LS1020ASE7KQB - 1GHz Dual-Core ARM SoC, Layerscape | NXP
N.º da peça: LS1020ASE7KQB ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $89.5 | $89,50 |
| 10 | $80.55 | $805,50 |
| 100 | $71.6 | $7.160,00 |
| 500 | $63.85 | $31.925,00 |
| 1.000 | $56.1 | $56.100,00 |
LS1020ASE7KQB Visão geral
What is an ARM SoC (System-on-Chip)? An ARM SoC integrates one or more ARM processor cores, a memory controller, peripheral interfaces, and frequently hardware accelerators onto a single silicon die, eliminating the need for a companion chipset. The LS1020A belongs to the Layerscape family of communications processors, which sits at the networking and industrial gateway tier of the broader QorIQ (now Layerscape) product hierarchy: ARM Cortex cores -> communications SoC -> Layerscape LS1 family -> embedded networking processors. Layerscape is an industry-first software-aware, core-agnostic architecture that targets cost- and power-efficient fanless operation.
The LS1020ASE7KQB runs the dual Cortex-A7 cores at 1.0 GHz with NEON SIMD media processing and includes dedicated DDR3L/DDR4 memory controllers supporting ECC for high-reliability designs. Its peripheral mix - dual vTSEC for GbE switching/routing, PCIe Gen2 root complex, USB 3.0, SATA 3.0, and SEC security engine - allows a single chip to replace a CPU-plus-discrete-controller solution. The QUICC Engine subsystem (uQE) provides legacy multi-protocol serial support for industrial fieldbus and telecom bridging.
Typical applications include industrial IoT gateways, fanless industrial routers, factory automation controllers, smart-grid edge nodes, and small-form-factor NAS or network attached storage. The combination of deterministic real-time performance with hardware crypto acceleration makes the LS1020ASE7KQB well suited to secure edge compute nodes that aggregate sensor data before forwarding upstream. Operating temperature up to 105 °C enables deployment in sealed enclosures without active cooling.
When designing with this part, allocate sufficient PCB area for the 19 x 19 mm 525-ball FCPBGA footprint and provide a minimum of 6 PCB layers with matched-impedance routing for DDR3L/DDR4 traces. Power sequencing of the 1.0 V core and I/O rails must follow the reference manual to avoid latch-up at startup. Validation against the Layerscape SDK and U-Boot boot streams is required for production deployment.
This page synthesizes drop-in alternative analysis, application scenarios, and design guidance that go beyond the manufacturer datasheet, helping engineers evaluate sourcing options and architecture trade-offs.
Alternativas drop-in para LS1020ASE7KQB — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
LS1020AXE7HNB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LS1020AXE7KQB
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
LS1020ASN7KQB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LS1021ASE7KQB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LS1022ASE7KQB
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
LS1020ASE7KQB Classificações máximas e características elétricas
| Core Processor | ARM Cortex-A7 |
| Number of Cores | 2 |
| Bus Width | 32-bit |
| Core Speed | 1.0 GHz |
| Family | QorIQ Layerscape LS1 |
| Co-Processors / DSP | Multimedia; NEON SIMD |
| RAM Controllers | DDR3L, DDR4 with ECC |
| Graphics Acceleration | No |
| Ethernet | vTSEC (Gigabit) |
| PCIe | PCIe Gen2 |
| USB | USB 3.0 |
| SATA | SATA 3.0 |
| Security Engine | SEC crypto offload |
| Legacy Serial Engine | QUICC Engine (uQE) |
| Encapsulamento | 525-FCPBGA (19x19 mm) |
| Temperatura de operação | 0 °C to +105 °C |
| Tensão de alimentação | 1.0 V core |
| Status RoHS | Compliant (per NXP product page) |
Guia de Configuração de Pinos do LS1020ASE7KQB 525-fcpbga (19x19 mm)
Configuração de pinos para LS1020ASE7KQB (pacote 525-fcpbga (19x19 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para LS1020ASE7KQB.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
LS1020ASE7KQB é adequado para 6 aplicaçãos: Industrial IoT Gateway, Fanless Industrial Router, Edge Compute / NAS Appliance, Smart-Grid Edge Node, Factory Automation Controller, Compact Network Security Appliance.
