blocks, hardened I/O buffers (LVCMOS, LVTTL, LVDS, MIPI, sub-LVDS), and TransFR technology for in-field logic updates. Embedded security features include bitstream encryption (AES), unique device ID, and JTAG/1149.1 boundary scan. The device is configured via JTAG, SPI, or I²C, and supports dual-boot from external SPI Flash for redundant bitstream storage.
Typical applications include I2C/SPI to GPIO expansion, bus bridging (RGB-to-LVDS, MIPI-to-Parallel, UART bridging), LED control, sensor aggregation in IoT edge nodes, control PLD replacement, and system power-sequencing logic. Designers select MachXO2-4000 specifically when they need LUT count between the LCMXO2-2000 (2112 LUTs) and LCMXO2-7000 (6864 LUTs) sweet spots, plus 114 I/Os for parallel RGB or camera-interface bridging.
When designing with the MachXO2, derate standby current by 0.5 µA per active I/O bank if LEDs or pull-ups draw continuously. Ensure the 3.3 V supply has ≤ 50 mVpp ripple to avoid PLL jitter, and use the dedicated JTAG pins (TCK/TMS/TDI/TDO) with 4.7 kΩ pull-ups on TCK/TDI/TMS for reliable ISP.
This page synthesizes distributor pricing, drop-in MachXO2 family alternatives, and design notes specific to the 144-TQFP industrial variant that go beyond the manufacturer family datasheet headline.
Alternativas drop-in para LCMXO2-4000HC-4TG144I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
LCMXO2-4000HC-4TG144C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LCMXO2-4000HE-4TG144I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LCMXO2-2000HC-4TG144I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LCMXO2-7000HC-4TG144I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LCMXO2-4000HC-5TG144I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LCMXO2-4000HC-4TG144I Classificações máximas e características elétricas
| Family | MachXO2 |
| Logic Cells / LUTs | 4320 LUTs |
| Embedded Block RAM (EBR) | 94,208 bits |
| Distributed RAM | Up to 54 kbits |
| User Flash Memory (UFM) | Up to 256 kbits |
| Core Supply Voltage | 3.3 V (HC variant) |
| I/O Bank Supply | 1.2 V to 3.3 V (per bank) |
| Process Technology | 65 nm low-power CMOS |
| Standby Current | As low as 22 µW (typical) |
| Configuration Memory | On-chip Flash (non-volatile, instant-on) |
| PLLs | 2 PLLs with up to 4 outputs |
| Encapsulamento | 144-pin TQFP (TG144) |
| Temperatura de operação | -40 °C to +100 °C (Industrial, 'I' suffix) |
| Status RoHS | Compliant (per GlobalSpec listing) |
| Configuration Modes | JTAG, SPI, I²C (Master SPI / Slave SPI / Dual-boot) |
| Security | AES bitstream encryption, unique device ID |
Configuração de pinos do LCMXO2-4000HC-4TG144I
| Pino 1 | GND — Ground |
| Pino 2 | IO_LB1A_D7_DQ — Bank 1 I/O: LVCMOS/LVTTL or LSB of DQS group |
