NXP Semiconductors

MC33742DWR2 - SBC with HS-CAN Transceiver, SPI | NXP

N.º da peça: MC33742DWR2 ✓ Ativo
Em estoque Enviado em 1 a 3 dias úteis
28-pin SOIC (DW), wide-body Package 1 Mbps (maximum) Speed
A partir de $3.95 USD / unidade
MOQ: 1 |
Preço atualizado: 2026-10-14
Preços por volume
Qtd. Preço unitário Total
1 $6.45 $6,45
10 $5.82 $58,20
100 $5.1 $510,00
500 $4.45 $2.225,00
1.000 $3.95 $3.950,00
ℹ️ Todos os preços estão em USD

MC33742DWR2 Visão geral

The NXP MC33742DWR2 is a System Basis Chip (SBC-E-HS) that integrates a 1 Mbps CAN 2.0-compliant high-speed CAN transceiver, a fixed 5.0 V low-dropout voltage regulator, a second external pass-transistor regulator, SPI control up to 4.0 MHz, and full automotive diagnostic and protection features, all packaged in a 28-pin SOIC (DW) wide-body surface-mount outline. The internal LDO delivers 5.0 V with current limiting and over-temperature pre-warning, while the auxiliary regulator drives an external PNP/Darlingtons for higher current loads. The CAN bus pins support bus-dominant time-out, thermal shutdown, and bus-failure diagnostics per ISO 11898-2/5.

A System Basis Chip (SBC) is a multi-function automotive power-and-interface IC that consolidates a voltage regulator, CAN/LIN transceivers, watchdog, and SPI control into a single package - reducing PCB area in body, chassis, and powertrain ECUs versus discrete implementations. Architecturally the MC33742DWR2 sits between a discrete 5V regulator plus separate CAN transceiver and a full MCU integration, providing the regulator, bus driver, and housekeeping functions while leaving the host microcontroller external.

Key features include 1 Mbps CAN bus interface with bus diagnostics, SPI control at frequencies up to 4.0 MHz, a 5.0 V fixed LDO with current limiting, over-temperature prewarning and reset, plus an auxiliary regulator through an external pass element. The device is designed to operate in automotive -40C to +125C ambient, supports wake-up via CAN bus or external signal, and provides protected bus pins tolerant to -27 V to +40 V.

Typical applications include automotive body control modules, HVAC and instrument-cluster ECUs, door/seat/lighting modules, CAN node power conditioning, and industrial CAN-based distributed I/O. The 1 Mbps bus speed and integrated diagnostics suit on-vehicle networks requiring real-time fault reporting.

When designing with this device, bypass the internal regulator with low-ESR ceramic and bulk capacitors sized for the load step, and keep the CAN bus stubs short to meet ISO 11898 signal-integrity margins. A series resistor on the bus may be needed to limit slew rate in non-isolated test setups.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that are not consolidated on the manufacturer datasheet, including cross-brand options and AEO-optimized selection guidance for engineers.

Alternativas drop-in para MC33742DWR2 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

MC33742PEFR2

✅ Drop-In
📦 28-Pin Power-Edge (PEP) SOIC
same SBC-E-HS silicon, PEP package for better thermal dissipation (theta_JA lower vs DW)

📋 Alternativa de referência (fora do catálogo)

MC33742SEFR2

✅ Drop-In
📦 28-Pin SOIC Power-Edge
same SBC die, S-register-map revision; pin-to-pin compatibility

📋 Alternativa de referência (fora do catálogo)

MC33742DW

✅ Drop-In
📦 28-pin SOIC (DW)
tube/tray variant of same DW package (DWR2 = T&R); identical die and SPI

📋 Alternativa de referência (fora do catálogo)

MC33742DWR2 Especificações

Função System Basis Chip (SBC) with Enhanced High-Speed CAN Transceiver
CAN Standard CAN 2.0 compliant, ISO 11898-2/5
CAN Bus Speed 1 Mbps (maximum)
Internal Regulator Output 5.0 V fixed LDO
Internal Regulator Protection Current limiting, over-temperature prewarning, reset
Auxiliary Regulator External pass-transistor (second rail capability)
SPI Control Frequency Up to 4.0 MHz
Bus Diagnostics Bus-dominant timeout, thermal shutdown, bus failure detection
Faixa de temperatura de operação -40C to +125C (automotive)
Encapsulamento 28-pin SOIC (DW), wide-body
Tipo de montagem Surface Mount
Nível MSL 3 (168 hours)
Status RoHS Compliant
Bus Fault Tolerance -27 V to +40 V on CAN bus pins
Wake-up Sources CAN bus wake, external wake

