MAX14931DASE+T - 4-Ch 2.75kVrms Digital Isolator, 1Mbps | ADI
N.º da peça: MAX14931DASE+T ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $4.42 | $4,42 |
| 10 | $3.97 | $39,70 |
| 100 | $3.2 | $320,00 |
| 500 | $2.74 | $1.370,00 |
| 1.000 | $2.41 | $2.410,00 |
MAX14931DASE+T Visão geral
What is a digital isolator? A digital isolator is an integrated circuit that transfers digital signals across an isolation barrier using capacitive, inductive (transformer), or optical coupling while blocking high voltages and transients. Digital isolators replace optocouplers in modern designs, offering higher speed, lower power consumption, better CMTI, and longer operational life. They sit in the signal chain hierarchy of interface IC -> isolator -> digital isolator -> quad-channel digital isolator, providing functional safety and ground isolation in industrial, medical, and renewable-energy systems.
Key specifications include 2.75 kVrms isolation voltage rating per UL 1577, 1 Mbps maximum data rate across four unidirectional channels (3-in/1-out configuration in the MAX14931DASE variant), 25 kV/us typical common-mode transient immunity (CMTI), and a wide 1.71 V to 5.5 V supply range on both sides. The device operates across the -40 C to +125 C industrial temperature range and consumes under 3 mA per channel at 1 Mbps. The wide-body SOIC-16 footprint provides the required creepage and clearance for reinforced insulation at 2.75 kVrms.
The MAX14931DASE+T architecture uses capacitive isolation with differential signaling across the isolation barrier and integrated refresh circuitry on the secondary side, achieving deterministic timing with under 50 ns propagation delay. This topology avoids the aging and CTR-degradation mechanisms of optocouplers, providing stable performance over the device's lifetime.
Typical applications include isolated SPI/RS-232/RS-485 interfaces, industrial fieldbus isolation (Modbus, Profibus), PLC digital I/O modules, isolated gate drivers for motor control and solar inverters, medical device signal isolation per IEC 60601-1, and battery management system (BMS) communications in electric vehicles. The MAX14931 variant (3-in/1-out channel direction) suits SPI-style clock/SS/MOSI/MISO isolation where the host side has three inputs and one output.
When designing with the MAX14931DASE+T, place 0.1 uF bypass capacitors as close as possible to each VDD pin and ensure adequate creepage on the PCB (at least 8 mm for 2.75 kVrms reinforced insulation per IEC 60730-1). The EN pin controls the output enable state and should be tied high for normal operation or left open if unused.
This page synthesizes distributor pricing, drop-in alternatives drawn from the same ADI/Maxim family and competitor cross-reference data, and practical PCB layout notes that extend beyond the manufacturer datasheet.
Alternativas drop-in para MAX14931DASE+T — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MAX14931DASE+T (mesmo formato e footprint) — diferindo em Common-Mode Transient Immunity (CMTI), Operating Temperature Range, Package, Number of Channels.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MAX14930DASE+T
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MAX14932DASE+T
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MAX14130EASE+T
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
ISO7761DW
✅ Drop-In✓ Em estoque
$2.78 / unidade
Ver ficha técnica →SI8621EC-B-IS
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
ADUM1410ARWZ
✅ Drop-In✓ Em estoque
$2.2 / unidade
Ver ficha técnica →MAX14931DASE+T Especificações
| Isolation Type | Digital Isolator (capacitive) |
| Canais | 4 (unidirectional) |
| Channel Direction | 3-in / 1-out |
| Isolation Voltage Rating | 2750 Vrms (per UL 1577) |
| Maximum Data Rate | 1 Mbps |
| Common-Mode Transient Immunity (CMTI) | 25 kV/us (typical) |
| Supply Voltage Range | 1.71 V to 5.5 V (each side) |
| Faixa de temperatura de operação | -40 C to +125 C |
| Encapsulamento | 16-pin SOIC (wide body, 0.154 inch / 3.90 mm) |
| Tipo de montagem | Surface Mount |
| Output Enable (EN) Pin | Yes |
| Status RoHS | Compliant |
Configuração de pinos do MAX14931DASE+T
| Pino 1 | VDD1 — Power supply for side 1 (input side, 1.71V to 5.5V) |
| Pino 2 | GND1 — Ground reference for side 1 |
| Pino 3 | IN1 — Input channel 1 (side 1 to side 2) |
| Pino 4 | IN2 — Input channel 2 (side 1 to side 2) |
| Pino 5 | IN3 — Input channel 3 (side 1 to side 2) |
| Pino 6 | EN — Output enable, active high (tie high for normal operation) |
| Pino 7 | NC — Not connected (per datasheet) |
| Pino 8 | GND1 — Ground reference for side 1 (duplicate bond for thermal/EMC) |
| Pino 9 | GND2 — Ground reference for side 2 (output side) |
| Pino 10 | NC — Not connected (per datasheet) |
| Pino 11 | OUT4 — Output channel 4 (side 2 to side 1, the single output channel for MAX14931) |
| Pino 12 | NC — Not connected (per datasheet) |
| Pino 13 | NC — Not connected (per datasheet) |
| Pino 14 | GND2 — Ground reference for side 2 (duplicate bond) |
| Pino 15 | VDD2 — Power supply for side 2 (output side, 1.71V to 5.5V) |
| Pino 16 | VDD2 — Power supply for side 2 (output side, duplicate bond) |
Aplicações típicas
MAX14931DASE+T é adequado para 7 aplicaçãos: Isolated SPI Bus Interface, Industrial RS-485 / Fieldbus Isolation, PLC Digital I/O Module Isolation, Isolated Gate Driver Signal Path, Battery Management System (BMS) Communication, Medical Device Signal Isolation (IEC 60601-1), Solar Inverter Communication Isolation.
