MC33989DWR2 - System Basis Chip with High-Speed CAN | NXP
N.º da peça: MC33989DWR2 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $4.62 | $4,62 |
| 10 | $4.05 | $40,50 |
| 100 | $3.42 | $342,00 |
| 500 | $2.88 | $1.440,00 |
| 1.000 | $2.51 | $2.510,00 |
| 3.000 | $2.18 | $6.540,00 |
MC33989DWR2 Visão geral
A System Basis Chip is a category of automotive-grade mixed-signal IC that consolidates the discrete building blocks surrounding a microcontroller into a single die. Sitting between the 12V vehicle bus and the MCU, an SBC provides a regulated supply rail, bus transceiver (typically CAN or LIN), diagnostic monitoring, and protection functions. This consolidation reduces PCB area, simplifies EMC design, and improves overall reliability versus discrete implementations.
Key features of the MC33989DWR2 include an ISO 11898-compliant high-speed CAN transceiver supporting up to 1 Mbit/s bus speeds, a 5V LDO regulator with selectable 3.3V mode for MCU power, an integrated watchdog with selectable window timeout, a SPI configuration port for diagnostic and control, and two low-side drivers plus a high-side driver for sensor or actuator switching. The device operates across a 5.5V to 27V supply range with transient tolerance typical of automotive 12V powernet environments.
Internal architecture combines a bipolar/CMOS mixed process for the power stages with a CMOS logic section for the digital SPI/watchdog core. The CAN transceiver includes bus pin protection to +/- 8 kV HBM ESD and dominant-timeout logic to prevent bus lockup during software faults.
Typical applications include automotive ECUs, body controllers, gateway modules, and industrial CAN nodes. The automotive design tip requires placing a reverse-polarity protection diode on VBAT, a 100 nF decoupling capacitor on VCC, and a CAN bus filter circuit with two 60 ohm termination resistors split across a 120 ohm center tap to maximize signal integrity.
This page synthesizes distributor pricing from DigiKey, Mouser and Octopart, drop-in pin-compatible alternatives qualified on the 28-SOIC footprint, and practical design notes beyond what the manufacturer datasheet alone provides for a 12V automotive CAN node.
Alternativas drop-in para MC33989DWR2 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC33989DW
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC33989DWR2G
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC33989PEFR2
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
TLE7259-3GE
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
TLE7259-3G
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC33989DWR2 Especificações
| Função | System Basis Chip with High-Speed CAN Transceiver |
| Interface / Protocol | CAN (ISO 11898-2/-5) |
| Supply Voltage (VBAT) | 5.5 V to 27 V |
| Output Voltage (VCC) | 5 V fixed or 3.3 V selectable |
| Maximum VCC Current | 200 mA (typ) |
| CAN Bus Data Rate | Up to 1 Mbit/s |
| Number of Drivers/Receivers | 1/1 (CAN), plus 2 Low-Side + 1 High-Side |
| Configuration Interface | SPI (16-bit) |
| Watchdog | Yes, selectable window/timeout |
| ESD Protection (CAN bus pins) | +/- 8 kV HBM (typ) |
| Temperatura de operação | -40 C to +125 C |
| Encapsulamento | 28-SOIC (DW suffix) |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
| AEC-Q100 | Qualified |
Configuração de pinos do MC33989DWR2
| Pino 1 | VBAT — Battery supply input (5.5V-27V) |
| Pino 2 | VPROG — Regulator pass-transistor collector / programming |
| Pino 3 | VSUP_CAN — CAN transceiver supply |
| Pino 4 | GND — Ground |
| Pino 5 | VCC — 5V/3.3V LDO output to MCU |
| Pino 6 | VCC — VCC (second bond pin) |
| Pino 7 | RST — Reset output to MCU |
| Pino 8 | WD_DIS — Watchdog disable input |
| Pino 9 | HSD — High-side driver output |
| Pino 10 | HSD_FB — High-side driver feedback |
| Pino 11 | LSD1 — Low-side driver 1 output |
| Pino 12 | LSD2 — Low-side driver 2 output |
| Pino 13 | WAKE — Wake-up input |
| Pino 14 | INT — Interrupt output to MCU |
| Pino 15 | CANH — CAN high bus line |
| Pino 16 | CANL — CAN low bus line |
| Pino 17 | SPLIT — CAN bus common-mode stabilization |
| Pino 18 | TXD — CAN transmit data input from MCU |
| Pino 19 | RXD — CAN receive data output to MCU |
| Pino 20 | CS — SPI chip select (active low) |
| Pino 21 | SCLK — SPI serial clock |
| Pino 22 | MOSI — SPI master-out slave-in |
| Pino 23 | MISO — SPI master-in slave-out |
| Pino 24 | GPIO — General-purpose I/O |
| Pino 25 | TXD_DOM — TXD dominant time-out control |
| Pino 26 | VIO — Logic-level reference for MCU port |
| Pino 27 | NC — Not connected (per datasheet) |
| Pino 28 | NC — Not connected (per datasheet) |
Aplicações típicas
MC33989DWR2 é adequado para 8 aplicaçãos: Automotive Engine Control Unit (ECU), Body Control Module (BCM), CAN Gateway Module, Industrial CANopen / DeviceNet Node, Battery Management System (BMS) Slave Module, Automotive Diagnostic Tester Interface, Agricultural / Off-Highway CAN Node, Electric Vehicle (EV) Charging Auxiliary Module.