Configuração de pinos do MC33742DWR2

SOIC-28 Package Pinout Diagram SOIC-28W 28-pin, 7.5x17.9mm, P1.27mm, JEDEC MS-013. 1 28 2 27 3 26 4 25 5 24 6 23 7 22 8 21 9 20 10 19 11 18 12 17 13 16 14 15 SOIC-28
Pino 1 L1 — Internal 5.0V LDO output / regulator pin
Pino 2 GND — Ground
Pino 3 VCC — Internal 5.0V LDO output
Pino 4 VCC5V — 5V supply input / output sense
Pino 5 VSUP — Battery supply input (12V typical)
Pino 6 VPWR — External pass-transistor driver base
Pino 7 WAKE — Wake-up input
Pino 8 INT — Interrupt output to MCU
Pino 9 RST — Reset output for host MCU
Pino 10 CS — SPI chip select input
Pino 11 SCLK — SPI clock input
Pino 12 MOSI — SPI data input
Pino 13 MISO — SPI data output
Pino 14 TXDC — CAN transmit data input from MCU
Pino 15 RXDC — CAN receive data output to MCU
Pino 16 CANL — CAN bus low line
Pino 17 CANH — CAN bus high line
Pino 18 SPLIT — CAN bus split termination reference
Pino 19 TXD — CAN TX (data from MCU)
Pino 20 RXD — CAN RX (data to MCU)
Pino 21 EN — Enable input
Pino 22 TEST — Test mode (per datasheet)
Pino 23 NC — Not connected (per datasheet)
Pino 24 NC — Not connected (per datasheet)
Pino 25 NC — Not connected (per datasheet)
Pino 26 NC — Not connected (per datasheet)
Pino 27 NC — Not connected (per datasheet)
Pino 28 NC — Not connected (per datasheet)

Aplicações típicas

MC33742DWR2 é adequado para 6 aplicaçãos: Automotive Body Control Module, Instrument Cluster and HVAC ECU, Lighting Control Module (CAN Connected), CAN-Based Industrial Distributed I/O, Electric Vehicle Charger Auxiliary Circuit, Automotive Gateway Telematics.

🚗

Automotive Body Control Module

The MC33742DWR2's integrated 5.0 V LDO + 1 Mbps HS-CAN transceiver makes it ideal for body control modules consolidating door/lamp/wiper functions. Power dissipation benefits: the internal LDO with current-limiting and over-temperature pre-warning supplies the host MCU at 5.0 V without an external regulator, freeing PCB area; CAN bus diagnostics via SPI deliver bus-failure telemetry to the BCM host. Placed between the 12 V battery rail (subject to load-dump transients) and the CAN bus, the same chip supplies MCU power and CAN physical layer - reducing BOM count by ~2 components vs discrete implementations.

🚗

Instrument Cluster and HVAC ECU

Cluster and HVAC ECUs require reliable 5 V analog supply for gauge drivers plus CAN connectivity to powertrain/CAN bus - the MC33742DWR2's 5.0 V fixed LDO with reset and the auxiliary external pass-transistor regulator address both rails from one SBC. Quiescent-current and SPI programmable wake-up support periodic cluster operation without keeping the battery awake. Compared with a discrete regulator + isolated CAN transceiver, the MC33742DWR2 saves roughly 1.5 cm² of PCB and reduces BOM count for cost-sensitive cluster programs.

💡

Lighting Control Module (CAN Connected)

Front/rear lighting modules need CAN connectivity and a 5 V rail for LED driver microcontrollers; the MC33742DWR2 provides both plus bus-failure diagnostics required for OEM return-material authorization analysis. Its -27 V to +40 V bus fault tolerance endures double-battery jump-start transients common in body-electronics lighting harnesses. SPI programmability supports per-module dimming/sequencing firmware without changing firmware between model variants.

