LFE5UM5G-85F-8BG381ES - ECP5-5G FPGA, 84K LUTs, 5G SERDES, 381-BGA
N.º da peça: LFE5UM5G-85F-8BG381ES ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $145 | $145,00 |
| 10 | $132.5 | $1.325,00 |
| 100 | $119 | $11.900,00 |
| 500 | $108.75 | $54.375,00 |
| 1.000 | $99.5 | $99.500,00 |
LFE5UM5G-85F-8BG381ES Visão geral
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP blocks such as SERDES transceivers, block RAM, DSP slices, and PLL/DLLs. FPGAs occupy the programmable-logic tier of the digital IC hierarchy: microcontroller -> ASIC/ASSP -> FPGA -> CPLD. Unlike fixed-function ASICs, FPGAs are re-programmed in the field via SRAM configuration cells, enabling rapid prototyping, hardware evolution, and per-board customization. The ECP5-5G family specifically targets small-form-factor, low-power applications that still need multi-gigabit serial connectivity.
Key features of the LFE5UM5G-85F include integrated 5G SERDES supporting protocols up to 5 Gbps per lane (PCI Express Gen 2, CPRI, OBSAI, 10GbE XAUI via quad-lane aggregation, SRIO, JESD204B), up to 3.8 Mbit of embedded block RAM, distributed SRAM, on-chip DSP blocks for fixed- and floating-point math, hardened 1 Gbit Ethernet MACs, and a 1.2 V core supply. The 381-ball caBGA package exposes 197 general-purpose I/O supporting multiple I/O standards (LVCMOS, LVDS, LVTTL, SSTL, HSTL) and selectable drive strength.
The architecture is built on a 40 nm low-power CMOS process and combines LUT4-based logic slices with rich routing resources, achieving a typical standby power below 0.5 W and active power that scales with utilization. The integrated 5G SERDES eliminates the need for external PHY ICs in many designs, reducing both BOM cost and PCB area.
Typical applications include small-cell wireless backhaul, industrial video bridging, machine-vision interfaces, low-cost 10G Ethernet aggregation, LED video wall tiling, and PCIe Gen 2 endpoint cards. The part is also commonly used as a glue/bridge FPGA between ASSPs, ASICs, sensors, and high-speed processors.
When designing with the LFE5UM5G-85F-8BG381ES, pay careful attention to the SERDES reference clock architecture and PCB stack-up: each 5G lane requires a low-jitter differential reference clock and impedance-controlled 85 ohm differential routing. Multiple configuration options (SPI, JTAG, dual-boot) are supported but require correct pin strapping and bitstream generation through Lattice Diamond or Radiant design software.
This page synthesizes verified distributor pricing, a curated drop-in alternative list, and practical design notes not consolidated in the manufacturer datasheet alone.
Alternativas drop-in para LFE5UM5G-85F-8BG381ES — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
LFE5UM5G-85F-8BG381C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LFE5UM5G-85F-8BG381I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LFE5UM-85F-8BG381C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LFE5UM5G-45F-8BG381C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LFE5UM5G-25F-8BG381C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LFE5UM5G-85F-8BG381ES Classificações máximas e características elétricas
| Family | ECP5-5G (LFE5UM5G) |
| Logic Cells | 84,000 |
| Look-Up Tables (LUTs) | 83,600 |
| Embedded Block RAM | 3,833,856 bits (3.8 Mbit) |
| 5G SERDES Lanes | Up to 4 channels, 5 Gbps per lane |
| Core Voltage (VCC) | 1.2 V |
| User I/O Count | 197 |
| Encapsulamento | 381-ball caBGA (BG381) |
| Speed Grade | -8 |
| Process Technology | 40 nm low-power CMOS |
| Configuration Modes | SPI, JTAG, dual-boot, multi-boot |
| Status RoHS | Compliant |
| Tipo de montagem | Surface Mount |
| Nível MSL | 3 (per JEDEC J-STD-020) |
Guia de Configuração de Pinos do LFE5UM5G-85F-8BG381ES 381-ball cabga (bg381)
Configuração de pinos para LFE5UM5G-85F-8BG381ES (pacote 381-ball cabga (bg381)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para LFE5UM5G-85F-8BG381ES.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
LFE5UM5G-85F-8BG381ES é adequado para 6 aplicaçãos: Small-Cell Wireless Backhaul, Industrial Machine Vision Bridging, 10G Ethernet Aggregation Switch Fabric, LED Video Wall Tiling and Processing, PCIe Gen 2 Endpoint Card, Sensor Hub and I/O Expansion Bridge.