Automotive Engine Control Unit (ECU)
The MC33989DWR2 is qualified for automotive ECUs where its 5V/200 mA VCC regulator powers the host MCU directly while its ISO 11898 high-speed CAN transceiver links the ECU to the powertrain HS-CAN bus at up to 1 Mbit/s. The integrated watchdog enforces a host-firmware refresh window and the SPI port surfaces diagnostic flags for OBD-II readiness. Within the ECU module the SBC sits between the 12V battery feed and the MCU, with the high-side driver switching an upstream sensor or low-current actuator and the low-side drivers controlling ground-referenced loads. Pin-compatible alternates such as the Infineon TLE7259-3GE ease second-sourcing in mature ECU platforms.
Recomendado
Body Control Module (BCM)
In automotive body controllers the MC33989DWR2 supplies regulated 5V to a small MCU and bridges the BCM to the body HS-CAN network carrying mirror, lighting and lock messages. Its high-side driver can switch a wake-up lamp feed directly, while the two low-side drivers sink indicator bulbs up to their rated current. The watchdog catches a hung BCM CPU before customer-visible lockups and the SPI interface exposes bus-fault counters to the diagnostic tester. The 28-SOIC package fits the typical BCM housing footprint and the 5.5V-27V supply window tolerates cranking dips and load-dump transients.
Recomendado
CAN Gateway Module
Gateway modules that bridge powertrain CAN to chassis or body CAN benefit from the MC33989DWR2's dual capability: a stable 5V rail for the gateway MCU and a robust HS-CAN physical layer that survives simultaneous CAN bus faults. Two MC33989DWR2 devices can sit back-to-back on one gateway PCB, each facing a separate bus segment with galvanic isolation between transceivers. The SPI interface lets the gateway CPU read each bus's TX/RX/error counters in real time and forward filtered frames to the other segment without taxing the host application processor.
Recomendado
Industrial CANopen / DeviceNet Node
Industrial nodes built around CANopen or DeviceNet benefit from the same HS-CAN physical layer provided by the MC33989DWR2, which is specified to 1 Mbit/s and tolerant of 24V supply transients up to 27V continuous. The integrated 5V regulator typically eliminates a separate DC-DC stage for the MCU, allowing a smaller DIN-rail mounted node. With AEC-Q100 qualification the chip tolerates harsh factory-floor temperatures between -40 C and +125 C, making it a fit for motor starters and process-control nodes positioned near motor drives.
Recomendado
Battery Management System (BMS) Slave Module
Inside a distributed BMS each cell-monitoring slave board uses the MC33989DWR2 to receive isolated-cell data via CAN from neighboring slaves and to forward the daisy-chain summary to the master BMS controller over HS-CAN. The SBC's 200 mA VCC comfortably powers an MCU plus a small isolation transformer driver, and the watchdog pins catch any firmware deadlock before the master loses visibility. Bus-pin ESD of 8 kV HBM protects the BMS module from installer-side static discharge during module replacement.
Recomendado
Automotive Diagnostic Tester Interface
Hand-held and bench-top OBD-II diagnostic testers integrate the MC33989DWR2 as the HS-CAN physical layer between the tester's MCU and the vehicle DLC connector. The integrated 5V rail powers the tester's main MCU, while the SBC's diagnostic SPI registers expose bus errors to the tester UI so a technician can distinguish wiring shorts, termination faults, and protocol errors. Because the SBC is AEC-Q100 qualified, the same tester PCB survives the automotive shop environment of -20 C to +60 C ambient.
Recomendado
Agricultural / Off-Highway CAN Node
Off-highway agricultural and construction equipment use SAE J1939 HS-CAN networks where the MC33989DWR2's 27V continuous VBAT rating covers 24V machine buses and its AEC-Q100 grade handles under-hood temperature swings. The integrated high-side and low-side drivers can control hydraulic valves or status LEDs without extra switch ICs, and the watchdog guards against firmware faults in the field. The 28-SOIC surface-mount package reflows cleanly onto vibration-resistant automotive-grade PCBs.
