LPC1347FHN33,551 - 72MHz Cortex-M3 64KB Flash MCU | NXP
N.º da peça: LPC1347FHN33,551 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $3.62 | $3,62 |
| 10 | $3.26 | $32,60 |
| 100 | $2.85 | $285,00 |
| 500 | $2.48 | $1.240,00 |
| 1.000 | $2.15 | $2.150,00 |
LPC1347FHN33,551 Visão geral
A microcontroller (MCU) is a single integrated circuit that combines a processor core, memory, and peripherals into one chip, forming the complete embedded controller at the heart of countless electronic products. The LPC1347FHN33,551 belongs to the broader hierarchy of microcontrollers: ARM Cortex-M3 core -> 32-bit MCU -> LPC13xx family -> entry-level embedded controller segment, where cost, power efficiency, and peripheral integration matter more than raw compute throughput.
Key features include the 72 MHz Cortex-M3 CPU with a 3-stage pipeline and Harvard architecture, 64 KB flash for program storage, USB 2.0 full-speed device capability, and a USART serial port. The device also integrates EEPROM for non-volatile parameter storage, a rich timer and PWM complement, 10-bit ADC channels, and multiple serial interfaces including I2C and SPI, enabling compact single-chip designs.
Architecturally, the Cortex-M3 core incorporates separate local instruction and data buses, a third bus dedicated to peripherals, and an internal prefetch unit that supports speculative branching, improving effective instruction throughput. Enhanced debug features and a high level of support-block integration reduce development effort, while low power consumption suits battery-operated and energy-conscious designs. Operating from a 2.5 V to 3.3 V supply range, the MCU integrates cleanly with common 3.3 V logic systems.
Typical applications include USB-connected embedded devices, consumer and industrial control boards, sensor hubs, and lighting or motor-adjacent control systems where a 32-bit core, USB device port, and flash-based field upgrades are required in a compact 7x7 mm footprint.
A key design consideration is the HVQFN package's exposed pad, which must be soldered to a grounded PCB land pattern to achieve rated thermal and electrical performance; in-circuit programming via the USART or USB bootloader also simplifies field updates without a separate programmer.
This page synthesizes verified distributor data, same-family drop-in alternatives, pricing tiers, and practical design guidance not consolidated in the manufacturer datasheet, providing engineers with a single citable reference for the LPC1347FHN33,551.
Alternativas drop-in para LPC1347FHN33,551 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
LPC1346FHN33,551
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LPC1345FHN33,551
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LPC1343FHN33,551
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LPC1342FHN33,551
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LPC1347FHN33,551 Classificações máximas e características elétricas
| Core Processor | ARM Cortex-M3 |
| Core Size | 32-bit |
| Frequência máxima de clock | 72 MHz |
| Program Memory Size | 64 KB (64K x 8) FLASH |
| SRAM Size | 12 KB |
| EEPROM | Yes (on-chip) |
| Tensão de alimentação | 2.5 V to 3.3 V |
| USB | USB 2.0 full-speed device |
| Serial Interfaces | USART, I2C, SPI |
| Encapsulamento | 32-HVQFN (7x7 mm) with exposed pad |
| Tipo de montagem | Surface Mount |
| ADC Resolution | 10-bit |
| Supplier Device Package | HVQFN-32 |
| Packaging | Tray |
Guia de Configuração de Pinos do LPC1347FHN33,551 hvqfn-32
Configuração de pinos para LPC1347FHN33,551 (pacote hvqfn-32). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para LPC1347FHN33,551.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
LPC1347FHN33,551 é adequado para 6 aplicaçãos: USB Embedded Devices, Consumer Electronics Control, Industrial Sensor Nodes, Lighting Control, Networking Accessories, Smart Home and IoT Endpoints.
USB Embedded Devices
The LPC1347FHN33,551 integrates a USB 2.0 full-speed device controller, making it a natural fit for USB HID devices, virtual COM ports, and small mass-storage products. The 72 MHz Cortex-M3 core easily sustains 12 Mbps USB traffic while executing application firmware, and NXP's on-chip ROM USB driver stack reduces flash consumption, leaving more of the 64 KB flash for product logic. Placed as the sole controller on a compact PCB, the MCU eliminates the need for a separate USB interface chip. Its 12 KB SRAM accommodates USB endpoint buffers plus application data structures, and the on-chip EEPROM stores serial numbers and calibration data that USB descriptors require.
Recomendado
Consumer Electronics Control
Entry-level consumer products such as small appliance controllers, remote accessories, and personal electronics benefit from the LPC1347FHN33,551's balance of 32-bit performance and low cost. The 72 MHz Cortex-M3 provides ample headroom for state machines, debouncing, and user-interface logic, while timers and PWM outputs drive indicators, buzzers, and simple actuators directly. The 2.5 V to 3.3 V supply range integrates cleanly with single-cell battery or regulated 3.3 V rails common in consumer designs. The 7x7 mm HVQFN package with exposed pad keeps board area minimal for space-constrained handheld products, and field firmware updates over USART or the USB bootloader reduce service costs.