Industrial IoT Gateway
The LS1020ASE7KQB fits industrial IoT gateway deployments because its dual 1.0 GHz ARM Cortex-A7 cores deliver deterministic packet processing while the integrated vTSEC Gigabit Ethernet ports aggregate multiple fieldbuses. Hardware SEC crypto offload accelerates TLS / IPsec tunnels, securing MQTT or OPC-UA traffic without loading the CPU. The 0 to 105 °C operating range enables deployment in sealed cabinets on factory floors. Placed as the main SoC alongside a small DDR3L SO-DIMM and a GbE PHY, it consolidates routing, encryption, and protocol conversion. Compared with a discrete CPU + companion bridge design, the LS1020A drops BOM cost and PCB area. Power dissipation scales dynamically with the layerscape DVFS governors in the Linux BSP.
Recomendado
Fanless Industrial Router
For fanless industrial routers, the LS1020ASE7KQB integrates dual GbE MACs in the vTSEC block, a uQE QUICC Engine for legacy serial tunneling, and a PCIe Gen2 root complex for Wi-Fi or 4G/5G modems. The 1.0 GHz Cortex-A7 dual-core cluster routes millions of packets per second at sub-5-watt power, allowing passive heatsink cooling. Hardware SEC handles VPN encryption at line rate. The 525-FCPBGA (19x19 mm) package keeps PCB size small enough for DIN-rail enclosures. Boot from NAND or eMMC via the integrated peripheral set; the Layerscape SDK provides DPDK and VPP data-plane support.
Recomendado
Edge Compute / NAS Appliance
The LS1020ASE7KQB works as the main processor in a small-form-factor NAS or edge storage appliance thanks to its SATA 3.0 port count and USB 3.0 host. The dual Cortex-A7 cores plus NEON SIMD accelerate AES-XTS storage encryption when paired with the SEC engine. DDR3L/DDR4 controllers with ECC protect against single-bit DRAM errors in always-on storage devices. The PCIe Gen2 link connects to an external 10 GbE NIC where higher uplink bandwidth is required. Compared with ARM9-based legacy NAS boards, the Layerscape LS1020A offers 2-3x the throughput at similar power. Linux mainline kernel 5.10+ provides upstream BTRFS and ZFS support.
Recomendado
Smart-Grid Edge Node
For smart-grid substation edge nodes, the LS1020ASE7KQB combines hardware crypto (SEC), deterministic Ethernet (vTSEC), and legacy substation protocols (uQE) in one chip. IEC 61850 GOOSE messaging benefits from the deterministic latency of the dual Cortex-A7 cores running under Linux PREEMPT_RT. The 0 to 105 °C temperature grade supports outdoor cabinet deployment without derating. Hardware tamper detection via the SEC block aids NERC-CIP compliance. Pairing with a redundant GbE PHY and an isolated RS-485 transceiver provides a complete substation RTU front end.
Recomendado
Factory Automation Controller
The LS1020ASE7KQB suits PLC and motion-controller roles where determinism, multi-protocol networking, and small form factor are required. The uQE QUICC Engine handles Profibus, CAN, or legacy serial fieldbuses that controllers must still expose. The dual 1.0 GHz Cortex-A7 cluster runs a real-time Linux or RTOS instance for motion-loop closure at sub-millisecond rates. Hardware SEC protects firmware integrity against supply-chain tampering. The 525-FCPBGA keeps the SoC footprint compact for DIN-rail or panel-mount enclosures. Compared to discrete MCU plus gateway solutions, this single-chip approach consolidates networking and control.
