MC56F8335MFGE - 16-bit 60MHz DSC, 64KB Flash, 128-LQFP | NXP
N.º da peça: MC56F8335MFGE ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $30.55 | $30,55 |
| 10 | $27.5 | $275,00 |
| 100 | $24.45 | $2.445,00 |
| 500 | $21.4 | $10.700,00 |
| 1.000 | $18.65 | $18.650,00 |
MC56F8335MFGE Visão geral
A Digital Signal Controller (DSC) is a hybrid device that combines the deterministic control of a microcontroller (MCU) with the mathematical throughput of a digital signal processor (DSP). Within the broader taxonomy, a DSC sits between microcontrollers (control-oriented) and DSPs (math-oriented), and is itself a member of the larger microcontroller and embedded-processor IC family. The 56800E core extends this hybrid concept with a Harvard-style architecture, hardware DO-loop, and single-cycle MAC, making the MC56F8335MFGE suitable for both control loops and real-time signal conditioning in a single device.
Key features of the MC56F8335MFGE include 64 KB (32K x 16) Flash program memory, on-chip RAM, 49 general-purpose I/O, and a rich peripheral set: CANbus, EBI/EMI, two SCIs, one SPI, PWM, a temperature sensor, a watchdog timer, and power-on reset. The 56800E core delivers 60 MIPS with hardware MAC, accelerating closed-loop control and DSP-style filtering without offloading to a separate DSP. Connectivity options include CAN, SCI, and SPI, which is typical for industrial motor-control and sensor-interface boards.
Typical applications for the MC56F8335MFGE include digital motor control (BLDC, PMSM, AC induction), industrial inverters, uninterruptible power supplies, smart sensors, and automotive body electronics. The combination of PWM, CAN, ADC, and the 56800E MAC makes the device particularly well suited to Field-Oriented Control (FOC) of three-phase motors and to power-conversion control loops where deterministic interrupt latency matters.
When designing with this device, verify operating temperature grade from the device datasheet suffix, ensure PCB layout accommodates the 14 x 20 mm 128-LQFP footprint, and plan for a migration to the active 56F83xx successor because the MPN is NRND. Designers should evaluate pin-compatible family variants before committing to a long-lifecycle BOM.
Alternativas drop-in para MC56F8335MFGE — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MC56F8335MFGE (mesmo formato e footprint) — diferindo em Core.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC56F8335VFGE
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC56F8345VFGE
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC56F8346VFVE
✅ Drop-In✓ Em estoque
$10.1 / unidade
Ver ficha técnica →MC56F8135MFGE
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC56F8335MFGE Classificações máximas e características elétricas
| Core | 56800E |
| Core Size | 16-bit |
| Frequência máxima de clock | 60 MHz |
| Program Memory Size | 64 KB (32K x 16) Flash |
| Number of I/O | 49 |
| Encapsulamento / Caixa | 128-LQFP (14 x 20 mm) |
| Connectivity | CANbus, EBI/EMI, SCI, SPI |
| Peripherals | POR, PWM, Temp Sensor, WDT |
| Oscillator Type | Internal |
| Tipo de montagem | Surface Mount |
| Lead Free / RoHS | Lead Free (verify via PCN) |
| Part Status | NRND (Not Recommended for New Designs) |
| Series | 56F8xxx |
Guia de Configuração de Pinos do MC56F8335MFGE 128-lqfp (14 x 20 mm)
Configuração de pinos para MC56F8335MFGE (pacote 128-lqfp (14 x 20 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MC56F8335MFGE.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MC56F8335MFGE é adequado para 6 aplicaçãos: Three-Phase Motor Field-Oriented Control (FOC), AC Induction Motor V/Hz and Vector Drives, Uninterruptible Power Supplies (UPS) and Power Conversion, Industrial Sensor Hubs and Gateway Nodes, Automotive Body Electronics and HVAC Actuators, Smart Sensor Signal Conditioning.
Three-Phase Motor Field-Oriented Control (FOC)
The MC56F8335MFGE is engineered for Field-Oriented Control of PMSM and BLDC motors because its 56800E core executes Park/Clarke transforms in single-cycle MAC cycles at 60 MHz. The integrated PWM module drives the three-phase inverter bridge with center-aligned complementary outputs and programmable dead-time, while on-chip ADC sampling synchronizes to the PWM carrier for tight current-loop bandwidth. Per the 56F83xx family datasheet, the device's deterministic interrupt latency supports the sub-10 us control loops typical of FOC firmware. Designers place the DSC between the inverter gate driver and the Hall/encoder feedback path; CAN or SCI carries supervisory traffic to a host PLC or HMI. The 49 GPIO are sufficient for status LEDs, brake control, and encoder index handling.
Recomendado
AC Induction Motor V/Hz and Vector Drives
The MC56F8335MFGE's PWM, ADC, and SCI peripherals suit scalar V/Hz and indirect vector control of AC induction motors in industrial drives. The 60 MHz 56800E core computes slip estimation and rotor-flux model terms in real time, while the watchdog timer and POR safeguard unattended motor operation. Per the 56F83xx family datasheet, the device supports encoder and tachogenerator feedback inputs through its timer modules. Typical designs connect the DSC to a 3-phase IGBT bridge via isolated gate drivers; the 64 KB Flash accommodates speed ramps, fault handlers, and Modbus/CANopen protocol stacks.
