LPC1102LVUKZ - 50MHz ARM Cortex-M0 32KB MCU | NXP
N.º da peça: LPC1102LVUKZ ✓ Ativo| Qtd. | Preço unitário | Total |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
LPC1102LVUKZ Visão geral
A microcontroller is a semiconductor device that integrates a CPU core, program memory, data memory, and peripherals into one package. The LPC1102LVUKZ combines an Arm Cortex-M0 core, general-purpose I/O, serial interfaces, timers, and communication resources for embedded systems. Its 50 MHz operating frequency provides more processing headroom than lower-frequency entry MCUs while retaining a simple architecture suitable for cost-sensitive control products.
The verified distributor data identifies the part as an ARM Cortex-M0 LPC1100LV-series MCU with 32-bit processing, 50 MHz maximum frequency, 32 KB flash organized as 32K x 8, and 8 KB SRAM. The 25-WLCSP package enables compact layouts in wearables, small control modules, sensor nodes, and portable equipment. Because WLCSP assembly and inspection require specialized PCB design and manufacturing capability, designers should confirm the exact land pattern and assembly process before releasing a layout.
This MCU is suited to applications that require compact digital control, serial communication, timing, and low-cost integration rather than high analog precision or large memory capacity. Its 32 KB flash limits firmware size, while 8 KB SRAM supports moderate stack, buffer, and working-memory requirements. The Cortex-M0 ecosystem also makes standard embedded tooling and library support more accessible than a proprietary architecture.
Typical uses include small sensor interfaces, wearable accessories, actuator controllers, compact instrumentation, connected accessories, and low-cost embedded products. For a new design, evaluate the complete peripheral list, voltage limits, package dimensions, pin multiplexing, programming method, and operating-temperature requirements against the manufacturer datasheet before committing the PCB footprint.
Designers should verify the exact pin functions and electrical limits from the NXP LPC1102 documentation rather than relying on distributor summaries. Keep power routing and decoupling close to the device, confirm exposed-pad or thermal requirements for the package, and validate firmware timing under the intended clock configuration. The LPC1102LVUKZ is best suited to compact, cost-sensitive systems whose firmware fits within 32 KB of flash and whose data working set fits within 8 KB of SRAM.
This page combines verified distributor listings, package and memory details, application guidance, sourcing context, and explicit uncertainty markers. It is designed as a practical starting point for engineers comparing the LPC1102LVUKZ with other compact 32-bit microcontrollers.
Alternativas drop-in para LPC1102LVUKZ — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
[DATA_NEEDED: verified same-brand drop-in alternative]
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LPC1102LVUKZ Classificações máximas e características elétricas
| Product Type | 32-bit microcontroller |
| CPU Core | ARM Cortex-M0 |
| Maximum CPU Frequency | 50 MHz |
| Flash Memory | 32 KB (32K x 8) |
| SRAM | 8 KB |
| Architecture | ARM 32-bit |
| Series | LPC1100LV |
| Encapsulamento | 25-WLCSP, 2.17 mm x 2.32 mm |
| Tipo de montagem | Surface Mount |
| Core Type | Cortex-M0/M0+ family reference |
| Data Width | 32-bit |
Guia de Configuração de Pinos do LPC1102LVUKZ 25-wlcsp, 2.17 mm x 2.32 mm
Configuração de pinos para LPC1102LVUKZ (pacote 25-wlcsp, 2.17 mm x 2.32 mm). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para LPC1102LVUKZ.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
LPC1102LVUKZ é adequado para 6 aplicaçãos: Compact Sensor Interface, Wearable Accessory Controller, Small Actuator Controller, Compact Connected Module, Low-Cost Digital Control Board, Portable Instrumentation Interface.
Compact Sensor Interface
The LPC1102LVUKZ fits a small sensor node where the board must combine a 50 MHz ARM Cortex-M0 core with limited local processing. It can read digital sensors, apply filtering or threshold logic, and expose status through its serial peripherals while occupying only a 2.17 mm by 2.32 mm WLCSP footprint. The 32 KB flash is adequate for compact firmware, but engineers should budget code space for drivers, calibration, and future updates. The 8 KB SRAM supports small buffers and control state rather than large data logging. Before layout, verify the exact 25-ball pinout, power rails, and peripheral assignments in the NXP datasheet.
Recomendado
Wearable Accessory Controller
The LPC1102LVUKZ is appropriate for a wearable accessory that needs local button handling, LED indication, simple timing, and a low-area controller package. Its 32-bit Cortex-M0 architecture supports structured firmware and peripheral configuration, while 50 MHz operation provides useful response margin for lightweight control tasks. The 25-WLCSP package can help reduce board area, although its fine pitch and assembly requirements may increase manufacturing complexity compared with a leaded package. The 8 KB SRAM is suitable for compact state machines and communication buffers, not large sensor histories. Validate battery-life assumptions because verified low-power current data was not provided.
