LFE2-6E-5F256I - 6K LUT, 190 I/O ECP2 FPGA | Lattice
N.º da peça: LFE2-6E-5F256I ✓ Ativo| Qtd. | Preço unitário | Total |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
LFE2-6E-5F256I Visão geral
A field-programmable gate array is a programmable semiconductor containing configurable logic blocks and programmable interconnect. An FPGA sits above basic fixed-function logic in the hardware hierarchy: programmable logic blocks can be connected by engineers after manufacture, allowing parallel datapaths, state machines, interfaces, and embedded control functions to be consolidated into one device. ECP2 devices combine this reconfigurable architecture with an industrial-temperature option and a high-I/O package.
The verified distributor data identifies the device as an ECP2 FPGA with 6K logic cells, 190 I/O, a -5 speed designation, and a 1.2 V operating rail. DigiKey additionally lists 56,320 configuration bits and identifies the physical device as a 256-BGA package. The supplied Microchip USA result describes the package as 17 mm by 17 mm and notes 190 user I/O pins. Its snippet inconsistently states 750 lookup tables, so that value is not used as an authoritative specification.
Lattice describes the ECP2/M family as optimized for advanced DSP blocks and, for ECP2M devices, high-speed SERDES. The exact DSP-block count, system frequency ranges, memory quantities, I/O standards, configuration interfaces, and power characteristics are not present in the supplied source text and therefore require confirmation from the complete manufacturer datasheet before design release. The 190-I/O count is especially useful for dense board-level integration, but users must assign pins according to the official package data and bank constraints.
Typical uses include industrial control, data acquisition, communications gateways, embedded instrumentation, and parallel processing. The 256-ball package supports fine-pitch assembly but demands careful PCB layout, ball assignment, power-plane distribution, and signal-integrity control. The -5 suffix denotes the supplier-classified speed grade, while the final I suffix is reported by Partstack as an industrial temperature grade.
For PCB design, use the manufacturer pinout and package drawing rather than generic BGA assumptions. Validate every power, ground, configuration, clock, and user-I/O ball against the current Lattice documentation. Confirm supported I/O standards and voltage domains before connecting external devices. This page synthesizes the supplied distributor records, package details, and replacement cross-references into an engineering-oriented procurement and selection summary.
Alternativas drop-in para LFE2-6E-5F256I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com LFE2-6E-5F256I (mesmo formato e footprint) — diferindo em Package, Speed Grade, Package Type, Terminal Count.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
LFE2-6E-5FN256I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LFE2-6E-5FN256C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LFE2-6SE-5F256I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LFE2-6SE-7FN256C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LFE2-20E-5F484C
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →LFE2-6E-5F256I Classificações máximas e características elétricas
| Device Type | ECP2 Field Programmable Gate Array (FPGA) |
| Logic Cells | 6,000 cells |
| User I/O | 190 I/O |
| Configuration Bits | 56,320 bits |
| Core Supply | 1.2 V |
| Speed Grade | -5 |
| Temperature Grade | Industrial |
| Encapsulamento | 256-ball Fine Pitch Ball Grid Array |
| Package Abbreviation | FPBGA-256 |
| Package Dimensions | 17 mm x 17 mm |
| Package Shape | Square |
| Terminal Type | Ball |
| Terminal Count | 256 balls |
| Tipo de montagem | Surface mount |
| Lead-Free Status | Lead free |
| Programmable Logic Type | FPGA |
| DSP Support | Advanced DSP blocks supported by the LatticeECP2/M family |
| SERDES Support | High-speed SERDES supported by the LatticeECP2M family |
Guia de Configuração de Pinos do LFE2-6E-5F256I square
Configuração de pinos para LFE2-6E-5F256I (pacote square). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para LFE2-6E-5F256I.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
LFE2-6E-5F256I é adequado para 6 aplicaçãos: Industrial Control Logic, Data Acquisition and Instrumentation, Communications Gateway, LED and Display Control, Digital Signal Processing, Programmable Security and Authentication.
Industrial Control Logic
The LFE2-6E-5F256I fits industrial controller designs that need programmable parallel logic, extensive board connectivity, and an industrial temperature classification. Its 6,000 logic cells can implement control state machines, interlocks, counter logic, and supervisory functions, while 190 user I/O provide connections to sensors, actuators, indicators, and field interfaces. The -5 speed designation supports designs specified around that grade, subject to official timing verification. Use the FPGA between sensor conditioning or isolation and downstream drivers, and validate every I/O voltage domain before connection. Because the device is supplied in a 17 mm by 17 mm, 256-ball fine-pitch package, power delivery, ball escape routing, and assembly process controls must be designed before prototype release.
Recomendado
Data Acquisition and Instrumentation
The LFE2-6E-5F256I is appropriate for parallel data-acquisition front ends requiring deterministic digital control beside sampling circuitry. The 6,000-cell ECP2 resource count can coordinate sample timing, channel sequencing, digital correction, status reporting, and memory-facing control logic, while 190 user I/O can reduce discrete routing when multiple converters and test points are present. The 1.2 V core rail and -5 grade must still be coordinated with the converter interface and timing budget. Engineers should use dedicated clock routing for acquisition clocks, match input timing to the selected converter, and isolate analog and digital return currents. Exact supported I/O standards are not present in the supplied records and must be verified before assigning external pins.
