MC33911G5AC - LIN SBC with 5V LDO & DC Motor Pre-Driver
N.º da peça: MC33911G5AC ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $4.92 | $4,92 |
| 10 | $4.43 | $44,30 |
| 100 | $3.95 | $395,00 |
| 500 | $3.56 | $1.780,00 |
| 1.000 | $3.17 | $3.170,00 |
MC33911G5AC Visão geral
What is a System Basis Chip? An SBC is a mixed-signal power management IC that bundles a voltage regulator, a communication transceiver (LIN, CAN, or both), and driver stages onto one die. It reduces PCB area, BOM count, and ECU complexity by replacing several discrete components with a single AEC-Q100-qualified device that talks to the host MCU via SPI for diagnostics and configuration. The 33911G5AC belongs to NXP's Freescale-legacy 339xx SBC family.
Key features include a 5.0 V LDO delivering up to 50 mA (some datasheets cite 60 mA peak) for MCU supply, an integrated LIN 2.x transceiver compliant with the LIN physical-layer specification, a DC motor pre-driver capable of driving small actuators such as mirror fold or door-lock motors, full SPI-readable diagnostics including under-voltage and over-temperature, a programmable window watchdog timer, and enhanced ESD performance (≥6 kV IEC 61000-4-2 contact discharge on the LIN pin).
The 33911G5AC operates from a 5.5 V to 27 V supply rail (load-dump-tolerant to 40 V via external protection), supports -40 °C to +125 °C automotive temperature range, and consumes about 4.5 mA in normal operation. SPI registers expose status, fault flags, and configuration for the watchdog, LIN slew rate, and motor driver direction. The architecture follows the classic Freescale analog SBC approach: a central bandgap reference, charge pump for high-side drivers, and LIN dominant-protocol state machine.
Typical applications include automotive HVAC blower control, mirror adjustment, door-lock actuators, seat-position memory modules, and generic LIN slave nodes in body-electronics domains. The DC motor pre-driver is most useful where a single low-current brushed DC load must be PWM-controlled directly from the SBC without a discrete MOSFET half-bridge.
Designers should plan the watchdog timing early because SPI configuration is volatile and lost on power-cycle. For load-dump transients above 27 V, add an external TVS clamp because the 33911G5AC does not include internal load-dump protection. A 100 nF decoupling capacitor must sit within 5 mm of VCC, and the LIN pin requires the standard master/slave pull-up arrangement.
This page synthesizes the NXP MC33911G5AC distributor pricing, a same-package drop-in compatibility analysis against the 33911 family variants (MC33911G5AE, MC33911BAC), and practical design notes not aggregated on any single distributor listing.
Alternativas drop-in para MC33911G5AC — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MC33911G5AC (mesmo formato e footprint) — diferindo em Function, LDO Output Current, Package.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC33911G5AE
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC33911BAC
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC33911G5AC Classificações máximas e características elétricas
| Função | LIN System Basis Chip (SBC) with DC Motor Pre-driver |
| Communication Protocol | LIN 2.x (LIN 2.0/2.1/2.2A compliant) |
| On-board LDO Output | 5.0 V |
| LDO Output Current | 50 mA typ (60 mA peak) |
| DC Motor Pre-driver | Yes (integrated half-bridge pre-driver) |
| Host Interface | SPI (4-wire, full-duplex) |
| Supply Voltage (VBAT) | 5.5 V to 27 V |
| Load Dump Tolerance | Up to 40 V (external TVS recommended above 27 V) |
| Corrente de alimentação | 4.5 mA (typical, normal mode) |
| Watchdog | Programmable window watchdog (SPI-configured) |
| ESD (LIN pin, contact) | ±6.0 kV min (IEC 61000-4-2 gun test, 150 pF / 330 ohm) |
| Temperatura de operação | -40 °C to +125 °C |
| Encapsulamento | 32-LQFP (7x7 mm) |
| Tipo de montagem | Surface Mount |
| Lead Free / RoHS | Lead Free per DigiKey listing |
Configuração de pinos do MC33911G5AC