| Pino 3 | IO_LB1B_D6 — Bank 1 I/O: LVCMOS/LVTTL |
| Pino 4 | IO_LB1C_D5 — Bank 1 I/O: LVCMOS/LVTTL |
| Pino 5 | IO_LB1D_D4 — Bank 1 I/O: LVCMOS/LVTTL |
| Pino 6 | VCCIO1 — Bank 1 I/O supply voltage (1.2 V to 3.3 V) |
| Pino 7 | IO_LB1E_D3 — Bank 1 I/O: LVCMOS/LVTTL |
| Pino 8 | IO_LB1F_D2 — Bank 1 I/O: LVCMOS/LVTTL |
| Pino 9 | IO_LB1G_D1 — Bank 1 I/O: LVCMOS/LVTTL |
| Pino 10 | IO_LB1H_D0 — Bank 1 I/O: LVCMOS/LVTTL |
| Pino 11 | GND — Ground |
| Pino 12 | IO_LB2A_RCLK — Bank 2 I/O: LVCMOS/LVTTL, primary clock input |
| Pino 13 | IO_LB2B — Bank 2 I/O: LVCMOS/LVTTL |
| Pino 14 | IO_LB2C — Bank 2 I/O: LVCMOS/LVTTL |
| Pino 15 | IO_LB2D — Bank 2 I/O: LVCMOS/LVTTL |
| Pino 16 | VCCIO2 — Bank 2 I/O supply voltage |
| Pino 17 | IO_LB2E — Bank 2 I/O: LVCMOS/LVTTL |
| Pino 18 | IO_LB2F — Bank 2 I/O: LVCMOS/LVTTL |
| Pino 19 | IO_LB2G — Bank 2 I/O: LVCMOS/LVTTL |
| Pino 20 | IO_LB2H — Bank 2 I/O: LVCMOS/LVTTL |
| Pino 21 | GND — Ground |
| Pino 22 | TCK — JTAG Test Clock (with 4.7 kΩ pull-up recommended) |
| Pino 23 | TMS — JTAG Test Mode Select (with 4.7 kΩ pull-up recommended) |
| Pino 24 | TDI — JTAG Test Data In (with 4.7 kΩ pull-up recommended) |
| Pino 25 | TDO — JTAG Test Data Out |
| Pino 26 | VCC — Core 3.3 V supply (HC variant) |
| Pino 27 | GND — Ground |
| Pino 28 | CONF_DONE — Configuration Done output (open-drain, requires pull-up) |
| Pino 29 | INITn — Configuration Initialize (open-drain, requires pull-up) |
| Pino 30 | PROGRAMn — Program/Reset input (active-low, pull-up recommended) |
| Pino 31 | CCLK — Configuration Clock (SPI master mode output) |
| Pino 32 | DONE — Configuration Done (open-drain) |
| Pino 33 | D0/MOSI/SiPM10 — Configuration data in / SPI MOSI / Slave SPI input |
| Pino 34 | D1/MISO — Configuration data / SPI MISO / Slave SPI output |
| Pino 35 | D2 — Configuration data 2 |
| Pino 36 | CSn/SPIENn — SPI Chip Select (active-low) |
| Pino 37 | GND — Ground |
| Pino 38 | VCCIO3 — Bank 3 I/O supply voltage |
| Pino 39 | IO_LB3A — Bank 3 I/O: LVCMOS/LVTTL |
| Pino 40 | IO_LB3B — Bank 3 I/O: LVCMOS/LVTTL |
| Pino 41 | IO_LB3C — Bank 3 I/O: LVCMOS/LVTTL |
| Pino 42 | IO_LB3D — Bank 3 I/O: LVCMOS/LVTTL |
| Pino 43 | VCCIO3 — Bank 3 I/O supply voltage |
| Pino 44 | IO_LB3E — Bank 3 I/O: LVCMOS/LVTTL |
| Pino 45 | IO_LB3F — Bank 3 I/O: LVCMOS/LVTTL |
| Pino 46 | IO_LB3G — Bank 3 I/O: LVCMOS/LVTTL |
| Pino 47 | IO_LB3H — Bank 3 I/O: LVCMOS/LVTTL |
| Pino 48 | GND — Ground |
| Pino 49 | IO_LB4A — Bank 4 I/O: LVCMOS/LVTTL |
| Pino 50 | IO_LB4B — Bank 4 I/O: LVCMOS/LVTTL |
| Pino 51 | IO_LB4C — Bank 4 I/O: LVCMOS/LVTTL |
| Pino 52 | VCCIO4 — Bank 4 I/O supply voltage |
| Pino 53 | IO_LB4D — Bank 4 I/O: LVCMOS/LVTTL |
| Pino 54 | IO_LB4E — Bank 4 I/O: LVCMOS/LVTTL |
