LPC3240FET296/01 - ARM9 MCU 266MHz 256KB SRAM 296-TFBGA | NXP
N.º da peça: LPC3240FET296/01 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.75 | $167,50 |
| 100 | $14.2 | $1.420,00 |
| 500 | $12.05 | $6.025,00 |
| 1.000 | $10.4 | $10.400,00 |
LPC3240FET296/01 Visão geral
An ARM9 microcontroller is a 32-bit RISC processor built on the ARMv5TEJ architecture, featuring a Harvard memory layout, a 5-stage pipeline, and a full Memory Management Unit (MMU). The architecture sits inside the broader hierarchy of ARM cores -> ARM9 family -> ARM926EJ-S, and is positioned above Cortex-M microcontrollers in performance while consuming less power than Cortex-A application processors. ARM926EJ-S devices remain widely deployed in industrial, consumer, and automotive telematics designs that need Linux/WinCE support and deterministic real-time response.
Key differentiating features include a dedicated hardware VFP coprocessor that accelerates single-precision floating-point math, a 266 MHz sustained CPU clock, 256 kB zero-wait-state SRAM, and on-chip peripherals such as USB 2.0 High-Speed OTG, 10/100 Ethernet MAC, LCD controller, SDR/DDR memory controller, and 12-bit ADC. The combination of high-bandwidth USB, networking, and large memory support makes the part suitable for graphics terminals and embedded gateways.
The LPC3240FET296/01 architecture couples the ARM926EJ-S core to an AHB multi-layer bus matrix, providing simultaneous access to SRAM, external memory, and peripherals without contention. The MMU and DSP extensions enable full Linux 2.6 kernel support and DSP-style signal-processing kernels. Multiple low-power modes (Idle, Sleep, Deep-sleep, Power-down, Deep power-down) allow designers to manage quiescent current for battery-backed industrial nodes.
Typical applications include industrial human-machine interfaces (HMIs), point-of-sale terminals, building automation controllers, medical patient monitors, and ruggedized portable data loggers. The 296-TFBGA package and 0.8 mm ball pitch suit high-density 4-layer or 6-layer PCB designs that route Ethernet, USB, and external DDR memory without crowding the layout.
When designing with this device, allocate a minimum 4-layer PCB stack-up to fan out the 0.8 mm pitch BGA, keep the 25 MHz main crystal within 5 mm of the XTAL pins, and follow NXP's recommended decoupling scheme with one 100 nF capacitor per supply pin and a 4.7 uF bulk cap per supply rail.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a faster sourcing and review experience.
Alternativas drop-in para LPC3240FET296/01 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
LPC3240FET296/01,5
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LPC3240FET296/01K
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LPC3230FET296
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LPC3250FET296
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LPC3220FET296
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LPC3240FET296/01 Classificações máximas e características elétricas
| Core Architecture | ARM926EJ-S (ARM9, 32-bit RISC, Harvard, 5-stage pipeline) |
| Maximum CPU Frequency | 266 MHz |
| Hardware Floating Point | Yes (Vector Floating Point coprocessor) |
| On-chip SRAM | 256 kB |
| On-chip ROM | ROMless |
| MMU | Yes (full Memory Management Unit) |
| Instruction Set Extensions | ARMv5TEJ (Thumb, Jazelle, DSP extensions) |
| USB Interface | USB 2.0 High-Speed On-The-Go (OTG) |
| Ethernet | 10/100 MAC (MII/RMII interface) |
| External Memory Bus | SDR SDRAM and DDR SDRAM controller |
| Storage Interfaces | SD/MMC, NAND flash controller |
| Display Interface | LCD controller (improved LCD in /021 variant) |
| ADC | 10-bit ADC |
| Encapsulamento | 296-TFBGA (15 x 15 mm, 0.8 mm pitch) |
| Operating Voltage | 1.8 V core / 2.5 V / 3.3 V I/O (multi-rail) |
| Temperatura de operação | -40C to +85C (industrial) |
| Tipo de montagem | Surface Mount (BGA) |
| Status RoHS | Compliant |
| Family | LPC3200 |
Guia de Configuração de Pinos do LPC3240FET296/01 296-tfbga (15 x 15 mm, 0.8 mm pitch)
Configuração de pinos para LPC3240FET296/01 (pacote 296-tfbga (15 x 15 mm, 0.8 mm pitch)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para LPC3240FET296/01.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
LPC3240FET296/01 é adequado para 6 aplicaçãos: Industrial Human-Machine Interface (HMI), Point-of-Sale (POS) Terminals, Building Automation Controllers, Medical Patient Monitors, Industrial Data Loggers and Gateways, Automotive Telematics and Infotainment.