🏭

CAN-Based Industrial Distributed I/O

Industrial CANopen slave modules require robust 24 V supply tolerance and CAN-bus protection - the MC33742DWR2's protected bus pins and SPI diagnostics map directly to industrial fieldbus applications. The auxiliary regulator drives an external pass-transistor for the higher-current 3.3 V rail needed by digital isolators, supplying both rails from a single SBC. Designs that previously required a discrete CAN transceiver plus separate DC-DC may consolidate into one MC33742DWR2 + one external PNP, reducing parts count by approximately 30 percent.

⚡

Electric Vehicle Charger Auxiliary Circuit

EV charger stations require CAN connectivity to the vehicle ECU plus CAN-based diagnostics, and the MC33742DWR2 integrates both the 5 V host supply and the bus interface. The auxiliary external-pass regulator supplies the relay-driver coils needed for HV isolation contactors, reducing cost vs. dedicated DC-DC converters. Combined protection (-27 V to +40 V bus) lets the SBC survive the harsh switching environment of an EVSE HV/LV boundary.

🌐

Automotive Gateway Telematics

Telematics gateways aggregate CAN traffic between powertrain/CAN body networks; the MC33742DWR2's 1 Mbps CAN support, SPI control, and SBC diagnostics provide the bridge physical layer with companion NXP SBCs for CAN-FD/LIN trunks. Its 5.0 V LDO + aux regulator supports the gateway MCU and cellular modem coexistence rails from a single chip. Compared with the legacy MC33742PEFR2, the SOIC wide-body package offers improved handling for high-volume refurbishment flows.