Recomendado
Compact Network Security Appliance
The LS1020ASE7KQB integrates hardware IPsec/TLS acceleration in the SEC engine, which makes it suitable for branch-office firewall / UTM appliances. Dual GbE ports via vTSEC support WAN/LAN segmentation, and the PCIe Gen2 link connects a wireless or LTE modem for cellular failover. The 1.0 GHz dual Cortex-A7 runs an open-source firewall stack (iptables / nftables / Suricata) without becoming throughput-bound on small packet sizes. The industrial temperature grade plus 525-FCPBGA footprint supports sealed SOHO appliance enclosures.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para LS1020ASE7KQB — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | LS1020AXE7HNB | LS1020AXE7KQB | LS1020ASN7KQB | LS1021ASE7KQB |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 525-FCPBGA (19x19 mm) | 525-FCPBGA (19x19 mm) - same | 525-FCPBGA (19x19 mm) - same | 525-FCPBGA (19x19 mm) - same | 525-FCPBGA (19x19 mm) - same |
| CPU Cores | 2 x ARM Cortex-A7 | 2 x ARM Cortex-A7 | 2 x ARM Cortex-A7 | 2 x ARM Cortex-A7 | 2 x ARM Cortex-A7 |
| Core Speed | 1.0 GHz | 1.2 GHz (H bin, +20%) | 1.0 GHz | 1.0 GHz | 1.0 GHz |
| Operating Temperature | 0 to +105 °C | 0 to +105 °C | 0 to +105 °C | 0 to +105 °C | 0 to +105 °C |
| DRAM Controller | DDR3L / DDR4 with ECC | DDR3L / DDR4 with ECC | DDR3L / DDR4 with ECC | DDR3L / DDR4 with ECC | DDR3L / DDR4 with ECC |
| Encryption Engine | SEC hardware offload | SEC hardware offload | SEC hardware offload | SEC hardware offload | Enhanced SEC (LS1021A feature set) |
| PER Tier (Indicative) | USD 89.50 (qty 1) | Higher bin = typically +10-15% | Similar tier, KQB suffix | Similar tier, N sales code | Slightly higher (richer peripherals) |
| Lifecycle / Stock | Active | Active | Active | Active | Active |
Principais diferenciais
- Dual-core ARM Cortex-A7 at 1.0 GHz with hardware SEC + uQE in a single 525-FCPBGA (vs LS1022ASE7KQB)
- 0 to +105 °C industrial temperature grade at the value-performance tier (vs LS1020AXE7HNB)
- Same 525-FCPBGA footprint across the LS1 family (vs LS1043AXE7KQB)
Notas de projeto
Estimated: the 525-FCPBGA (19x19 mm) 1.0 mm pitch BGA requires at minimum a 6-layer PCB with through-via-in-pad or microvia stack-ups to route the dual DDR3L/DDR4 channels. Matched-impedance routing for DDR traces (50 ohm single-ended, 100 ohm differential for DQS) is essential - plan stack-up before schematic. Keep the 1.0 V core power plane unbroken above the SoC footprint to provide low-impedance decoupling. Decoupling must include 0402-size 100 nF caps within 2 mm of every BGA power/ground ball pair.
At 1.0 GHz dual-core sustained load the LS1020ASE7KQB dissipates roughly 4-6 W depending on peripheral utilization; place a thermal interface material pad below the SoC and a copper coin or heat-spreader on the top-side BGA to enable passive heatsink mounting. For sealed enclosures with no airflow, monitor junction temperature via the on-die thermal diode and reduce clock via Layerscape DVFS governors if Tj exceeds 100 °C.
Do NOT design in the LS1021ASE7KQB as a silent drop-in: although the 525-FCPBGA package is identical, the LS1021A silicon has additional peripheral pins and a different pin-mux table; the existing LS1020A firmware image will not boot. Re-spin the device tree and recompile U-Boot against the LS1021A reference manual before reuse. Also verify the boot ROM configuration words (RCW) for any silicon revision (Rev 2.0 vs 1.1 differ in default SERDES lanes).
Informações de conformidade
RoHS compliance per NXP product page listings (DigiKey, NXP part page). REACH, halogen-free and conflict-minerals statements not explicitly present in the verified web snippets; consult NXP product-compliance portal for full documentation. Not AEC-Q100 qualified - this is an industrial-graded part, not automotive.
