LPC1827JET100E - 180MHz Cortex-M3 1MB MCU | NXP | TFBGA-100
N.º da peça: LPC1827JET100E ✓ AtivoLPC1827JET100E Visão geral
A microcontroller is a programmable semiconductor system that integrates a processor core, memory, peripherals, and interface circuitry on one package. The LPC1827JET100E belongs to the NXP LPC18xx family of Cortex-M3 devices, placing it within the broader 32-bit embedded processor, embedded control, and semiconductor hierarchies. This combination of processing performance, connectivity, and memory is intended for embedded systems requiring substantial control capability and multiple communication interfaces.
Key features include the ARM Cortex-M3 processor core, 180 MHz maximum operating frequency, 1 MB of flash memory, and 136 kB of SRAM. The integrated Ethernet interface supports network-connected equipment, while the two high-speed USB interfaces support USB peripherals, data transfer, and USB-connected control systems. LCD support broadens the device's suitability for human-machine interfaces and industrial panel controllers. The 3.3 V supply requirement supports designs built around standard embedded 3.3 V power systems.
The LPC1827JET100E architecture combines a high-performance 32-bit ARM Cortex-M3 core with dedicated connectivity and embedded peripherals. Its 100-TFBGA-100 land pattern provides a compact solution for space-constrained equipment, although ball-pitch, escape-routing, assembly, and thermal-management requirements must be considered during PCB layout. The package also demands careful via-in-pad or fanout design where required by the selected assembly process.
Typical applications include industrial Ethernet controllers, USB host or device equipment, network-connected sensors, HMI systems, and embedded gateways. The Ethernet and dual USB resources allow the MCU to bridge communications among sensors, host computers, storage devices, and service networks. The LCD interface is particularly useful where local status display is required without a separate display controller.
Design consideration: the dense 100-TFBGA footprint should be assigned to a multilayer PCB with controlled impedance and a verified escape-routing strategy. Check every power, ground, decoupling, USB, Ethernet, and clock connection against the manufacturer pin-description and reference-layout tables before fabrication. Confirm peripheral multiplexing and pin assignment in the device configuration documentation, because alternate functions can constrain simultaneous use of communication interfaces.
This product page combines manufacturer and distributor specifications with practical design guidance, connectivity-focused application analysis, packaging information, and a constrained comparison of same-family drop-in candidates. These engineering details help shorten evaluation time while preserving the need to verify the complete design against the official datasheet and hardware design guidance.
Alternativas drop-in para LPC1827JET100E — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com LPC1827JET100E (mesmo formato e footprint) — diferindo em Architecture, Flash Memory, Package, Product Type, SRAM.
LPC1825JET100E
✅ Drop-InConsulte o preço
Ver ficha técnica →LPC1823JET100E
✅ Drop-InConsulte o preço
Ver ficha técnica →LPC1822JET100E
✅ Drop-InConsulte o preço
Ver ficha técnica →LPC1812JET100E
✅ Drop-InConsulte o preço
Ver ficha técnica →LPC1827JET100E Classificações máximas e características elétricas
| Product Type | 32-bit ARM Cortex-M3 microcontroller |
| Processor Core | ARM Cortex-M3 |
| Maximum CPU Frequency | 180 MHz |
| Flash Memory | 1 MB |
| Flash Organization | 1M x 8 |
| SRAM | 136 kB |
| Operating Voltage | 3.3 V |
| Ethernet Interface | 1 Ethernet interface |
| High-Speed USB Interfaces | 2 |
| LCD Interface | Supported |
| EMC Feature | Supported |
| Architecture | 32-bit RISC |
| Package Type | 100-TFBGA |
| Package Dimensions | 9 mm x 9 mm |
| Tipo de montagem | Surface mount |
| Shipping Format | Tray |
Guia de Configuração de Pinos do LPC1827JET100E 9 mm x 9 mm
Configuração de pinos para LPC1827JET100E (pacote 9 mm x 9 mm). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para LPC1827JET100E.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
LPC1827JET100E é adequado para 6 aplicaçãos: Industrial Ethernet Controller, USB Host and Device Equipment, Local HMI and Display Controller, Networked Sensor Gateway, Industrial Communication Controller, USB Data Acquisition System.
Industrial Ethernet Controller
The LPC1827JET100E fits industrial Ethernet equipment because it combines an ARM Cortex-M3 processor operating at up to 180 MHz with 1 MB of flash, 136 kB of SRAM, and an integrated Ethernet interface. These resources support protocol processing, supervisory control, diagnostics, and local data handling without requiring a separate high-performance processor. The Ethernet interface reduces system complexity, while the compact 100-TFBGA package measures 9 mm by 9 mm for space-constrained control hardware. Implementation must account for the selected PHY, magnetics, controlled-impedance routing, clocking, and isolation requirements.
