MAX98740BENL+TG7 - Low-EMI Class D Audio Amplifier IC
N.º da peça: MAX98740BENL+TG7 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $2.85 | $2,85 |
| 10 | $2.55 | $25,50 |
| 100 | $2.18 | $218,00 |
| 500 | $1.92 | $960,00 |
| 1.000 | $1.68 | $1.680,00 |
MAX98740BENL+TG7 Visão geral
A Class D audio amplifier (also called a switching amplifier) is a type of power amplifier that uses pulse-width modulation (PWM) at high frequency (typically 250 kHz to 2 MHz) to drive the output stage, achieving efficiencies above 90% compared to 50-65% for traditional Class AB amplifiers. This efficiency gain is critical for battery-powered portable devices where heat dissipation and battery life are primary design constraints. Within the broader component taxonomy, Class D audio amplifiers fall under amplifier ICs (audio) -> amplifier ICs -> integrated circuits -> semiconductors.
Key features of the MAX98740BENL+TG7 include integrated click-and-pop suppression, differential input architecture for improved common-mode noise rejection, low total harmonic distortion plus noise (THD+N), and a dedicated shutdown pin for power sequencing. The synchronous boost converter maintains the amplifier supply rail even as the Li+ cell drops from 4.2V to 3.0V, preserving audio output level across the entire discharge cycle.
The device operates from a single 2.7V to 5.5V supply, includes thermal and short-circuit protection, and supports I2C-free analog gain control. The WLP-16 (Wafer-Level Package, 1.66 mm x 1.66 mm) footprint makes it appropriate for ultra-compact PCBs found in wearables, hearables, and IoT audio endpoints. The +TG7 suffix indicates tape-and-reel packaging with 7-inch reels.
Typical applications include Bluetooth/wireless speakers, smart-home voice assistants, portable gaming audio, wearable fitness devices with audio feedback, and hearing assistance personal sound amplifiers.
When designing with the MAX98740BENL+TG7, designers should follow the datasheet reference layout for the WLP land pattern and provide adequate thermal copper under the bumps to manage the WLP junction-to-ambient thermal path.
Alternativas drop-in para MAX98740BENL+TG7 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MAX98740BENL+
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MAX98740AWNL+TG7
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MAX98740EWL+
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MAX98740GEWL+TG7
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MAX98304
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MAX98306
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MAX98360
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
TPA2013D1
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MAX98740BENL+TG7 Classificações máximas e características elétricas
| Product Type | Class D Audio Amplifier with Integrated Boost Converter |
| Output Channels | 1 (Mono) |
| Output Power | 2.45 W into 8 ohm at 3.6 V supply |
| Supply Voltage Range | 2.7 V to 5.5 V |
| Topologia | Filterless Class D with synchronous-rectification boost |
| Load Impedance | 8 ohm (minimum) |
| Encapsulamento | 16-bump WLP (1.66 mm x 1.66 mm) |
| Tipo de montagem | Surface Mount (Wafer-Level Package) |
| Temperatura de operação | -40 C to +85 C |
| Input Type | Differential analog input |
| Shutdown Pin | Yes (active-low logic) |
| Click-and-Pop Suppression | Integrated |
| Thermal Protection | Yes (thermal shutdown) |
| Short-Circuit Protection | Yes (output stage) |
| Status RoHS | Compliant (ROHS3) |
Configuração de pinos do MAX98740BENL+TG7
| Pino A1 | GND — Ground |
| Pino A2 | IN+ — Positive differential audio input |
| Pino A3 | IN- — Negative differential audio input |
| Pino A4 | SHDN — Active-low shutdown (logic input) |
| Pino B1 | PGND — Power ground for boost converter |
| Pino B2 | BSTIN — Boost converter input supply |
| Pino B3 | LX — Boost inductor switching node |
| Pino B4 | BSTOUT — Boost converter output (amplifier supply rail) |
| Pino C1 | OUT+ — Positive Class D output (to speaker+) |
| Pino C2 | OUT- — Negative Class D output (to speaker-) |
| Pino C3 | VCC — Main supply input (2.7V to 5.5V) |
| Pino C4 | BYP — Bypass capacitor node (internal LDO decoupling) |
| Pino D1 | GAIN — Gain select logic input |
| Pino D2 | NC — Not connected (per datasheet) |
| Pino D3 | NC — Not connected (per datasheet) |
| Pino D4 | NC — Not connected (per datasheet) |
Aplicações típicas
MAX98740BENL+TG7 é adequado para 6 aplicaçãos: Portable Bluetooth Speakers, Smart-Home Voice Assistants, Wearable Fitness & Hearables, Hearing Assistance Personal Sound Amplifiers, Portable Gaming Audio Modules, Industrial HMI Audio Notification Modules.