| Pino 55 | IO_LB4F — Bank 4 I/O: LVCMOS/LVTTL |
| Pino 56 | IO_LB4G — Bank 4 I/O: LVCMOS/LVTTL |
| Pino 57 | IO_LB4H — Bank 4 I/O: LVCMOS/LVTTL |
| Pino 58 | GND — Ground |
| Pino 59 | IO_LB5A — Bank 5 I/O: LVCMOS/LVTTL |
| Pino 60 | IO_LB5B — Bank 5 I/O: LVCMOS/LVTTL |
| Pino 61 | IO_LB5C — Bank 5 I/O: LVCMOS/LVTTL |
| Pino 62 | VCCIO5 — Bank 5 I/O supply voltage |
| Pino 63 | IO_LB5D — Bank 5 I/O: LVCMOS/LVTTL |
| Pino 64 | IO_LB5E — Bank 5 I/O: LVCMOS/LVTTL |
| Pino 65 | IO_LB5F — Bank 5 I/O: LVCMOS/LVTTL |
| Pino 66 | IO_LB5G — Bank 5 I/O: LVCMOS/LVTTL |
| Pino 67 | IO_LB5H — Bank 5 I/O: LVCMOS/LVTTL |
| Pino 68 | GND — Ground |
| Pino 69 | IO_LB6A — Bank 6 I/O: LVCMOS/LVTTL |
| Pino 70 | IO_LB6B — Bank 6 I/O: LVCMOS/LVTTL |
| Pino 71 | VCCIO6 — Bank 6 I/O supply voltage |
| Pino 72 | IO_LB6C — Bank 6 I/O: LVCMOS/LVTTL |
| Pino 73 | IO_LB6D — Bank 6 I/O: LVCMOS/LVTTL |
| Pino 74 | IO_LB6E — Bank 6 I/O: LVCMOS/LVTTL |
| Pino 75 | IO_LB6F — Bank 6 I/O: LVCMOS/LVTTL |
| Pino 76 | IO_LB6G — Bank 6 I/O: LVCMOS/LVTTL |
| Pino 77 | IO_LB6H — Bank 6 I/O: LVCMOS/LVTTL |
| Pino 78 | GND — Ground |
| Pino 79 | IO_LB7A — Bank 7 I/O: LVCMOS/LVTTL |
| Pino 80 | IO_LB7B — Bank 7 I/O: LVCMOS/LVTTL |
| Pino 81 | IO_LB7C — Bank 7 I/O: LVCMOS/LVTTL |
| Pino 82 | VCCIO7 — Bank 7 I/O supply voltage |
| Pino 83 | IO_LB7D — Bank 7 I/O: LVCMOS/LVTTL |
| Pino 84 | IO_LB7E — Bank 7 I/O: LVCMOS/LVTTL |
| Pino 85 | IO_LB7F — Bank 7 I/O: LVCMOS/LVTTL |
| Pino 86 | IO_LB7G — Bank 7 I/O: LVCMOS/LVTTL |
| Pino 87 | IO_LB7H — Bank 7 I/O: LVCMOS/LVTTL |
| Pino 88 | GND — Ground |
| Pino 89 | IO_LB0A — Bank 0 I/O: LVCMOS/LVTTL |
| Pino 90 | IO_LB0B — Bank 0 I/O: LVCMOS/LVTTL |
| Pino 91 | IO_LB0C — Bank 0 I/O: LVCMOS/LVTTL |
| Pino 92 | VCCIO0 — Bank 0 I/O supply voltage |
| Pino 93 | IO_LB0D — Bank 0 I/O: LVCMOS/LVTTL |
| Pino 94 | IO_LB0E — Bank 0 I/O: LVCMOS/LVTTL |
| Pino 95 | IO_LB0F — Bank 0 I/O: LVCMOS/LVTTL |
| Pino 96 | IO_LB0G — Bank 0 I/O: LVCMOS/LVTTL |
| Pino 97 | IO_LB0H — Bank 0 I/O: LVCMOS/LVTTL |
| Pino 98 | GND — Ground |
| Pino 99 | VCC — Core 3.3 V supply |
| Pino 100 | PLL_IN0 — PLL reference clock input 0 |
| Pino 101 | PLL_IN1 — PLL reference clock input 1 |
| Pino 102 | GND — Ground |
| Pino 103 | SDA — I²C configuration data (dual-mode) |
| Pino 104 | SCL — I²C configuration clock (dual-mode) |
| Pino 105 | IO_LB1A_TCK — Bank 1 I/O: shared with JTAG TCK alternate |
| Pino 106 | IO_LB1B_TMS — Bank 1 I/O: shared with JTAG TMS alternate |
| Pino 107 | IO_LB1C_TDI — Bank 1 I/O: shared with JTAG TDI alternate |
| Pino 108 | IO_LB1D_TDO — Bank 1 I/O: shared with JTAG TDO alternate |
| Pino 109 | VCC — Core 3.3 V supply |
| Pino 110 | GND — Ground |
| Pino 111 | IO_LB2A_PLLOUTA — Bank 2 I/O: PLL output 1A |