Recomendado
USB Host and Device Equipment
The LPC1827JET100E is suitable for USB host, peripheral, and data-acquisition equipment because it provides two high-speed USB interfaces alongside a 180 MHz Cortex-M3 core. A designer can allocate separate hardware paths for USB host and device duties when the selected pin multiplexing and board topology allow it. The 1 MB flash supports embedded firmware and protocol code, while 136 kB of SRAM supports buffers and control state. Practical designs should follow high-speed USB routing guidance, preserve impedance control, provide correct termination, and verify connector power requirements against the device supply design.
Recomendado
Local HMI and Display Controller
The LPC1827JET100E can serve as the controller for a compact human-machine interface because it combines LCD support, 136 kB of SRAM, and up to 180 MHz of processing capacity. This allows a design to maintain a graphical or segment display while also processing local sensor data and communications. The integrated LCD interface can simplify the architecture relative to a discrete display controller, although the exact display resolution, interface timing, and electrical levels must match the selected panel. Firmware should include display refresh, touch or keypad input, and communication tasks while respecting the MCU's memory budget.
Recomendado
Networked Sensor Gateway
The LPC1827JET100E fits a compact sensor gateway that aggregates local measurements and forwards them over Ethernet or USB. Its 180 MHz Cortex-M3 core provides timing capacity for sampling, filtering, protocol conversion, and device management, while 1 MB flash accommodates application firmware, boot logic, and update handling. Ethernet supports upstream network connectivity, while the two USB interfaces can support local configuration, logging, or peripheral attachment. A robust gateway design should validate worst-case interrupt latency, data-buffer depth, watchdog behavior, and brownout recovery before deployment in unattended monitoring installations.
Recomendado
Industrial Communication Controller
The LPC1827JET100E is appropriate for industrial communication equipment requiring both wired networking and USB service connectivity. The Cortex-M3 architecture handles protocol state machines and real-time control, and the integrated Ethernet and two USB interfaces reduce the number of companion devices. With 1 MB flash and 136 kB SRAM, the MCU can support a network stack, configuration storage, diagnostics, and a secondary USB path. The 100-TFBGA footprint helps reduce board area, but its 9 mm by 9 mm land pattern requires a capable assembly process and a carefully validated multilayer layout.
Recomendado
USB Data Acquisition System
The LPC1827JET100E can act as the processing center of a USB data acquisition system because its 180 MHz Cortex-M3 core supports time-sensitive sampling control and the two high-speed USB interfaces provide flexible host or device connectivity. The 136 kB SRAM can hold acquisition buffers and control state, while 1 MB flash accommodates firmware and protocol components. One USB interface may serve a host connection while another supports a peripheral or maintenance path, subject to pin assignment. Validate sampling timing, DMA behavior, USB enumeration, suspend and resume requirements, and thermal performance across the intended operating environment.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para LPC1827JET100E — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | LPC1825JET100E | LPC1823JET100E | LPC1822JET100E | LPC1812JET100E |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 100-TFBGA | 100-TFBGA | 100-TFBGA | 100-TFBGA | 100-TFBGA |
| Processor Core | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 |
Principais diferenciais
- Higher documented processing configuration in the LPC18xx comparison set (vs LPC1825JET100E)
- Connectivity-focused system integration (vs LPC1823JET100E)
- Compact 100-ball integration (vs LPC1822JET100E)
Notas de projeto
Assign the 100-TFBGA footprint only after comparing the selected manufacturer package drawing, ball map, and assembly capability. Use a multilayer PCB with a controlled escape-routing strategy for the dense 9 mm by 9 mm land pattern. Validate the stack-up, via-in-pad or fanout construction, solder-mask definition, and assembly process before releasing the layout; a visually similar ball-array package does not establish mechanical compatibility.
Separate Ethernet and high-speed USB routing from sensitive analog or low-speed communication paths, and use the manufacturer's reference layout for impedance and return-path guidance. Keep the PHY, magnetics, and USB connector connections short where the interface guidance requires it, provide continuous reference planes, and avoid discontinuities beneath high-speed links. Validate USB differential impedance and Ethernet impedance using the actual PCB stack-up.
Build the 3.3 V power tree with local bulk and high-frequency decoupling placed according to the manufacturer power-distribution guidance. Check every voltage domain and I/O tolerance against the pin-description table before attaching external signals. Brownout behavior, startup sequencing, and peripheral current changes should be evaluated because the 180 MHz processing core and multiple communication interfaces can create varying demand during normal operation.
Do not assume that every LPC18xx device in the 100JET100 package is functionally interchangeable. Review CPU frequency, flash, SRAM, Ethernet, USB, LCD, clock, pin multiplexing, startup, and brownout behavior for the exact candidate. A valid substitution must preserve the board's electrical assumptions and required peripheral functions, not merely the package designation and family name.
Informações de conformidade
No specific RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status was stated in the available product information. Confirm these attributes in the current manufacturer product documentation before final qualification.