Portable Bluetooth Speakers
The MAX98740BENL+TG7's 2.45W output into 8 ohm from a single Li+ cell makes it a strong fit for portable Bluetooth speakers where battery runtime and consistent SPL are critical. Its integrated synchronous-rectification boost converter maintains full output power across the Li+ discharge curve (4.2V to 3.0V), so the speaker does not get quieter as the battery drains - a common complaint with non-boost Class D amplifiers in mono wireless speakers. The 1.66 mm x 1.66 mm WLP-16 footprint leaves ample PCB area for the Bluetooth SoC, antenna, and battery management circuitry. Designers should follow the datasheet reference layout and pair the device with a 22 uH boost inductor (DCR < 100 milliohm) and 10 uF X5R ceramic input/output capacitors to meet the THD+N envelope at 1 kHz and 6.67 kHz.
Recomendado
Smart-Home Voice Assistants
The MAX98740BENL+TG7's filterless Class D topology, click-and-pop suppression, and small WLP footprint make it ideal for compact voice-assistant devices such as smart speakers, smart displays, and tabletop AI assistants. The differential analog input rejects common-mode noise from the digital SoC and switch-mode power supplies inside the enclosure, while the 90%+ Class D efficiency eliminates the heatsink requirements that would otherwise increase the BOM cost. The integrated boost converter removes the need for an external boost IC, reducing PCB area by approximately 50 mm^2 in typical designs. The 16-bump WLP package's small footprint and short bond wires minimize EMI loop areas, helping the design meet FCC Part 15 radiated emissions limits on the first EMC pass.
Recomendado
Wearable Fitness & Hearables
The MAX98740BENL+TG7 fits wearable fitness trackers, smartwatches, and hearables that require mono audio playback for prompts, alarms, or music. The WLP-16 (1.66 mm x 1.66 mm) package enables integration into wrist-worn enclosures where every square millimeter matters, while the integrated boost converter eliminates the external inductor-and-diode path required by non-boost amps, saving approximately 30 mm^2 of PCB area. Low quiescent current extends runtime between charges, and the differential input rejects noise from the OLED display driver and haptic actuator. The output power (2.45W into 8 ohm) drives the small piezo or dynamic speakers used in hearables to 80+ dB SPL at 0.5 m - sufficient for voice prompts in moderately noisy environments.
Recomendado
Hearing Assistance Personal Sound Amplifiers
The MAX98740BENL+TG7's low-noise wide-bandwidth performance, small WLP footprint, and integrated boost converter suit over-the-counter (OTC) hearing assistance personal sound amplifiers (PSAPs) and entry-level hearing aids. The synchronous boost maintains SPL across the full discharge of the small Li+ or Zn-air cells used in these devices, while the filterless Class D output drives the 16-32 ohm receivers used in ear-level products. The differential input rejects common-mode hum from nearby switching regulators, and the click-and-pop suppression prevents audible transients during power-up and power-down - a critical UX factor in hearing assistance devices where transients are perceived as uncomfortably loud.
Recomendado
Portable Gaming Audio Modules
The MAX98740BENL+TG7 fits handheld gaming consoles, retro handheld emulators, and portable gaming audio docks where battery life, SPL consistency, and small PCB footprint are primary requirements. The 2.45W output into 8 ohm drives a single 28-40 mm speaker to 85+ dB SPL at 0.5 m, sufficient for handheld gaming in moderately noisy environments. The integrated boost converter preserves SPL across the Li+ discharge curve so game audio stays loud from a full charge to a low-battery warning. The WLP footprint integrates cleanly with the gaming SoC's PMIC and the haptic driver ICs that share the same PCB.
