MC56F8347VVFE - 16-Bit 60MHz DSP MCU, 128KB Flash, 160-MAPBGA | NXP
N.º da peça: MC56F8347VVFE ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.2 | $252,00 |
| 100 | $22.1 | $2.210,00 |
| 500 | $19.85 | $9.925,00 |
| 1.000 | $17.9 | $17.900,00 |
MC56F8347VVFE Visão geral
A Digital Signal Controller (DSC) sits in the hierarchy between a microcontroller and a full DSP: like an MCU it integrates Flash, RAM, timers, ADC, and communication peripherals on-chip; like a DSP it offers single-cycle MAC, Harvard-style bus architecture, and deterministic interrupt latency. DSCs are used where the application requires DSP-class signal processing throughput (motor control loops, power-conversion algorithms, audio/voice processing) without the cost and complexity of a separate DSP + MCU pair.
Key features include an on-chip enhanced Synchronous Serial Interface (SSI) and Serial Peripheral Interface (SPI), dual SCI (UART) ports, a 12-bit ADC with up to 8 input channels, a Quad Timer module, PWM outputs suitable for motor drive, and a JTAG/OnCE debug port. The 56800E core executes most instructions in a single clock cycle and supports hardware DO/REP loops, making it well-suited to fixed-point control and signal processing tasks.
Architecturally, the 56F8347 separates program Flash (128 KB) and data Flash (up to 8 KB optional) from unified RAM, allowing concurrent instruction fetch and data access through dual on-chip buses. The integrated peripherals share a peripheral interrupt controller with configurable priorities. Operating voltage is typically 3.0 V to 3.6 V, with industrial temperature grade options.
Typical applications include variable-frequency motor drives (BLDC, PMSM, ACIM), digital power conversion (UPS, solar inverters, SMPS), industrial automation controllers, smart sensor signal conditioning, and consumer audio processing. The combination of DSP throughput and MCU-style integration reduces BOM cost in motor-control designs.
When designing with the MC56F8347VVFE, ensure the MAPBGA PCB footprint includes 4-layer construction with via-in-pad or micro-vias, as the 0.8 mm pitch BGA cannot be hand-soldered. The on-chip voltage regulator and decoupling requirements are detailed in the MC56F8347 datasheet; inadequate decoupling causes Flash programming failures during in-field updates.
This page synthesizes distributor pricing, package data, and practical design notes for the MC56F8347VVFE not found in the manufacturer datasheet alone.
Alternativas drop-in para MC56F8347VVFE — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MC56F8347VVFE (mesmo formato e footprint) — diferindo em Core Architecture, Package, ADC, Program Memory Size, RoHS Status.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC56F8347MFVE
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MC56F8345VVFE
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MC56F8367VVFE
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MC56F8147VVFE
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MC56F8347VVFE Classificações máximas e características elétricas
| Core Architecture | 56800E 16-bit Digital Signal Controller |
| Core Frequency (Max) | 60 MHz |
| Program Memory Type | FLASH |
| Program Memory Size | 128 KB (64K x 16) |
| RAM Size | 12 KB (6K x 16) |
| Number of I/O | 76 |
| Encapsulamento / Caixa | 160-MAPBGA (15x15 mm) |
| Oscillator Type | External |
| ADC | 12-bit integrated |
| Communication Interfaces | SSI, SPI, dual SCI (UART) |
| PWM Outputs | Yes (motor-control peripherals) |
| Timers | Quad Timer module |
| Debug Interface | JTAG / OnCE |
| Tipo de montagem | Surface Mount (BGA) |
| Status RoHS | Compliant (per distributor listings) |
| Packaging | Tray |
Guia de Configuração de Pinos do MC56F8347VVFE 160-mapbga (15x15 mm)
Configuração de pinos para MC56F8347VVFE (pacote 160-mapbga (15x15 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MC56F8347VVFE.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MC56F8347VVFE é adequado para 6 aplicaçãos: Variable-Frequency Motor Drive (BLDC / PMSM / ACIM), Digital Power Conversion (UPS, Solar Inverter, SMPS), Industrial Automation and Process Control, Smart Sensor Signal Conditioning, Consumer Audio and Voice Processing, Appliance Motor Control (Washing Machines, Refrigerators, HVAC).
Variable-Frequency Motor Drive (BLDC / PMSM / ACIM)
The MC56F8347VVFE's 60 MIPS 56800E core executes field-oriented control (FOC) loops for 3-phase permanent-magnet synchronous motors within a single PWM period of 16.67 microseconds at 60 MHz. Its integrated PWM module with complementary outputs and dead-time insertion directly drives the gate-driver stage of a 3-phase inverter, while the 12-bit ADC with synchronized sampling captures phase currents at the PWM midpoint for accurate Clarke/Park transformations. The 128 KB Flash holds the FOC state machine, space-vector modulator, and protection routines, while 12 KB RAM holds controller state variables and observer coefficients.