Industrial Human-Machine Interface (HMI)
The LPC3240FET296/01 fits industrial HMI panels because its 266 MHz ARM926EJ-S core drives TFT LCD controllers while the integrated 10/100 Ethernet MAC streams data from PLCs and SCADA nodes. Its 256 kB of zero-wait-state SRAM holds frame buffers and event queues without external memory contention. The improved LCD controller in the /01,5 silicon revision handles 24-bit color and touch-screen input, eliminating an additional ASIC. Designers place the BGA on a 4-layer PCB with a 4.7 uF decoupling cap per supply rail, achieving EN 61131-2 industrial EMC margins.
Recomendado
Point-of-Sale (POS) Terminals
POS terminals benefit from the LPC3240FET296/01's USB 2.0 High-Speed OTG, which connects receipt printers, barcode scanners, and customer displays without an external hub. The ARM926EJ-S core runs embedded Linux with Java-based payment stacks, while the hardware VFP accelerates encryption handshakes (RSA, ECC) during card transactions. The 296-TFBGA 15 x 15 mm package fits inside slimline countertop enclosures, and the industrial -40C to +85C temperature range handles kitchen or outdoor kiosks. A typical BOM pairs the MCU with DDR SDRAM and a NAND flash for the OS image.
Recomendado
Building Automation Controllers
The LPC3240FET296/01's Ethernet MAC and ARM926EJ-S MMU support full Linux builds for BACnet, Modbus, and KNX gateways in HVAC and lighting controllers. Its 256 kB SRAM holds network protocol stacks, while the SDR/DDR controller offloads large packet buffers. Low-power modes (Sleep, Power-down) let battery-backed controllers ride out grid disturbances. The 296-TFBGA footprint integrates cleanly with the 24V industrial backplane common in building automation, and the AEC-style ESD margins on USB and Ethernet lines meet IEC 61000-4-2 contact-discharge targets when paired with TVS arrays.
Recomendado
Medical Patient Monitors
Patient monitors use the LPC3240FET296/01 to drive waveform LCDs while running DSP-style ECG and SpO2 algorithms on the hardware VFP coprocessor. The 266 MHz clock sustains 250 Hz sample rates across 12 leads without jitter, and the 256 kB SRAM keeps rolling waveform buffers in zero-wait-state memory. IEC 60601-1 isolation is achieved by pairing the MCU's UART with the ISO7762FDWR digital isolator and an external ADC. The BGA package and low-quiescent Sleep mode suit battery-powered portable monitors that must run 8 hours per shift.
Recomendado
Industrial Data Loggers and Gateways
Ruggedized data loggers use the LPC3240FET296/01 for its 266 MHz ARM9 throughput, the 256 kB SRAM for time-stamped event buffers, and the Ethernet MAC for remote telemetry. The NAND flash controller boots Linux directly from a 1 Gbit SLC flash, while the DDR controller streams sensor data to a remote historian. Industrial -40C to +85C operation tolerates outdoor enclosures, and the 296-TFBGA package withstands MIL-STD-810 vibration when PCB-staked. Designers pair the MCU with external 16-bit ADCs for thermocouple and 4-20 mA current loop inputs.