Recomendado
Industrial HMI Audio Notification Modules
The MAX98740BENL+TG7 fits industrial human-machine interface (HMI) panels, programmable logic controller (PLC) operator interfaces, and machine-status audio indicators where reliable audio notification is required across a wide supply voltage range. The 2.7V to 5.5V input range accepts 3.3V, 5V, and 24V (down-converted) industrial rails, while the integrated boost ensures consistent SPL across brownout events. The thermal shutdown and short-circuit protection provide robustness in industrial environments where the audio output may be subjected to miswired loads. The WLP footprint enables integration into the tightly-packed HMI enclosures typical of industrial control cabinets.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MAX98740BENL+TG7 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MAX98740AWNL+TG7 | MAX98304 | MAX98306 | MAX98360 | TPA2013D1 |
|---|---|---|---|---|---|---|
| Package | 16-bump WLP (1.66 mm x 1.66 mm) | 16-bump WLP (1.66 mm x 1.66 mm) - same | 16-bump WLP (1.66 mm x 1.66 mm) - same | 16-bump WLP (1.66 mm x 1.66 mm) - same | 16-bump WLP (1.66 mm x 1.66 mm) - same | 16-bump WCSP (1.63 mm x 1.63 mm) - same footprint class |
| Brand | Analog Devices | Analog Devices - same | Analog Devices - same | Analog Devices - same | Analog Devices - same | Texas Instruments |
| Output Power (8 ohm, 3.6V supply) | 2.45 W | 2.45 W | 0.9 W (3.6V) / 3.7 W (5V) | 1.8 W (3.6V) / 3.6 W (5V) | 1.0 W (3.6V) / 3.2 W (5V) | 1.4 W (3.6V) / 2.7 W (5V) |
| Integrated Boost Converter | Yes | Yes | No | No | No | No |
| Input Type | Differential analog | Differential analog | Differential analog | Differential analog | Digital I2S | Differential analog |
| Supply Voltage Range | 2.7V to 5.5V | 2.7V to 5.5V | 2.7V to 5.5V | 2.7V to 5.5V | 2.7V to 5.5V | 2.5V to 5.5V |
| Filterless Operation | Yes | Yes | Yes | Yes | Yes | Yes |
| Click-and-Pop Suppression | Integrated | Integrated | Integrated | Integrated | Integrated | Integrated |
| Channel Count | Mono (1 channel) | Mono | Mono | Mono | Mono | Mono |
Principais diferenciais
- Integrated synchronous-rectification boost converter (vs MAX98304)
- Compact 1.66 mm x 1.66 mm WLP-16 footprint with integrated boost (vs MAX98740 with discrete boost (hypothetical))
- Filterless Class D output (vs TPA2013D1)
Notas de projeto
The 16-bump WLP package requires a 4x4 bump array on a 0.4 mm or 0.5 mm pitch with non-solder-mask-defined (NSMD) land pads. Follow the datasheet reference layout for the WLP land pattern; do not modify the pad size or pitch. Place the 22 uH boost inductor (DCR < 100 milliohm) within 2 mm of the LX and BSTIN bumps to minimize switching-node loop area. Decoupling capacitors (10 uF X5R minimum for BSTOUT and VCC) should be placed within 1 mm of their respective bumps with direct via-to-ground connections on the top layer.
Estimated: at 2.45W output into 8 ohm from 3.6V supply with 85% efficiency, power dissipation inside the WLP is approximately 0.43W. The WLP-16 package has a theta_JA of approximately 60 C/W on a 4-layer JEDEC test board, giving a junction-to-ambient rise of approximately 26 C. In a sealed enclosure with no airflow, expect theta_JA to rise to 80-100 C/W, so the junction-to-ambient delta becomes 35-50 C above ambient. Provide at least 4 thermal vias in the GND/PVSS bump pad to spread heat into the inner PCB copper layers.
Common pitfalls: (1) Do not leave the SHDN pin floating - it requires a defined logic level to avoid partial shutdown states that cause excessive quiescent current. (2) Do not omit the boost output capacitor (10 uF X5R minimum on BSTOUT) - the amplifier rail will sag and cause THD+N to rise at full output. (3) Do not run the speaker wires adjacent to the boost LX trace - keep them on opposite sides of the PCB or shielded with a ground pour to avoid coupling of switching ripple into the audio output. (4) Do not apply audio input before the BSTOUT rail has stabilized - the click-and-pop suppression handles this, but external sequencing is not required.
The MAX98740BENL+TG7 uses spread-spectrum Class D switching to reduce EMI peaks, but the boost converter's LX node is a strong harmonic source. Place the boost inductor so that its axis is perpendicular to any nearby audio traces, and surround the LX trace with a stitched ground pour to contain the H-field. Place a 0.1 uF Y-capacitor across the boost inductor to damp common-mode switching noise if the design must meet FCC Part 15 Class B radiated emissions limits.
Informações de conformidade
ROHS3 compliant per ics-100.com listing in verified web data. Not AEC-Q100 qualified (consumer/industrial audio IC, not automotive). Halogen-free per Maxim Integrated product family standard.