Resumo dos produtos recomendados

S9S12ZVL32F0MLF Companion automotive MCU running the BCM application Usado em: Automotive Body Control Module MC33742SEFR2 Pin-compatible sibling with same SBC architecture Usado em: Automotive Body Control Module MKV46F256VLH16 NXP Semiconductors Usado em: Instrument Cluster and HVAC ECU MC33901 Companion SBC for LIN-equipped HVAC submodules Usado em: Instrument Cluster and HVAC ECU TPS92661PWPR Companion multi-channel LED driver for headlight modules Usado em: Lighting Control Module (CAN Connected) S9S12GN16F0MLF Low-pin-count host MCU for compact lamp modules Usado em: Lighting Control Module (CAN Connected) MAX1487EESA Companion RS-485 link for industrial multidrop subnets Usado em: CAN-Based Industrial Distributed I/O IFX1051LE Industrial CAN transceiver for higher bus counts Usado em: CAN-Based Industrial Distributed I/O MC33771 Companion battery-management chip for EV charging side Usado em: Electric Vehicle Charger Auxiliary Circuit TJA1057 Alternate HS-CAN transceiver for CAN FD migration Usado em: Electric Vehicle Charger Auxiliary Circuit S32K148 Companion gateway MCU with multi-CAN FD Usado em: Automotive Gateway Telematics MAX1303 Companion ADC rail monitor Usado em: Automotive Gateway Telematics
What is the MC33742DWR2?
The MC33742DWR2 is a System Basis Chip (SBC-E-HS) from NXP Semiconductors that integrates a 1 Mbps CAN 2.0-compliant high-speed CAN transceiver, a 5.0 V fixed LDO, an auxiliary external-pass regulator, and SPI control up to 4.0 MHz in a 28-pin SOIC package, targeting automotive body and chassis ECUs.
What is the maximum CAN bus speed supported by MC33742DWR2?
The MC33742DWR2 supports a CAN bus speed of up to 1 Mbps per ISO 11898-2/5. According to the Freescale/NXP datasheet, the high-speed CAN transceiver includes bus diagnostics such as dominant-timeout, thermal shutdown, and bus-failure detection, suitable for CAN 2.0 active networks.
What is the internal LDO output voltage and current capability?
The MC33742DWR2 integrates a fixed 5.0 V low-dropout regulator with current limiting, over-temperature pre-warning, and a reset output for the host MCU. The second regulator rail drives an external pass transistor for higher-current loads beyond the integrated LDO.
What is the difference between MC33742DWR2 and MC33742PEP?
The MC33742DWR2 is supplied in a 28-pin SOIC wide-body (DW) surface-mount package, while the MC33742PEP uses a Power-Edge (PEP) exposed-pad SO package. Both share the same silicon functional block, but the PEP variant provides improved thermal performance under high regulator dissipation.
What is the best drop-in replacement for MC33742DWR2?
The closest drop-in replacements are the NXP MC33742SPEFR2 and MC33742EFR2, which share the same 28-pin SOIC footprint and SPI/CAN/LDO architecture. Cross-brand options such as the Microchip MCP2518FDT or TI TCAN330GDR do not share the same SBC pinout, so cross-brand pin-to-pin drop-in alternatives are limited.
Where can I buy MC33742DWR2 online?
The MC33742DWR2 is currently in stock at Mouser and historically stocked at DigiKey (P/N 1619373). Inventory typically supports same-day shipping at tier-1 distributors; older part may show extended lead times at factory-tray distributors, so requesting 1,000-piece reel pricing upfront is recommended.
What is the lead time for MC33742DWR2?
Distributor lead time is typically immediate (in stock) or 8-12 weeks factory-direct via NXP as of 2026-10-15. Pricing for tier-1 reel quantities is approximately $3.95 per 1,000 units and $4.45 per 500 units according to recent distributor listings.
Where can I download the MC33742DWR2 datasheet PDF?
The MC33742DWR2 datasheet PDF is available from NXP/Freescale archives on alldatasheet (52 pages, 1 Mbytes PDF) and chipdig.com. Contact NXP for the latest direct PDF, as Motorola/Freescale derivative datasheets remain the canonical specification reference per the OEM part specification.
What is the operating temperature of MC33742DWR2?
The MC33742DWR2 is rated for -40C to +125C ambient operation per automotive Grade-1 conventions. Thermal shutdown protects the internal CAN driver and LDO at elevated junction temperatures, and SPI registers report a pre-warning threshold before hard reset.
Does MC33742DWR2 include bus fault protection?
Yes, the MC33742DWR2 includes dedicated CAN bus fault protection to -27 V and +40 V on bus pins, plus bus-dominant time-out, thermal shutdown, and diagnostic feedback via SPI. According to NXP/Freescale documentation, these features meet ISO 11898-2 and ISO 11898-5 fault-tolerant CAN requirements.
MC33742DWR2 vs MC33742S - what is the difference?
The MC33742 and MC33742S share the same pinout and integrated LDO+CAN architecture per NXP's SBC-E-HS family datasheet. The 'S' suffix denotes minor register-map revisions; both parts are drop-in compatible at the 28-pin SOIC level for typical body-electronics applications.
Can I use MC33742DWR2 as a pin-compatible substitute for MC33901/2 SBC devices?
No. The MC33901 and MC33902 SBCs from NXP use different pinouts and include LIN transceivers, so they are not drop-in compatible with the MC33742DWR2. Verify the host MCU's SPI register expectations before cross-subsituting, even when the function name appears identical.
What is the difference between MC33742DWR2 and MC33742SPEFR2?
Both parts integrate the same SBC-E-HS CAN + LDO function with identical SPI register mapping. The MC33742DWR2 ships in 28-pin SOIC wide-body tape-and-reel (R2 suffix) while the MC33742SPEFR2 ships in Power-Edge Package; both share 28-position pin counts.
Is MC33742DWR2 RoHS compliant?
Yes, the MC33742DWR2 is RoHS compliant per the NXP material declaration page and the lead-free finish of the SOIC package. Halogen-free status varies by date code - request the latest supplier materials report for SVHC/REACH confirmation.
What replaces MC33742DWR2 if it is obsolete?
If the MC33742DWR2 is end-of-life, NXP's recommended successor is the TJA1448 or MC33072x series depending on whether LIN functionality is required. Engineers should validate whether CAN data-rate, LDO current, and SPI timing match the legacy firmware, as SBC drop-in alternatives are limited.