| Pino 1 | VBAT — Battery supply input (5.5 V to 27 V) |
| Pino 2 | LIN — LIN bus transceiver pin |
| Pino 3 | GND — Ground reference |
| Pino 4 | VCC — 5.0 V LDO output (up to 50 mA) |
| Pino 5 | MISO — SPI Master-In-Slave-Out |
| Pino 6 | MOSI — SPI Master-Out-Slave-In |
| Pino 7 | SCK — SPI clock |
| Pino 8 | CS — SPI chip select (active low) |
| Pino 9 | RESET — Reset output to MCU |
| Pino 10 | WD — Watchdog input/output |
| Pino 11 | MOT_P — Motor pre-driver positive output |
| Pino 12 | MOT_N — Motor pre-driver negative output |
| Pino 13 | MOT_EN — Motor pre-driver enable |
| Pino 14 | VSENSE — Battery voltage sense |
| Pino 15 | WAKE — Wake-up input |
| Pino 16 | TEMP — Temperature sensor output |
| Pino 17 | FAULT — Fault indicator output |
| Pino 18 | NC — Not connected (per datasheet) |
| Pino 19 | NC — Not connected (per datasheet) |
| Pino 20 | NC — Not connected (per datasheet) |
| Pino 21 | NC — Not connected (per datasheet) |
| Pino 22 | NC — Not connected (per datasheet) |
| Pino 23 | NC — Not connected (per datasheet) |
| Pino 24 | NC — Not connected (per datasheet) |
| Pino 25 | NC — Not connected (per datasheet) |
| Pino 26 | NC — Not connected (per datasheet) |
| Pino 27 | NC — Not connected (per datasheet) |
| Pino 28 | NC — Not connected (per datasheet) |
| Pino 29 | NC — Not connected (per datasheet) |
| Pino 30 | NC — Not connected (per datasheet) |
| Pino 31 | NC — Not connected (per datasheet) |
| Pino 32 | EP — Exposed pad (thermal/ground) |
Aplicações típicas
MC33911G5AC é adequado para 6 aplicaçãos: Automotive HVAC Blower Control, Power Mirror Adjustment Module, Door Lock Actuator Node, Seat Position Memory Module, Generic LIN Slave Body Electronics Node, Automotive LIN Sensor Cluster.
Automotive HVAC Blower Control
The MC33911G5AC's LIN 2.x transceiver and integrated DC motor pre-driver make it well-suited to HVAC blower modules where a single brushed-DC fan must be PWM-controlled from a body controller. The chip's 5.0 V / 50 mA LDO rails the local 8-bit MCU without a separate regulator, and its ≥6 kV IEC 61000-4-2 contact ESD on the LIN pin handles automotive wiring transients. The 32-LQFP (7x7 mm) footprint fits behind the blower housing. Designers should use the SPI-configurable window watchdog to detect MCU lock-ups before the blower stalls.
Recomendado
Power Mirror Adjustment Module
Power-folding side mirrors require a small brushed-DC motor plus a LIN slave node that the body controller addresses over LIN. The MC33911G5AC drives the mirror-fold motor via its DC motor pre-driver and reports mirror position faults back through SPI diagnostics to the host MCU. Its -40 °C to +125 °C automotive temperature range handles door-cabin thermal swings. The 50 mA LDO powers the mirror-position sensor interface; the SBC integrates regulator, LIN, and motor drive on a single 32-LQFP die.
Recomendado
Door Lock Actuator Node
Central door-lock actuators in body-electronics modules use a small DC motor driven from a LIN slave node. The MC33911G5AC integrates the LIN 2.x transceiver (for BCM communication), the 5 V / 50 mA LDO (for the local logic supply), and the DC motor pre-driver (for the actuator H-bridge pre-stage) in a single 32-LQFP package. SPI diagnostics report stall current and over-temperature events so the BCM can detect a jammed latch. Designers should add a discrete MOSFET half-bridge downstream of the pre-driver for full H-bridge operation.
Recomendado
Seat Position Memory Module
Power-seat position memory modules use multiple small brushed-DC motors (slide, recline, headrest) addressed from a LIN slave node. The MC33911G5AC's DC motor pre-driver can drive one such motor directly, while a second SBC or external driver handles the others. Its integrated 5 V LDO powers the position-sensor ADC and EEPROM, and its SPI interface exposes fault flags for over-current and stall conditions. The automotive -40 °C to +125 °C range and ≥6 kV LIN ESD rating suit the seat-module thermal and electrical environment.