Recomendado
Uninterruptible Power Supplies (UPS) and Power Conversion
The MC56F8335MFGE is a strong fit for UPS and inverter control because its PWM module generates the SPWM patterns required for DC-AC conversion, and its 56800E core runs the digital control loop including voltage/current RMS estimation and battery-state monitoring. Per the family datasheet, the on-chip temperature sensor enables overtemperature shutdown logic without external thermistors. A typical UPS design uses the DSC's ADC to sense DC-bus voltage, battery current, and output voltage; its SCI links to a front-panel display and its CAN bus reports status to a building-management system. The 49 GPIO accommodate relay drivers, fan control, and battery-test switching.
Recomendado
Industrial Sensor Hubs and Gateway Nodes
The MC56F8335MFGE acts as a CAN-to-SCI/SPI gateway in industrial sensor hubs by aggregating data from multiple analog and digital sensors and forwarding it over CANopen or Modbus. Per the family datasheet, the EBI/EMI bus permits glueless expansion to external memory or FPGA-based preprocessing, while the integrated temperature sensor supports board-level thermal monitoring. A typical deployment places the DSC on a DIN-rail module with a CAN transceiver upstream and a wireless modem downstream. Because the part is NRND, new gateway designs should plan a migration to an active 56F83xx variant while keeping the LQFP-128 footprint.
Recomendado
Automotive Body Electronics and HVAC Actuators
The MC56F8335MFGE's CANbus connectivity, PWM channels, and 16-bit ADC resolution match the requirements of automotive body controllers and HVAC flap actuators. Per the 56F83xx datasheet, the device supports LIN via SCI plus a software stack, and the integrated watchdog and POR satisfy ISO 7637 surge handling at the MCU level. Typical designs use the DSC to drive multiple brushed DC motors for HVAC mode doors, read thermistor bridges, and exchange status with the body controller over CAN. The 49 GPIO accommodate H-bridge drivers, switch inputs, and diagnostic LEDs.
Recomendado
Smart Sensor Signal Conditioning
The MC56F8335MFGE's 56800E MAC accelerates DSP-style filtering on raw sensor outputs such as strain-gauge, thermocouple, or load-cell signals, making it a strong fit for smart-sensor signal conditioning. Per the family datasheet, the on-chip PWM and SCI support excitation of bridges and transmission of conditioned readings. A typical design digitizes the analog front-end with an external 24-bit sigma-delta ADC, then uses the 56800E MAC for digital filtering, linearization, and temperature compensation. The 64 KB Flash accommodates calibration tables and protocol stacks; CAN or SCI links the smart sensor to a controller network.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC56F8335MFGE — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC56F8335VFGE | MC56F8345VFGE | MC56F8346VFVE | MC56F8135MFGE |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 128-LQFP (14x20 mm) | 128-LQFP (14x20 mm) - same | 128-LQFP - same | 128-LQFP - same | 128-LQFP (14x20 mm) - same |
| Core | 56800E (16-bit) | 56800E (16-bit) - same | 56800E (16-bit) - same | 56800E (16-bit) - same | 56800E (16-bit) - same |
| Maximum Clock | 60 MHz | 60 MHz - same | 60 MHz - same | 60 MHz - same | 60 MHz - same |
| Number of I/O | 49 | 49 - same | 49 or higher - confirm | 49 or higher - confirm | fewer I/O - confirm |
| Connectivity | CAN, EBI/EMI, SCI, SPI | CAN, EBI/EMI, SCI, SPI - same | Similar peripheral mix - same | Similar peripheral mix - same | Reduced peripheral set - confirm |
| Lifecycle Status | NRND | NRND or active - confirm | NRND or active - confirm | NRND or active - confirm | NRND or active - confirm |
Principais diferenciais
- Hybrid 56800E core combines MCU control and DSP throughput (vs MC56F8346VFVE)
- Rich connectivity including CAN, SCI, SPI, and EBI (vs MC56F8135MFGE)
- Mature 128-LQFP (14x20 mm) footprint with extensive reference designs (vs MC56F8345VFGE)
Notas de projeto
Because the MC56F8335MFGE is NRND per NXP's product page, do not commit the part to a new long-lifecycle BOM. Confirm NXP's last-time-buy and PCN schedule, evaluate the same-family drop-in alternatives listed on this page (MC56F8335VFGE, MC56F8345VFGE), and finalize firmware on a currently-active 56F83xx variant if at all possible. New designs should select an active device unless legacy compatibility forces this choice.
The 128-LQFP (14 x 20 mm) package dissipates power through the leads and the PCB copper pad. For continuous motor-control loads at 60 MHz with all peripherals active, estimate junction temperature rise using the datasheet's thermal resistance. Provide a contiguous ground-pour copper plane under the LQFP and at least 8 thermal vias to the inner ground layers to keep theta_JA within published limits. Add copper area on top layer tied to GND to spread heat laterally.
Route the analog and digital sections of the PCB in separate zones because the MC56F8335MFGE integrates both. Place the decoupling capacitor network (one 100 nF ceramic plus one 10 uF bulk per power pin) within 2 mm of each supply pin. Keep ADC reference and analog input traces short and away from PWM and SCI switching signals; use a guarded analog ground that joins the digital ground at a single point near the DSC's GND pin.
The 56F8xxx SCI, SPI, and CAN signals require series termination matched to the line impedance at higher baud rates. For CAN, place a 120 ohm termination resistor at each end of the bus and keep stub length below 1/10 of the signal rise time. For SPI at 10 MHz and above, route clock and MOSI as a length-matched pair with a continuous reference ground to avoid ringing on the MISO return path.
Informações de conformidade
Lead-free and RoHS compliance per NXP product page; full PCN/revision-specific compliance should be confirmed against the manufacturer datasheet for the exact date code being purchased.