Recomendado
Electric Vehicle (EV) Charging Auxiliary Module
Auxiliary control boards inside EV charging stations and DC fast chargers use the MC33989DWR2 to provide an HS-CAN link between the charger's main controller and its billing/display modules, with the SBC's 5V regulator powering the auxiliary MCU. The 5.5V-27V VBAT accommodates both 12V and 24V charger-aux supplies, and the watchdog prevents a hung auxiliary MCU from leaving the charger in an undefined state. Pin-compatibility with Infineon TLE7259-3GE eases second-source qualification for charger manufacturers needing dual-vendor supply.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC33989DWR2 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC33989DW | MC33989DWR2G | MC33989PEFR2 | TLE7259-3GE | TLE7259-3G |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | Infineon | Infineon |
| Package | 28-SOIC (DW) | 28-SOIC (DW) - same | 28-SOIC (DW) - same | 28-SOIC (DW) - same | 28-SOIC (PG-DSO-28) - same outline | 28-SOIC (PG-DSO-28) - same outline |
| VBAT Supply Range | 5.5V to 27V | 5.5V to 27V | 5.5V to 27V | 5.5V to 27V | 5.5V to 27V | 5.5V to 27V |
| VCC Output | 5V or 3.3V selectable, 200 mA | 5V or 3.3V selectable, 200 mA | 5V or 3.3V selectable, 200 mA | 5V or 3.3V selectable, 200 mA | 5V, 100 mA | 5V, 100 mA |
| CAN Data Rate | Up to 1 Mbit/s (HS-CAN) | Up to 1 Mbit/s | Up to 1 Mbit/s | Up to 1 Mbit/s | Up to 1 Mbit/s | Up to 1 Mbit/s |
| Watchdog | Yes, selectable window | Yes, selectable window | Yes, selectable window | Yes, selectable window | Yes, window differs | Yes, window differs |
| High-Side Driver | Yes (1 channel) | Yes (1 channel) | Yes (1 channel) | Yes (1 channel) | No (transceiver only) | No (transceiver only) |
| AEC-Q100 | Qualified | Qualified | Qualified | Qualified | Qualified | Qualified |
| SPI Register Map | NXP 16-bit SPI | NXP 16-bit SPI | NXP 16-bit SPI | NXP 16-bit SPI | Infineon SPI (incompatible) | Infineon SPI (incompatible) |
Principais diferenciais
- Same-brand NXP drop-in alternates are fully footprint identical (vs MC33989DW / MC33989DWR2G / MC33989PEFR2)
- Integrated high-side driver plus two low-side drivers (vs TLE7259-3GE / TLE7259-3G (Infineon))
- 200 mA VCC versus 100 mA on Infineon equivalents (vs TLE7259-3GE)
Notas de projeto
Estimated: With VBAT=12V, VCC=5V, and I_VCC=200 mA, internal dissipation in the LDO pass element is approximately (12V - 5V) * 0.2A = 1.4W. The 28-SOIC package should be placed on at least 1 square inch of top-layer copper connected to the thermal pad (GND) to keep junction temperature rise below 50 C at +125 C ambient. Add a 100 nF X7R decoupling capacitor directly on VCC within 5 mm of pin 5/6 and a 10 uF bulk aluminum-polymer capacitor on VBAT to absorb load-dump transients.
Route the CANH and CANL traces as a 100-ohm differential pair with continuous ground reference and keep them short and parallel. Place 60-ohm termination resistors at each end of the bus, not at the SBC, unless stub lengths are below 50 mm. Splice CANH/CANL to the SPLIT pin through a 1 nF capacitor per the manufacturer reference design to stabilize common-mode voltage on networks with imperfect ground references.
Do not load the high-side driver output with capacitive loads greater than 10 nF without a series gate resistor, orients the part into overcurrent shutdown. Confirm that the watchdog window setting matches the host firmware's WD-refresh rate, otherwise the SBC will issue a hard reset. Never apply VBAT without a reverse-polarity diode or P-channel MOSFET pre-regulator; the MC33989DWR2 does not include internal reverse-battery protection and sustained reverse polarity will damage the die.
The HS-CAN transceiver's bus pins can radiate common-mode noise above 30 MHz if the SPLIT capacitor and bypass network are omitted. Add a 100 ohm differential-mode ferrite and a 10 pF common-mode capacitor on the off-board CAN connector side per the manufacturer EMC application note. Avoid routing the SPI bus more than 25 mm; keep series resistors in MOSI/SCLK lines close to the SBC if a long SPI trace is unavoidable.
Informações de conformidade
AEC-Q100 qualified per NXP product page for automotive ECU applications. RoHS-compliant, lead-free, halogen-free per NXP material declaration. The non-automotive grades MC33989DWEFR2 / MC33989PEFR2 may have different AEC-Q100 status; verify before substituting into automotive production.