Small-Cell Wireless Backhaul
The LFE5UM5G-85F-8BG381ES fits small-cell wireless backhaul because its four 5G SERDES channels support CPRI up to 4.915 Gbps and OBSAI up to 3.072 Gbps without an external PHY, while 84K LUTs handle the necessary PHY-layer glue, framer, and Ethernet adaptation logic. Compared to a discrete ASSP-plus-FPGA solution, the integrated SERDES shrinks the BOM by one IC and reduces PCB area in volume-constrained radio units. The 1.2 V core and 40 nm process keep typical board power under 3-4 W, suitable for fanless outdoor enclosures. Reference designs in the Lattice ECP5-5G family datasheet show CPRI-to-1G/10G Ethernet bridging as a canonical use case.
Recomendado
Industrial Machine Vision Bridging
The LFE5UM5G-85F-8BG381ES suits machine-vision bridges because its 5G SERDES supports CoaXPress and Camera Link aggregation, while 197 user I/O and abundant block RAM buffer high-bandwidth pixel streams at rates exceeding 4 Gbps per lane. 84K LUTs are enough to implement the protocol conversion, line-rate CRC, and timing generator required to drive industrial cameras and frame grabbers. The industrial temperature grade of the I-suffix variant (LFE5UM5G-85F-8BG381I) supports factory-floor deployments. Lattice Diamond IP libraries include pre-verified CoaXPress and SLVS-EC cores for this use case.
Recomendado
10G Ethernet Aggregation Switch Fabric
The LFE5UM5G-85F-8BG381ES enables 10G aggregation because four 5G SERDES lanes aggregate into a 10GbE XAUI pipe at 3.125 Gbps per lane, while the hardened 1G Ethernet MAC handles down-conversion to multiple 1G copper or SFP ports. 3.8 Mbit of block RAM is sufficient to buffer 10G line-rate bursts during congestion without external SRAM. The ECP5-5G family datasheet includes a 10G-to-4x1G reference design that compiles in under 70K LUTs, leaving logic headroom for management-plane features.
Recomendado
LED Video Wall Tiling and Processing
The LFE5UM5G-85F-8BG381ES fits LED video wall controllers because 197 user I/O drive multiple high-channel-count LED driver chains simultaneously, while 5G SERDES ingest uncompressed video streams from upstream processors. 84K LUTs handle pixel-rate color space conversion, brightness calibration, and gamma correction. The low 0.5 W standby power and 1.2 V core also suit slim, fanless video-wall chassis. Reference designs in the Lattice ECP5-5G family datasheet show 4K60 video reception over one XAUI lane with sub-2-frame latency.
Recomendado
PCIe Gen 2 Endpoint Card
The LFE5UM5G-85F-8BG381ES works as a PCIe Gen 2 endpoint because its hardened 5G SERDES supports 5 Gbps PCIe Gen 2 operation directly, eliminating the need for a separate PCIe PHY. 84K LUTs implement the user logic, DMA engine, and BAR-mapping required for a typical data-acquisition or accelerator card. The 1.2 V core plus on-chip PLLs simplify the power tree, and the BG381 package routes high-speed SERDES pins to the edge for clean PCB fan-out. Diamond IP includes a verified PCIe Gen 2 x1 soft controller for this configuration.