Recomendado
Industrial Sensor Nodes
In industrial sensing and monitoring nodes, the LPC1347FHN33,551's 10-bit ADC digitizes sensor signals while the USART, I2C, and SPI interfaces communicate with external converters and transceivers. Low power consumption suits permanently installed nodes, and the on-chip EEPROM retains calibration constants and node IDs through power cycles without external serial memory. The 64 KB flash hosts protocol handling and local data buffering, and the 3-stage pipelined Cortex-M3 executes filtering arithmetic comfortably at 72 MHz. Its HVQFN exposed-pad package provides a low-inductance ground connection that improves analog measurement quality when soldered to a solid ground pour.
Recomendado
Lighting Control
The LPC1347FHN33,551 generates multi-channel PWM from its timer peripherals for LED dimming and color mixing in luminaires and smart-lighting modules. The 72 MHz core runs dimming curves, communication parsing, and scene logic concurrently, while the USB device port enables configuration tools to connect directly to the fixture during commissioning. On-chip EEPROM stores user-configured scenes and addresses through power loss. Operating from a 3.3 V rail derived from the fixture's auxiliary supply, the MCU interfaces with LED driver ICs over I2C or PWM lines, and the compact HVQFN-32 footprint fits within standard luminaire driver enclosures with room to spare.
Recomendado
Networking Accessories
USB and serial networking accessories such as serial-to-USB adapters, configuration dongles, and small protocol bridges use the LPC1347FHN33,551's combination of USB full-speed device controller and USART. Firmware bridges USB CDC traffic to the USART at line rates the 72 MHz core handles with margin, while the 12 KB SRAM buffers bursts to prevent data loss during host scheduling delays. The bootloader-capable flash allows field updates of bridge firmware directly through the USB connection. Its low unit cost at production volumes suits price-sensitive accessory markets, and the exposed-pad HVQFN package supports compact two-layer PCB implementations typical of dongle products.
Recomendado
Smart Home and IoT Endpoints
Smart-home endpoints such as wall accessories, sensor pucks, and small actuators use the LPC1347FHN33,551 as a low-cost 32-bit brain. Its I2C and SPI buses connect sensors and radio or bus-interface ICs, timers generate PWM for triac or relay-phase control, and the EEPROM stores device addresses and network parameters without external NVM. The 2.5 V to 3.3 V operating range supports direct battery or regulator-fed designs, and the entry-level Cortex-M3 delivers sufficient compute for sensor polling and protocol handling at 72 MHz while keeping quiescent power appropriate for always-on household devices in a compact 7x7 mm footprint.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para LPC1347FHN33,551 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | LPC1346FHN33,551 | LPC1345FHN33,551 | LPC1343FHN33,551 | LPC1342FHN33,551 |
|---|---|---|---|---|---|
| Package | HVQFN-32 (7x7 mm) exposed pad | HVQFN-32 (7x7 mm) - same | HVQFN-32 (7x7 mm) - same | HVQFN-32 (7x7 mm) - same | HVQFN-32 (7x7 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core / Max Frequency | ARM Cortex-M3, 72 MHz | ARM Cortex-M3, 72 MHz | ARM Cortex-M3, 72 MHz | ARM Cortex-M3, 72 MHz | ARM Cortex-M3, 72 MHz |
| Flash Memory | 64 KB | 48 KB | 32 KB | 32 KB | 16 KB |
| USB Device | USB 2.0 full-speed device | USB 2.0 full-speed device | USB 2.0 full-speed device | USB 2.0 full-speed device | No USB (family-dependent) |
| Supply Voltage | 2.5 V to 3.3 V | 2.5 V to 3.3 V | 2.5 V to 3.3 V | 2.5 V to 3.3 V | 2.5 V to 3.3 V |
| Relative Cost Position | Highest flash in family (premium) | Lower cost (-25% flash) | Lower cost (-50% flash) | Lowest common cost option | Lowest family cost |
Principais diferenciais
- Largest flash in the LPC134x family (vs LPC1346FHN33,551)
- USB full-speed device with ROM driver stack (vs LPC1342FHN33,551)
- On-chip EEPROM for parameter storage (vs LPC1343FHN33,551)
Notas de projeto
The HVQFN-32 package includes an exposed die pad that must be connected to the PCB ground plane. Design the land pattern with the exposed-pad opening per the NXP recommended footprint and use an array of thermal vias to the ground plane for solder relief. Insufficient exposed-pad soldering is the most common cause of intermittent ground and thermal problems with HVQFN devices, so include X-ray or inspection criteria in production qualification.
Decouple each VDD pin with a 100 nF ceramic capacitor placed within a few millimeters of the pin, plus at least one bulk capacitor (4.7 uF to 10 uF) near the MCU. The 2.5 V to 3.3 V supply must remain within the datasheet range during USB transients; USB VBUS (5 V) must never be applied directly to MCU supply pins - use an approved regulator. Estimated: a 3.3 V rail at typical LPC13xx operating current leaves ample margin on standard 100 mA-class LDOs for GPIO loads.
Many LPC1347 pins are multiplexed between GPIO, USART, I2C, SPI, ADC, and USB functions; I2C pins in particular require external pull-up resistors and correct open-drain configuration. Before routing, cross-check the pin-configuration chapter of the official LPC13xx datasheet for your exact package (HVQFN-32), because pin functions shift between package options. Also verify the debug/ISP entry pin state at reset to avoid unintended bootloader entry in the field.
Informações de conformidade
The NXP ',551' commercial suffix conventionally denotes tray packaging with lead-free finish, but explicit RoHS/REACH certificate text was not present in the verified data retrieved for this page; confirm on the NXP product page or via the material declaration sheet.