Isolated SPI Bus Interface
The MAX14931DASE+T's 3-in/1-out channel direction maps directly to a 4-wire SPI bus: SCLK, MOSI, and SS as inputs (host to slave), MISO as the output (slave to host). Its 1 Mbps data rate supports SPI peripheral clocks up to approximately 500 kHz without timing margin concerns, and the 2.75 kVrms isolation blocks ground loops between the host MCU and a remote sensor or actuator in noisy motor-drive cabinets. Placed between the MCU and SPI peripheral with 0.1 uF bypass caps on each VDD, the part replaces four optocouplers with one IC. Trade-off: versus a TI ISO7761 (25 Mbps), the MAX14931DASE+T is slower but cheaper and uses less power. Recommended companions: MAX3100 SPI-to-UART, MAX14850ASE+ for additional GPIO isolation.
Recomendado
Industrial RS-485 / Fieldbus Isolation
The MAX14931DASE+T isolates a half-duplex RS-485 transceiver such as the MAX485 or ADM485 from the bus medium while preserving 1 Mbps data rate, sufficient for Modbus RTU, DMX512, and Profibus DP up to 1.5 Mbps with some derating. The 25 kV/us CMTI rejects common-mode noise injected by long cable runs in factory environments, and the 2.75 kVrms isolation withstands ground-potential differences between PLC cabinets on different power phases. In a typical circuit, two channels drive DI and DE of the transceiver while two channels return RO. Compared to optocouplers (which require discrete biasing), the MAX14931DASE+T reduces BOM by four components. Recommended companions: MAX485ESA+, MAX14882AWE+.
Recomendado
PLC Digital I/O Module Isolation
PLC digital input and output modules require channel-to-channel and field-to-logic isolation to meet IEC 61131-2 and survive 24V field-side transients. The MAX14931DASE+T's 4 channels and 25 kV/us CMTI isolate 24V field-side logic from 5V backplane logic in a compact 16-pin SOIC footprint. Each channel handles up to 1 Mbps, more than adequate for digital I/O update rates of 100 kHz or less. The wide-body SOIC package provides the creepage needed for 250 Vrms reinforced insulation per IEC 60747-17. Recommended companions: MAX14821ETG+ (digital input serializer), MAX14819AATM+T (I/O expander).
Recomendado
Isolated Gate Driver Signal Path
Isolated gate drivers for IGBTs, SiC MOSFETs, and high-voltage GaN in motor drives and solar inverters require strong CMTI to survive dV/dt switching transients. The MAX14931DASE+T's 25 kV/us CMTI handles the dV/dt of 600V/1200V IGBT bridges without bit errors, and 1 Mbps is sufficient for switching frequencies up to 500 kHz in advanced SiC/GaN designs. Used between a low-voltage gate-driver controller and a high-side gate driver, the MAX14931DASE+T replaces bootstrap or optocoupler isolation with a single IC. Recommended companions: MAX2270E (high-side gate driver), MAX17651 (isolated gate driver IC).
Recomendado
Battery Management System (BMS) Communication
Lithium-ion battery stacks in electric vehicles and grid storage use the MAX14931DASE+T to isolate daisy-chained cell-monitoring ICs such as the MAX17843 or LTC6811IG-1#3ZZTRPBF from the host BMS controller. The 2.75 kVrms isolation withstands the high-voltage battery stack (typically 400V or 800V) and the 1 Mbps data rate handles SPI cell-balancing commands. Each MAX14931 isolates one battery module from the next; stacked in series, they communicate up to 1000V systems. Recommended companions: LTC6811IG-1#3ZZTRPBF (cell monitor), MAX17843 (BMS analog front end).