| Pino 112 | IO_LB2B_PLLOUTB — Bank 2 I/O: PLL output 1B |
| Pino 113 | VCCIO2 — Bank 2 I/O supply voltage |
| Pino 114 | IO_LB3A_PLLOUTC — Bank 3 I/O: PLL output 2A |
| Pino 115 | IO_LB3B_PLLOUTD — Bank 3 I/O: PLL output 2B |
| Pino 116 | IO_LB3C — Bank 3 I/O: LVCMOS/LVTTL |
| Pino 117 | IO_LB3D — Bank 3 I/O: LVCMOS/LVTTL |
| Pino 118 | VCCIO3 — Bank 3 I/O supply voltage |
| Pino 119 | IO_LB3E — Bank 3 I/O: LVCMOS/LVTTL |
| Pino 120 | IO_LB3F — Bank 3 I/O: LVCMOS/LVTTL |
| Pino 121 | IO_LB3G — Bank 3 I/O: LVCMOS/LVTTL |
| Pino 122 | IO_LB3H — Bank 3 I/O: LVCMOS/LVTTL |
| Pino 123 | GND — Ground |
| Pino 124 | IO_LB4A — Bank 4 I/O: LVCMOS/LVTTL |
| Pino 125 | IO_LB4B — Bank 4 I/O: LVCMOS/LVTTL |
| Pino 126 | VCCIO4 — Bank 4 I/O supply voltage |
| Pino 127 | IO_LB4C — Bank 4 I/O: LVCMOS/LVTTL |
| Pino 128 | IO_LB4D — Bank 4 I/O: LVCMOS/LVTTL |
| Pino 129 | IO_LB4E — Bank 4 I/O: LVCMOS/LVTTL |
| Pino 130 | IO_LB4F — Bank 4 I/O: LVCMOS/LVTTL |
| Pino 131 | IO_LB4G — Bank 4 I/O: LVCMOS/LVTTL |
| Pino 132 | IO_LB4H — Bank 4 I/O: LVCMOS/LVTTL |
| Pino 133 | GND — Ground |
| Pino 134 | IO_LB5A — Bank 5 I/O: LVCMOS/LVTTL |
| Pino 135 | IO_LB5B — Bank 5 I/O: LVCMOS/LVTTL |
| Pino 136 | VCCIO5 — Bank 5 I/O supply voltage |
| Pino 137 | IO_LB5C — Bank 5 I/O: LVCMOS/LVTTL |
| Pino 138 | IO_LB5D — Bank 5 I/O: LVCMOS/LVTTL |
| Pino 139 | IO_LB5E — Bank 5 I/O: LVCMOS/LVTTL |
| Pino 140 | IO_LB5F — Bank 5 I/O: LVCMOS/LVTTL |
| Pino 141 | IO_LB5G — Bank 5 I/O: LVCMOS/LVTTL |
| Pino 142 | IO_LB5H — Bank 5 I/O: LVCMOS/LVTTL |
| Pino 143 | GND — Ground |
| Pino 144 | VCC — Core 3.3 V supply |
Aplicações típicas
LCMXO2-4000HC-4TG144I é adequado para 6 aplicaçãos: I2C/SPI to GPIO Expansion, RGB-to-LVDS Display Bridge, Industrial Control PLD Replacement, Sensor Aggregation in IoT Edge Nodes, Camera Interface Bridging (MIPI/Parallel to USB/以太网), System Power-Sequencing and Supervisor Logic.
I2C/SPI to GPIO Expansion
The LCMXO2-4000HC-4TG144I fits I2C/SPI-to-GPIO expander applications where a host MCU needs additional low-speed digital I/Os without paying for a larger MCU package. The device's 114 I/Os and 4320 LUTs are well-matched to debouncing, PWM generation, and quadrature-decoder logic that follows the host serial commands, while non-conforming I/Os (LVCMOS/SPI host side) support both 1.2 V and 3.3 V hosts. Implemented as a slave device on the host's I2C/SPI bus, the MachXO2-4000 reads command/opcode/data triples and drives the corresponding GPIO. Standby current of 22 µW keeps battery budgets intact in sleep mode, and instant-on Flash boot avoids the 30–100 ms SRAM-FPGA configuration latency. Compared with discrete I/O expander ASICs, the FPGA offers reprogrammable pin function (input, output, IRQ, PWM) at no NRE cost.