Recomendado
Small Actuator Controller
The LPC1102LVUKZ can serve as the central controller in a small actuator or motor-control subsystem when the design needs deterministic digital sequencing, timers, and serial command handling. A 50 MHz Cortex-M0 core can execute control logic while the MCU manages limit inputs, sensor feedback, and status indicators. The 32 KB flash limit encourages compact firmware, while the 8 KB SRAM is suitable for state variables and short communication buffers rather than advanced motion algorithms. The WLCSP footprint enables dense assemblies, but power delivery, thermal behavior, and motor-noise isolation must be designed around the exact package and supply requirements.
Recomendado
Compact Connected Module
The LPC1102LVUKZ is suitable as the application processor beside a communications transceiver in a compact gateway or serial-to-embedded module. The MCU can handle protocol framing, configuration, status monitoring, and local control while using 32 KB flash for firmware and 8 KB SRAM for packet processing. Its 50 MHz Cortex-M0 core offers adequate performance for many lightweight protocols, but the selected peripherals and baud-rate requirements must be verified. Because the package is only 2.17 mm by 2.32 mm, antenna and connector placement should be planned early, and RF or switching circuitry should not be placed underneath sensitive power and clock paths.
Recomendado
Low-Cost Digital Control Board
The LPC1102LVUKZ offers a cost-oriented platform for small control boards requiring a modern 32-bit core, moderate flash, and modest SRAM. It can coordinate relays, indicators, keypads, and simple sensors where the firmware remains comfortably below the 32 KB flash limit. The 50 MHz operating frequency helps separate control tasks from serial communication, while the LPC1100LV family positioning aligns with entry-level embedded systems. Designers should verify whether the required I/O quantity, communication peripherals, and power characteristics are present in the exact LPC1102LVUKZ package before selecting it over a larger or more highly integrated MCU.
Recomendado
Portable Instrumentation Interface
The LPC1102LVUKZ can support compact instrumentation interfaces that need local control, data conditioning, and serial communication rather than high-resolution signal processing. Its 50 MHz Cortex-M0 core can manage sampling timing, calibration tables, and command handling, while 32 KB flash and 8 KB SRAM constrain the design to modest algorithms and short data buffers. The small WLCSP package helps reduce instrument footprint, but exposed-ball assembly, analog isolation, grounding, and connector placement require careful PCB planning. Confirm the device's verified analog and timer capabilities before assigning precision measurement functions; distributor snippets do not provide the complete peripheral list.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para LPC1102LVUKZ — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | [DATA_NEEDED: verified same-brand drop-in alternative] |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
Principais diferenciais
- Compact 32-bit control with a small package (vs [DATA_NEEDED: verified same-brand drop-in alternative])
- Known memory configuration for embedded firmware (vs [DATA_NEEDED: verified same-brand drop-in alternative])
- Arm-based software ecosystem (vs [DATA_NEEDED: verified same-brand drop-in alternative])
Notas de projeto
Treat the 25-WLCSP as a fine-pitch assembly constraint rather than a generic small IC. Obtain the exact ball map and recommended land pattern from the NXP package documentation, reserve solder-mask and paste geometry for the assembly process, and route critical power and ground connections before signal routing. Confirm whether the package has a central exposed connection and how it must be connected or thermally managed.
The verified snippets provide CPU, memory, and package data but do not provide operating-voltage or decoupling values. Do not select capacitors or regulator settings from generic assumptions. Download the LPC1102 family datasheet, identify the LPC1102LVUKZ supply limits, and follow the manufacturer’s recommended power, ground, and decoupling arrangement. This is especially important when the MCU drives sensors, radio circuitry, or actuator drivers through the same board.
The most likely design error is assuming that any LPC1100 or LPC1102 ordering code has the same pinout. Compare the exact LPC1102LVUKZ package suffix, ball assignments, peripheral multiplexing, and exposed thermal connection with the datasheet. Also budget the 32 KB flash and 8 KB SRAM limits before writing firmware; driver code, bootloader support, logging, and protocol buffers can consume those resources quickly.
Keep clock, decoupling, and sensitive interface routing short and separated from noisy switching or motor circuits. Because the package is extremely compact, use careful fan-out planning to avoid long traces and excessive loop area. Confirm the required external crystals, load capacitors, pull resistors, and bus termination values from the exact datasheet rather than carrying values from another LPC device.
Informações de conformidade
The supplied search results do not explicitly state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. Compliance claims must be confirmed from the current NXP product documentation and applicable distributor records.