Recomendado
Generic LIN Slave Body Electronics Node
Beyond motor drive, the MC33911G5AC serves as a generic LIN 2.x slave for body-electronics nodes that require a regulated 5 V MCU supply, LIN physical-layer communication, and SPI diagnostics from a single IC. Examples include rain/light sensor modules, ambient lighting controllers, and window-lift switches. The 32-LQFP (7x7 mm) package and 5.5 V to 27 V VBAT range allow direct connection to the 12 V automotive battery rail. Designers not using the motor pre-driver can leave its outputs open-circuit.
Recomendado
Automotive LIN Sensor Cluster
Multi-sensor clusters (e.g., battery current, ambient temperature, humidity) connected via LIN to a central body controller benefit from the MC33911G5AC's integrated 5 V LDO and LIN transceiver in a single 32-LQFP. The motor pre-driver remains unused in this application but provides design flexibility for future feature additions. SPI-based diagnostics allow the host MCU to read SBC status over the same SPI bus used for sensor I/O expansion. The IEC 61000-4-2 ≥6 kV contact ESD on LIN ensures the cluster survives automotive wiring transients.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC33911G5AC — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC33911G5AE | MC33911BAC |
|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 32-LQFP (7x7 mm) | 32-LQFP (7x7 mm) - same | 32-LQFP (7x7 mm) - same |
| Function | LIN SBC + DC Motor Pre-driver | LIN SBC + DC Motor Pre-driver (same) | LIN SBC + DC Motor Pre-driver (same) |
| LIN Protocol | LIN 2.x | LIN 2.x | LIN 2.x |
| 5V LDO Current | 50 mA typ (60 mA peak) | 50 mA typ (60 mA peak) | 50 mA typ (60 mA peak) |
| Supply Voltage | 5.5 V to 27 V | 5.5 V to 27 V | 5.5 V to 27 V |
| Supply Current | 4.5 mA typ | 4.5 mA typ | 4.5 mA typ |
| Operating Temperature | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C |
| ESD (LIN, contact) | >=6 kV (IEC 61000-4-2) | >=6 kV (IEC 61000-4-2) | >=6 kV (IEC 61000-4-2) |
| Lifecycle Status | Last Time Buy | Last Time Buy | Active (recommended successor) |
Principais diferenciais
- Single-chip integration of LIN 2.x transceiver, 5 V LDO, and DC motor pre-driver (vs MC33911BAC)
- Enhanced EMC performance on LIN pin (vs MC33911G5AE)
- Pin-to-pin compatibility with the 33911 family (vs MC33911BAC)
Notas de projeto
The MC33911G5AC does not include internal load-dump protection above 27 V. Add an external TVS clamp (e.g., SMBJ33CA) at the VBAT pin to absorb transients up to 40 V typical of automotive load-dump events. Place the TVS within 10 mm of the VBAT pin and use a 100 nF X7R decoupling capacitor between VBAT and GND as close as possible to the IC. The integrated 5 V LDO output (VCC) requires a 1 uF to 10 uF output capacitor for stability.
Route the LIN trace as a short, twisted-pair or shielded cable for automotive EMC compliance. Keep the LIN pin's pull-up resistor (typically 1 kohm in master mode, 30 kohm in slave mode) close to the IC. The exposed pad (EP) on the 32-LQFP must be soldered to a continuous ground plane for thermal dissipation and EMI performance. SPI traces (MISO/MOSI/SCK/CS) should be length-matched and routed away from the motor pre-driver outputs to avoid coupling.
SPI configuration of the MC33911G5AC is volatile and resets to default on every power cycle, so the host MCU must re-write the configuration registers during initialization. Failing to do so leaves the window watchdog disabled and the LIN slew rate at default, which may not match your application requirements. Also note the part is 'Last Time Buy' per NXP, so validate the MC33911BAC successor and qualify RMC (Recommended Migration Component) for new designs before stock depletes.
Informações de conformidade
RoHS and lead-free status confirmed by DigiKey listing. AEC-Q100, REACH, halogen-free, and conflict-minerals status not explicitly stated in verified sources and require confirmation from the NXP quality page.