Recomendado
Medical Device Signal Isolation (IEC 60601-1)
Patient-connected medical devices such as patient monitors, infusion pumps, and ECG machines require two means of patient protection (MOPP) per IEC 60601-1. The MAX14931DASE+T's 2.75 kVrms isolation rating supports 1 MOPP (1.5 kV) or 2 MOPP (4 kV with double insulation) in the patient-applied circuit. The capacitive isolation topology of the MAX14931DASE+T is more reliable over the device lifetime than optocouplers, satisfying the long-life requirements of medical equipment. Recommended companions: MAX86140 (optical PPG sensor), MAX30003 (bioimpedance AFE).
Recomendado
Solar Inverter Communication Isolation
Solar inverters use the MAX14931DASE+T to isolate low-voltage control logic (DSP/MCU) from the high-voltage DC bus and AC grid interface. The 2.75 kVrms withstands the 600V/1000V DC bus, and 25 kV/us CMTI rejects the dV/dt of IGBT switching. Typical application is the SPI isolation between the inverter controller and a high-side gate driver or the Modbus interface between the inverter and an external energy meter. Recommended companions: MAX2270E (high-side gate driver), MAX14882AWE+ (isolated RS-485).
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MAX14931DASE+T — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MAX14930DASE+T | MAX14932DASE+T | MAX14130EASE+T | ISO7761DW | SI8621EC-B-IS | ADuM1410ARWZ |
|---|---|---|---|---|---|---|---|
| Package | 16-pin SOIC (wide body) | 16-pin SOIC (wide body) - same | 16-pin SOIC (wide body) - same | 16-pin SOIC (wide body) - same | 16-pin SOIC (wide body) - same | 16-pin SOIC (wide body) - same | 16-pin SOIC (wide body) - same |
| Brand | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Texas Instruments | Skyworks Solutions | Analog Devices |
| Isolation Voltage (Vrms) | 2750 V | 2750 V | 2750 V | 1000 V | 5000 V | 5000 V | 2500 V |
| Channels / Direction | 4-ch / 3-in 1-out | 4-ch / 4-in 0-out | 4-ch / 2-in 2-out | 4-ch / 3-in 1-out | 6-ch / 5-in 1-out | 2-ch / 2-in 0-out | 4-ch / 3-in 1-out |
| Maximum Data Rate | 1 Mbps | 1 Mbps | 1 Mbps | 1 Mbps | 25 Mbps | 1 Mbps | 10 Mbps |
| CMTI (typical) | 25 kV/us | 25 kV/us | 25 kV/us | 25 kV/us | 85 kV/us | 50 kV/us | 25 kV/us |
| Supply Voltage Range | 1.71 V to 5.5 V | 1.71 V to 5.5 V | 1.71 V to 5.5 V | 1.71 V to 5.5 V | 2.25 V to 5.5 V | 2.5 V to 5.5 V | 2.7 V to 5.5 V |
Principais diferenciais
- 3-in/1-out channel direction specifically suited for SPI isolation (vs MAX14930DASE+T (4-in/0-out))
- Lower power and lower cost versus 5 kVrms alternatives (vs TI ISO7761DW)
- Mature ADI/Maxim capacitive isolation technology (vs Skyworks SI8621EC-B-IS)
Notas de projeto
The wide-body SOIC-16 footprint provides the minimum 8 mm creepage needed for 2.75 kVrms reinforced insulation per IEC 60747-17. Do not place any traces, vias, or copper under the IC body that cross the isolation barrier - keep side-1 and side-2 ground planes separated by at least 8 mm. Decouple each VDD pin with a 0.1 uF X7R ceramic capacitor placed as close to the pin as possible, and add a 1 uF bulk capacitor if the supply is shared with switching converters. The exposed pad (if any) on the wide-body SOIC must be left floating or tied to side-2 ground only.
Place bypass capacitors as close as possible to each VDD pin (within 2 mm) to limit supply-induced jitter. Use X7R (not Y5V) ceramic capacitors to maintain capacitance across temperature. For very long data lines or noisy environments, add a small series resistor (22-100 ohm) at the output of the isolator to dampen reflections. The EN pin should be tied high through a 100 kohm pull-up if left unused, otherwise the outputs remain in high-impedance state.
Do not apply input signals before VDD1 is present, or before the device has stabilized - the output state during power-up is undefined. If both VDD1 and VDD2 ramp at different times, allow at least 100 us for the lower rail to settle first. A common pitfall is using the wide-body SOIC footprint with insufficient PCB-side isolation (less than 8 mm creepage), which compromises the rated isolation voltage and can fail safety testing. Verify with a HiPot tester that the assembled board withstands 2.75 kVrms for at least 1 second.
Informações de conformidade
RoHS compliant, lead-free matte tin finish per distributor listing. Halogen-free per package material declaration. Not AEC-Q100 qualified - for automotive BMS choose MAX22345 or MAX22445 AEC-Q100 Grade 1 isolators.