Recomendado
Automotive Telematics and Infotainment
The LPC3240FET296/01's CAN-capable timers and Ethernet MAC make it a fit for fleet telematics boxes and entry-level infotainment head units. The ARM926EJ-S core runs Linux with GPS, accelerometer, and cellular modem drivers, while the USB High-Speed OTG connects dash cameras and OBD-II dongles. The industrial temperature range tolerates cabin environments, but automotive deployments should verify AEC-Q100 status with NXP for production. The 256 kB SRAM holds navigation map tiles without external DRAM contention, and the VFP accelerates audio codec processing for hands-free Bluetooth profiles.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para LPC3240FET296/01 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | LPC3240FET296/01,5 | LPC3240FET296/01K | LPC3230FET296 | LPC3250FET296 | LPC3220FET296 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 296-TFBGA (15x15) | 296-TFBGA (15x15) - same | 296-TFBGA (15x15) - same | 296-TFBGA (15x15) - same | 296-TFBGA (15x15) - same | 296-TFBGA (15x15) - same |
| Maximum CPU Frequency | 266 MHz | 266 MHz | 266 MHz | 208 MHz | 266 MHz | 200 MHz |
| On-chip SRAM | 256 kB | 256 kB | 256 kB | 256 kB | 256 kB | 128 kB |
| Hardware Floating Point | Yes (VFP) | Yes (VFP) | Yes (VFP) | No | Yes (VFP) | No |
| USB 2.0 High-Speed OTG | Yes | Yes | Yes | Yes | Yes | Yes |
| Ethernet MAC | 10/100 | 10/100 | 10/100 | 10/100 | 10/100 | 10/100 |
| LCD Controller | Improved (silicon rev /01) | Improved (silicon rev /01,5) | Improved (silicon rev /01) | Standard | Improved | Standard |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Approx. 1k-piece Pricing (USD) | $10.40 | $10.40 | $10.40 | $9.10 | $12.85 | $8.75 |
Principais diferenciais
- Integrated hardware Vector Floating Point coprocessor (vs LPC3230FET296)
- Higher 266 MHz sustained CPU clock (vs LPC3220FET296)
- Full 256 kB zero-wait-state SRAM (vs LPC3220FET296)
- Improved LCD controller in silicon revision /01 (vs LPC3250FET296)
Notas de projeto
Estimated: the 296-TFBGA package at 0.8 mm ball pitch requires a minimum 4-layer PCB stack-up with 0.4 mm laser-drilled vias-in-pad for fanout. Route all differential pairs (USB DP/DN, Ethernet MII/RMII) with 90 ohm differential impedance and keep trace length matching within 0.5 mm. Place a 4.7 uF bulk decoupling capacitor per supply rail within 5 mm of the BGA, plus one 100 nF cap directly under each supply ball cluster to suppress switching noise.
Estimated: at the maximum 266 MHz clock with all peripherals active, the LPC3240FET296/01 typically dissipates 600 to 800 mW. The TFBGA package's theta_JA is approximately 25 C/W on a 4-layer JEDEC test board, yielding a self-heating rise of 15-20C above ambient. For sealed enclosures without airflow, add a copper pour under the BGA and 4 thermal vias (0.3 mm) to the inner ground plane to keep the junction below 105C at 85C ambient.
Do not omit the external 32.768 kHz watch crystal on the RTC oscillator pins, even if RTC is unused - the internal RTC block requires a reference clock at power-up. Always sequence the 1.8 V core rail before the 2.5 V and 3.3 V I/O rails by at least 10 ms to avoid latch-up. The USB HS PHY's 480 MHz reference clock is sensitive to PCB capacitance; keep the XTAL1/XTAL2 traces shorter than 5 mm and shield them with a ground ring.
The DDR SDRAM controller on the LPC3240FET296/01 requires matched-length traces within 25 mils (0.6 mm) on the address/control bus to avoid double-clocking at 266 MHz. Place series 22 ohm damping resistors on the DDR clock lines near the MCU to reduce overshoot. For Ethernet MII at 25 MHz, keep the 25 MHz reference clock trace isolated from switching power nets and route it on an inner layer with continuous ground reference.
Informações de conformidade
RoHS and lead-free per NXP product page. AEC-Q100 status not specified by NXP for this part - automotive deployments should verify with NXP field application support. Halogen-free status not explicitly confirmed in the provided web data and marked unknown.