Recomendado
Communications Gateway
The LFE2-6E-5F256I can serve as the protocol and routing core of a compact communications gateway when parallel datapaths are more efficient than adding another fixed controller. Its 6,000 logic cells can support framing, CRC generation, buffering, state management, and interface bridging, while 190 user I/O leaves substantial board-level connectivity. The family source identifies high-speed SERDES as an ECP2M capability, but the supplied material does not establish whether this exact suffix exposes the required resources, so no specific transceiver should be assumed. Final design work must verify the official ECP2 device matrix, pin assignments, supported voltage standards, and timing. Consider the FPGA only where its -5 performance and resource limits fit the measured throughput.
Recomendado
LED and Display Control
The LFE2-6E-5F256I can consolidate timing, refresh, pattern storage, and control functions for multi-panel LED or display systems. Its 190 user I/O offers many available connections for multiplexed display rows and columns, while 6,000 logic cells can support multiple refresh domains, fault monitoring, and serial-to-parallel expansion. In a practical design, the FPGA receives commands over a serial interface, updates frame buffers, and generates precisely timed row and column controls. The implementation must respect official I/O voltage and timing constraints for each panel interface and account for ground bounce, clock skew, and connector loading. The supplied data does not specify dedicated display blocks or memory capacity, so designers should not infer those resources without consulting the complete device documentation.
Recomendado
Digital Signal Processing
The LFE2-6E-5F256I is a candidate for fixed-point filtering, interpolation, decimation, and sensor-signal conditioning when parallel operations justify an FPGA. The ECP2/M family source specifically identifies advanced DSP blocks as an optimization target, allowing repetitive arithmetic and control functions to be consolidated while reducing processor overhead. The 6,000 logic cells and 190 I/O can support modest parallel pipelines, but exact multiplier availability, pipeline performance, block count, and memory depth are absent from the supplied records. Engineers must map each operator to the official device resource table, pipeline arithmetic to meet clock targets, and avoid assuming that all DSP blocks can operate simultaneously at the maximum advertised family performance.
Recomendado
Programmable Security and Authentication
The LFE2-6E-5F256I can implement state-machine, parallel cryptographic, protocol, and authentication logic in compact secure-access hardware. Six thousand logic cells allow moderate pipelines or control structures, while 190 I/O can connect memory, status indicators, cryptographic companions, and communications. Deploy the FPGA where deterministic latency and hardware isolation are useful, and bind the configuration to the product security requirements. Exact cryptographic accelerators, key storage, random-number resources, and side-channel characteristics are not stated in the supplied data and must not be assumed. The engineering review should cover secure configuration handling, erase and reprogram workflows, fault injection, clocking, and whether the chosen suffix provides any dedicated security hardware.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para LFE2-6E-5F256I — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | LFE2-6E-5FN256I | LFE2-6E-5FN256C | LFE2-6SE-5F256I | LFE2-6SE-7FN256C | LFE2-20E-5F484C |
|---|---|---|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Speed Grade | -5 | -5 | -5 | -5 | -7 | -5 |
| Device Family | ECP2 | ECP2 | ECP2 | ECP2 | ECP2 | ECP2 |
Principais diferenciais
- Verified capacity and I/O configuration for this exact order code (vs LFE2-6SE-5F256I)
- Industrial-grade classification for the specified suffix (vs LFE2-6E-5FN256C)
- Exact -5 speed designation in verified distributor records (vs LFE2-6SE-7FN256C)
- Established sourcing footprint at major distributors (vs LFE2-6E-5FN256I)
Notas de projeto
Treat the FPBGA-256 as a fine-pitch assembly requiring manufacturer-approved escape routing, via geometry, solder-mask and paste design, and X-ray inspection. The supplied data confirms a 17 mm by 17 mm square package with 256 balls but does not provide the official ball map or pitch details. Do not infer pad geometry from the package dimensions. Download the current Lattice package drawing and pin table, map power and ground balls first, then route ordinary I/O only after completing the power planes and decoupling network.
The verified core rail is 1.2 V, but no current, voltage tolerance, sequencing, or auxiliary-rail data is supplied. Before schematic release, obtain the complete power table and calculate worst-case current across speed, I/O load, temperature, and configuration state. Place bulk and high-frequency decoupling according to the manufacturer guidance, use multiple power and ground connections, and keep switching-converter return current away from sensitive clock and I/O returns. These are design requirements, not estimates from missing datasheet values.
Preserve clock integrity by routing clocks through supported dedicated FPGA clock resources and controlling return paths beneath them. Most other functional data is absent from the supplied snippets, so pin assignments must not be finalized until speed grades, bank voltages, and supported I/O standards are checked in the official ECP2/M documentation. Maintain assembly clearances, avoid long stubs to external memories or converters, and provide test access for configuration, clocks, reset, and critical I/O without disturbing the BGA escape pattern.
Do not substitute a similar MPN solely because its name contains 256 and the product appears in a comparison tool. Confirm exact ball assignment, core and bank voltages, configuration interface, speed grade, temperature grade, resource population, and lifecycle status. LFE2-6E-5FN256I is the closest cited candidate, while the C suffix likely changes temperature class and the -7 suffix changes speed class. Rebase the project, recompile timing, and run post-fit simulation before approving any production substitution.
Informações de conformidade
FindIC describes the LFE2-6E-5F256I as lead free. The supplied records do not establish RoHS, REACH, AEC-Q100, halogen-free, or conflict-minerals status; no compliance claim is inferred.