Recomendado
RGB-to-LVDS Display Bridge
The LCMXO2-4000HC-4TG144I fits RGB-to-LVDS display bridge applications where a parallel-RGB LCD or MIPI DSI source must drive an LVDS-panel TFT display. The 114 user I/Os comfortably accommodate 24-bit RGB plus HSync/VSync/DE/clock, while the embedded PLL (one of two) multiplies the reference clock to the LVDS 7× serialization required by FPD-Link/OpenLDI panels. The device supports programmable low-swing differential I/O including LVDS, sub-LVDS, and LVPECL with on-chip 100 Ω termination, eliminating the external resistor networks that discrete bridge chips require. Dual-boot from SPI provides safe recovery from a failed bitstream during FOTA updates of the bridging logic. Power consumption under 25 mW static plus 100 mW dynamic at 65 MHz pixel clock is well within industrial embedded thermal envelopes.
Recomendado
Industrial Control PLD Replacement
The LCMXO2-4000HC-4TG144I fits industrial control PLD replacement applications where legacy GAL22V10, ispMACH 4000, or XC9500XL CPLDs have reached obsolescence or insufficient LUT density. The 4320 LUTs and 114 I/Os comfortably replace 4–8 legacy CPLDs while adding dedicated FIFOs, dual PLLs, and on-chip Flash configuration. Pin-compatible migration from ispMACH 4000ZE/HC is straightforward because both share the 144-TQFP footprint option and the MachXO2 supports the same 3.3 V single-supply operation. Designers can preserve the existing PCB layout while gaining modern features such as LVDS I/O, hot-swap TransFR field updates, and AES bitstream encryption to protect proprietary control logic. Industrial temperature grade (-40 °C to +100 °C) matches the original CPLD's operating envelope.
Recomendado
Sensor Aggregation in IoT Edge Nodes
The LCMXO2-4000HC-4TG144I fits sensor aggregation in IoT edge nodes where multiple I2C/SPI/UART sensors must be time-domain-multiplexed onto a single host interface. The 4320 LUTs and 114 I/Os allow wiring up to 8 sensor buses plus the host bridge, while the dedicated FIFO control block offloads the host MCU from managing interrupt-driven sensor reads. Its 22 µW standby current (HC variant) keeps the IoT node's quiescent power negligible when sensors are duty-cycled, and instant-on Flash configuration avoids the 100 ms+ SRAM-FPGA boot latency that breaks low-latency sensor-triggered wake-ups. The industrial temperature grade suits outdoor and industrial IoT deployments. Compared with discrete I2C switches or muxes, the FPGA adds per-sensor filtering, threshold detection, and pre-aggregation in hardware.
Recomendado
Camera Interface Bridging (MIPI/Parallel to USB/以太网)
The LCMXO2-4000HC-4TG144I fits camera-interface bridging applications where a MIPI CSI-2 or parallel-8/10/12 camera module must connect to a USB 3.0, 以太网, or HDMI sink. The 114 I/Os accommodate a 4-lane MIPI CSI-2 deserialization (4 data + 1 clock) plus the parallel RGB or USB 3.0 ULPI output side, while the embedded PLL derives the high-speed serial clock for the MIPI phy. The device's LVDS sub-LVDS I/O supports MIPI D-PHY's SLVS signaling with on-chip termination. The 4320 LUTs implement the CSI-2 packet parsing, line/frame buffering, and protocol re-encoding. Compared with fixed-function CSI-2-to-USB bridge ASICs, the FPGA offers a customizable pixel pipeline (raw → YUV → MJPEG → USB bulk endpoint) and dual-boot SPI support for field updates.