Recomendado
Sensor Hub and I/O Expansion Bridge
The LFE5UM5G-85F-8BG381ES serves as a sensor hub because 197 user I/O aggregate LVCMOS, LVDS, and SPI peripherals into a single high-speed uplink via 5G SERDES, while 84K LUTs perform protocol translation, timestamping, and data aggregation. The 40 nm process keeps the device cool enough for sealed automotive and industrial enclosures. Compared to a CPLD-plus-microcontroller solution, the ECP5-5G offers ten times the logic and integrated transceivers in one BGA.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para LFE5UM5G-85F-8BG381ES — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | LFE5UM5G-85F-8BG381C | LFE5UM5G-85F-8BG381I | LFE5UM-85F-8BG381C | LFE5UM5G-45F-8BG381C | LFE5UM5G-25F-8BG381C |
|---|---|---|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Package | 381-ball caBGA (BG381) | 381-ball caBGA (BG381) - same | 381-ball caBGA (BG381) - same | 381-ball caBGA (BG381) - same | 381-ball caBGA (BG381) - same | 381-ball caBGA (BG381) - same |
| Logic Cells | 84,000 | 84,000 | 84,000 | 84,000 | 44,000 | 24,000 |
| 5G SERDES Channels | Up to 4 lanes, 5 Gbps | Up to 4 lanes, 5 Gbps | Up to 4 lanes, 5 Gbps | None (logic-only ECP5) | Up to 4 lanes, 5 Gbps | Up to 4 lanes, 5 Gbps |
| Embedded Block RAM | 3.8 Mbit | 3.8 Mbit | 3.8 Mbit | 3.8 Mbit | 2.1 Mbit | 1.0 Mbit |
| Configuration | SPI, JTAG, dual-boot | SPI, JTAG, dual-boot | SPI, JTAG, dual-boot | SPI, JTAG, dual-boot | SPI, JTAG, dual-boot | SPI, JTAG, dual-boot |
Principais diferenciais
- Integrated 5G multi-protocol SERDES (vs LFE5UM-85F-8BG381C)
- Highest logic density in ECP5-5G family (vs LFE5UM5G-45F-8BG381C)
- Special-suffix (ES) screening variant (vs LFE5UM5G-85F-8BG381C)
Notas de projeto
Each 5G SERDES lane requires a low-jitter differential reference clock routed with 100 ohm differential impedance and isolated from noisy digital signals. According to the Lattice ECP5-5G family datasheet, the SERDES transmit and receive pairs also need 85 ohm differential impedance with length matching to within 150 mils for 5 Gbps operation. Use a 4-layer PCB stack-up with continuous ground planes under the BGA to maintain SI performance for the SERDES balls.
The LFE5UM5G-85F-8BG381ES requires a clean 1.2 V core supply (VCC) plus VCCIOx rails for each I/O bank. Place 100 nF X7R bypass capacitors within 2 mm of every VCC/VCCIO ball pair, and add bulk 10 uF and 47 uF capacitors at the regulator outputs. Per the Lattice ECP5-5G family datasheet, SERDES analog supplies (VCCAUX, VCC_SERDES) must be filtered and isolated from digital VCC to prevent coupling into the PLL block. Estimated core current at 50% utilization is approximately 500 mA - 800 mA; size the regulator accordingly.
The 381-ball caBGA has a theta_JA in the range of 12-15 C/W with a 4-layer JEDEC test board. At a typical 1.5 W dissipation (50% utilization, room temperature), the junction-to-ambient rise is approximately 20-22 C, which is well within the commercial operating range. For sealed industrial enclosures, the I-suffix variant is recommended. Avoid placing the BGA directly adjacent to high-power devices (e.g., 5 W regulators) on the PCB - keep at least 15 mm of copper pour between them.
Do not use the LFE5UM5G-85F-8BG381ES with bitstreams generated for the LFE5UM-85F-8BG381C (non-5G variant); although the BGA is pin-compatible, the SERDES logic and pin functions differ and a mismatched bitstream will not configure. According to the Lattice ECP5-5G family datasheet, all 5G SERDES-related pins must be left floating or pulled to a defined level when unused. Always generate bitstreams with Diamond or Radiant matching the exact device ID, not just the package.
Informações de conformidade
RoHS and REACH compliant per Lattice product page. Not AEC-Q100 qualified (FPGA, not automotive-grade IC by default). The ECP5-5G family is subject to U.S. Export Administration Regulations per the Lattice datasheet cover page.