Recomendado
Digital Power Conversion (UPS, Solar Inverter, SMPS)
In digital power supplies the MC56F8347VVFE closes the voltage and current control loops for DC-DC and AC-DC converters at switching frequencies up to several hundred kHz. Its DSP throughput (60 MIPS) handles digital peak current-mode control, PFC algorithms, and adaptive dead-time compensation in software, while the on-chip 12-bit ADC samples the feedback signals with sub-microsecond latency. The 56800E's deterministic interrupt response ensures consistent switching-period timing, which is critical for EMI predictability in high-frequency SMPS designs.
Recomendado
Industrial Automation and Process Control
Factory automation PLCs and motion controllers benefit from the MC56F8347VVFE's combination of DSP throughput and MCU peripherals. The 76 GPIO lines drive opto-isolated discrete I/O for limit switches and relays, while the dual SCI (UART) ports and SSI interface connect to Modbus RTU slaves or industrial sensor networks. On-chip timers generate precise step/direction pulses for stepper motor axes, and the JTAG/OnCE debug port supports in-circuit firmware updates on the production line, minimizing field-service overhead.
Recomendado
Smart Sensor Signal Conditioning
The MC56F8347VVFE integrates a 12-bit ADC and DSP core in a single chip, enabling in-line signal conditioning for sensors such as strain gauges, load cells, flow meters, and vibration accelerometers. Its hardware MAC and DO-loop instructions run digital filters (FIR/IIR), RMS calculations, and FFT analysis at sample rates up to several hundred kHz. The 128 KB Flash holds calibration tables and linearization curves for sensor-specific compensation, while the 12 KB RAM buffers raw sample blocks for batch processing.
Recomendado
Consumer Audio and Voice Processing
Consumer audio products such as powered speakers, soundbars, and hearing-aid accessories use the MC56F8347VVFE to perform digital crossovers, dynamic-range compression, and noise-suppression algorithms. The 56800E core's single-cycle MAC accelerates biquad filter chains, while the SSI port streams audio samples to external codecs. The integrated 12-bit ADC and PWM can also synthesize analog audio outputs directly, eliminating a separate DAC in low-cost designs.
Recomendado
Appliance Motor Control (Washing Machines, Refrigerators, HVAC)
White-goods manufacturers use the MC56F8347VVFE to drive drum motors, compressor inverters, and fan motors in washing machines, refrigerators, and HVAC systems. Its integrated peripherals eliminate the need for a separate motor-control ASIC, while the 56800E DSP core executes sensorless control algorithms that reduce BOM cost by removing Hall-effect sensors. The wide operating temperature grade and integrated protection peripherals (overcurrent, overtemperature) meet appliance reliability requirements.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC56F8347VVFE — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC56F8347MFVE | MC56F8345VVFE | MC56F8367VVFE | MC56F8147VVFE |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 160-MAPBGA (15x15 mm) | 160-LQFP | 160-MAPBGA (15x15) - same | 160-MAPBGA (15x15) - same | 160-MAPBGA (15x15) - same |
| Core | 56800E 16-bit DSC | 56800E 16-bit DSC | 56800E 16-bit DSC | 56800E 16-bit DSC | 56800E 16-bit DSC |
| Max Clock Frequency | 60 MHz | 60 MHz | 60 MHz | 60 MHz | 60 MHz |
| ADC | 12-bit | 12-bit | 12-bit | 12-bit | 12-bit |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
Principais diferenciais
- Drop-in 160-MAPBGA software upgrade with 2x Flash headroom (vs MC56F8147VVFE)
- 128 KB Flash in 160-MAPBGA footprint (vs MC56F8147VVFE)
- 12 KB RAM supports state-rich FOC observers (vs MC56F8147VVFE)
Notas de projeto
The 160-MAPBGA package (15x15 mm) at 0.8 mm or 1.0 mm ball pitch requires a 4-layer PCB minimum with micro-vias or via-in-pad technology. Hand-soldering or rework without a BGA rework station is not practical; plan for X-ray inspection after reflow. Place decoupling capacitors (100 nF + 10 uF) within 5 mm of each VDDA/VSSA pair; inadequate decoupling is a leading cause of Flash programming failures during in-field firmware updates.
Estimated: at full 60 MHz CPU load with all peripherals active, the MC56F8347VVFE dissipates approximately 400-500 mW. The MAPBGA package has theta_JA in the 30-40 C/W range on a 4-layer JEDEC test board, resulting in a junction temperature rise of 15-20 C above ambient at room temperature. For enclosed industrial environments above 60 C ambient, derate CPU clock or add thermal vias under the central ball array to keep Tj below 125 C.
The MC56F8347 and MC56F8147 share a datasheet but differ in Flash and RAM sizes - selecting the wrong variant for firmware size wastes cost or causes code-space overflow. Always check the silicon revision marked on the package (Rev 0 vs Rev 1.0+) since early revisions had errata in Section 1.1.3 and a corrected D14 pin assignment per the chipdig.com datasheet excerpt. Validate the JTAG/OnCE connection during prototype bring-up before committing to layout, as BGA reworking for a JTAG misrouting is costly.
Informações de conformidade
RoHS and lead-free status inferred from distributor listings; reach, halogen-free, and conflict-minerals declarations not confirmed in supplied web data.