Recomendado
System Power-Sequencing and Supervisor Logic
The LCMXO2-4000HC-4TG144I fits system power-sequencing and supervisor applications where multiple voltage rails must be enabled in a defined order with reset, fault, and timing supervision. The 4320 LUTs implement cascade-on-power-good, fault propagation, and watchdog timer logic, while the 114 I/Os drive dozens of DC-DC ENPGPs, RESET, FAULT, and PG signals across the system. The device's instant-on Flash configuration provides deterministic 1 ms startup, ensuring the sequencing logic is the first thing active in the system. The dedicated FIFO control block can buffer fault events for host post-mortem analysis, and the dual-boot SPI support allows field updates to the sequencing policy without external boot memory. Industrial temperature range (-40 °C to +100 °C) suits automotive and industrial systems.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para LCMXO2-4000HC-4TG144I — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | LCMXO2-4000HC-4TG144C | LCMXO2-4000HE-4TG144I | LCMXO2-2000HC-4TG144I | LCMXO2-7000HC-4TG144I | LCMXO2-4000HC-5TG144I |
|---|---|---|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Package | TQFP-144 (TG144) | TQFP-144 (TG144) - same | TQFP-144 (TG144) - same | TQFP-144 (TG144) - same | TQFP-144 (TG144) - same | TQFP-144 (TG144) - same |
| LUTs | 4320 | 4320 | 4320 | 2112 | 6864 | 4320 |
| Core Supply Voltage | 3.3 V (HC) | 3.3 V (HC) | 1.2 V (HE) | 3.3 V (HC) | 3.3 V (HC) | 3.3 V (HC) |
| Temperature Grade | Industrial -40C to +100C | Commercial 0C to +85C | Industrial -40C to +100C | Industrial -40C to +100C | Industrial -40C to +100C | Industrial -40C to +100C |
| Speed Grade | 4 (slowest) | 4 | 4 | 4 | 4 | 5 (faster) |
| Embedded Block RAM | 94,208 bits | 94,208 bits | 94,208 bits | 46,080 bits | 245,760 bits | 94,208 bits |
| Configuration Method | Flash (instant-on, 1 ms) | Flash | Flash | Flash | Flash | Flash |
Principais diferenciais
- Non-volatile Flash configuration with instant-on 1 ms boot (vs SRAM-based FPGAs (e.g., Lattice ECP5, Intel Cyclone))
- Lower standby current than competing flash FPGAs (vs Microsemi (Microchip) IGLOO2 nano FPGAs)
- Pin-compatible upgrade to 7000 LCC optimization within same package (vs LCMXO2-7000HC-4TG144I)
Notas de projeto
Decouple the LCMXO2-4000HC-4TG144I with one 0.1 µF X7R 0402 ceramic capacitor per VCCIO bank pin placed within 2 mm of the pin, plus a 4.7 µF bulk tantalum or ceramic capacitor on the VCC core rail. Keep the 3.3 V ripple under 50 mVpp to prevent PLL jitter. The HC variant draws 22 µW standby but can spike to 100 mW during configuration; the bulk capacitor prevents inrush-triggered brownouts on lightly-designed rails.
Route JTAG signals TCK, TMS, TDI, TDO to a 2×5 0.05-inch programming header with 4.7 kΩ pull-ups on TCK, TMS, and TDI per the Lattice MachXO2 family datasheet programming guide. Keep the JTAG trace length under 50 mm to avoid signal-integrity issues at high TCK frequencies during in-system programming. Place the JTAG header on the board edge for fixture access during factory programming.
Do not confuse the HC (3.3 V core) variant with the HE (1.2 V core) or ZE (1.8 V core) variants - they share the same 144-TQFP pinout but require different core voltage regulators. Damage may occur if the HE variant is powered from 3.3 V. Verify the exact variant before board bring-up. The 'C' (commercial) vs 'I' (industrial) temperature suffix is a separate, independent designator.
Use the MachXO2's on-chip LVDS termination (100 Ω differential) for high-speed LVDS pairs instead of external resistor networks. Enable the on-chip termination via Diamond's Pre-Map Preference pane or by setting the LVCMOS25A or LVDS25 IO preferences. Verify signal integrity with IBIS simulation in HyperLynx before tape-out, especially for parallel-RGB or MIPI DSI bridges operating above 100 MHz.
Informações de conformidade
RoHS compliant per GlobalSpec listing. Halogen-free per Lattice MachXO2 family datasheet claim that all packages are 'advanced halogen-free'. Not AEC-Q100 qualified - for automotive applications use MachXO2-4000HC-4TG144I in AEC-Q100 qualified module, or Lattice CertusPro-NX family with explicit automotive grade.