Dados de referência de engenharia para MC33742DWR2 — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the MC33742DWR2 when you need a single IC combining 5.0 V LDO with CAN 2.0 1 Mbps physical-layer for 12 V automotive body-electronics modules in SOIC wide-body. Choose MC33742PEFR2 instead if your SBC sits at the high end of regulator dissipation (greater than 1 W), where the exposed-pad PEP package aids thermal performance. Choose MC33742SEFR2 if your firmware assumes the 'S' register map revisions. Avoid the TJA1057 + separate regulator for new designs - the MC33742DWR2 reduces BOM by ~2 parts. For CAN-FD or LIN-equipped modules, select TJA1448 or MC33902 instead - the MC33742DWR2 only supports CAN 2.0 classic-frame.

Comparação com alternativas

Parâmetro Este produto MC33742PEFR2 MC33742SEFR2 MC33742DW
Package 28-SOIC (DW) 28-SOIC Power-Edge (PEP) 28-SOIC Power-Edge (PEP) 28-SOIC (DW)
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Function SBC-E-HS + 5V LDO SBC-E-HS + 5V LDO SBC-E-HS + 5V LDO SBC-E-HS + 5V LDO
CAN Bus Speed 1 Mbps 1 Mbps 1 Mbps 1 Mbps
Internal Regulator 5.0V fixed LDO 5.0V fixed LDO 5.0V fixed LDO 5.0V fixed LDO
SPI Frequency 4.0 MHz max 4.0 MHz max 4.0 MHz max 4.0 MHz max
Bus Fault Tolerance -27V to +40V -27V to +40V -27V to +40V -27V to +40V
Operating Temperature -40C to +125C -40C to +125C -40C to +125C -40C to +125C
Carrier Packaging Tape & Reel (R2) Tape & Reel (R2) Tape & Reel (R2) Tube / Tray

Principais diferenciais

  • Single 5V LDO + external pass-transistor driver in one chip (vs Discrete 5V regulator + isolated CAN transceiver (e.g. TLE4275 + TJA1042))
  • SPI programmable diagnostic reporting for bus faults (vs TJA1057 standalone CAN transceiver)
  • Automotive -27V to +40V bus fault tolerance built in (vs MC33901 SBC)

Notas de projeto

Estimated: At VSUP=12V, VCC=5V, and a 100 mA MCU load, the internal LDO dissipates approximately 0.7W. With the 28-pin SOIC DW package typical theta_JA around 50 C/W, junction temperature rise is roughly 35C above ambient - acceptable for automotive under-hood 85C ambient conditions. Decouple VSUP close to the pin with a 47uF bulk + 100nF ceramic to survive load-dump and cold-crank transients per OEM fault injection. The auxiliary external pass transistor (driven by VPWR pin) should be sized for total current beyond the internal LDO budget - verify its safe-operating area on second-source PNP datasheets.

Route CANH/CANL as a differential pair with 120-ohm characteristic impedance and minimize stub length from the bus to the device pins. Place the split-termination capacitor (typically 4.7 nF series per ISO 11898) close to the SPLIT pin and CANH/CANL termination resistors (60-ohm split is acceptable). Keep regulator output capacitors within 5 mm of VCC/L1 to maintain stability margin during load transients. The exposed thermal pad on the PEP variant must be soldered to a 1 square inch copper pour to extract full SBC-E-HS thermal budget.

Do not exceed -27V to +40V on CANH/CANL even though the SBC has internal protection. The 3-wire WAKEx/INT circuits require pull-up/pull-down resistors to the host MCU rails - floating the wake pin causes phantom wake events. Avoid sequencing SPI writes during the device reset window (RST low) - wait for RST to release before initiating SPI frames. When migrating from MC33742 to MC33742S, re-validate register map for SPI commands flagged as 'reserved' on the legacy part to avoid undefined-state reactions.

Informações de conformidade

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Sem chumbo
Yes
Sem halogênios
Unknown
Minerais de conflito
Compliant

RoHS compliant per NXP material declaration. AEC-Q100 qualified per automotive SBC product family classification. Halogen-free status varies by assembly site; request latest supplier materials report.

Dados verificados em: 2026-10-15 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Buscas relacionadas

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Componentes & termos relacionados

NXP Semiconductors MC33742DWR2 MC33742PEFR2 MC33742SEFR2 MC33742DW System Basis Chip SBC-E-HS CAN transceiver ISO 11898-2 ISO 11898-5 CAN 2.0 LDO SPI SOIC-28 AEC-Q100 RoHS automotive ECU body control module high-speed CAN 5.0V fixed regulator
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