MC68030CRC33C - 33MHz 32-Bit MPU, 128-PGA | Motorola/NXP
N.º da peça: MC68030CRC33C ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.6 | $256,00 |
| 100 | $22.8 | $2.280,00 |
| 500 | $20.1 | $10.050,00 |
| 1.000 | $18.4 | $18.400,00 |
MC68030CRC33C Visão geral
The M68k (M68000) is a CISC/legacy RISC-influenced 32-bit microprocessor architecture that powered the Apple Macintosh, Atari ST, Commodore Amiga, Sun workstations, and many early Unix systems. It introduced a flat 32-bit address space, eight 32-bit data registers, and eight 32-bit address registers, and it dominates long-lifecycle embedded applications such as industrial controllers, telecom switches, military/aerospace systems, and legacy VMEbus boards. The 68030 specifically adds a 4 KB data cache and a 4 KB instruction cache (write-through modes configurable) and improves the bus controller for higher throughput than the 68020/68000.
Key electrical features include 33 MHz clock, 5 V supply (typical HCMOS), HCMOS process technology, on-chip MMU, dual 4 KB caches, and an enhanced burst-mode bus interface. The 128-PGA ceramic package is the rugged through-hole form factor preferred for defense, aerospace, and industrial applications. Like most Motorola/NXP M68k chips, this part is long-lifecycle and is sourced today primarily through authorized distributors, Rochester Electronics (franchised for EOL silicon), and the open market.
Typical applications include VMEbus single-board computers, telecom switching infrastructure, industrial PLCs and motor controllers, military/aerospace command and control systems, laser printer controllers, and legacy medical imaging equipment. The on-chip MMU enables full Unix-like operating systems (e.g., NetBSD, VxWorks, OS-9) to run natively.
A key design consideration is the legacy CPU support burden: new designs should consider ColdFire MCF5307/MCF5407 drop-in equivalents in CPGA128 or migrate to ARM Cortex-A based SBCs. The ceramic 128-PGA package requires a through-hole socket (PGA socket) or hand/outgassing reflow for production.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the original Motorola/NXP datasheet, providing engineers with a single reference for sourcing, replacement, and lifecycle decisions.
Alternativas drop-in para MC68030CRC33C — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC68030CRC40C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC68030CRC33B
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MC68030RC33
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC68030RC25
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC68030CRC25C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC68EC040RC25A
✅ Drop-In✓ Em estoque
$92 / unidade
Ver ficha técnica →MC68030CRC33C Classificações máximas e características elétricas
| Processor Type | M680x0 32-Bit Microprocessor |
| Core | M68000 Family (MC68030) |
| Architecture | CISC, 32-bit internal / 32-bit external data bus |
| Operating Frequency | 33 MHz |
| Tensão de alimentação | 5 V (HCMOS) |
| On-chip Instruction Cache | 4 KB |
| On-chip Data Cache | 4 KB |
| Memory Management Unit (MMU) | Yes, on-chip |
| Bus Controller | Enhanced (burst-mode capable) |
| Encapsulamento | 128-PGA (CPGA128), 34.55 x 34.55 mm |
| Tipo de montagem | Through-Hole, Pin Grid Array (ceramic) |
| Temperatura de operação | 0C to +85C (commercial) |
| Packaging | Tray |
| Lead Free Status | Contains lead (ceramic PGA) |
Guia de Configuração de Pinos do MC68030CRC33C 128-pga (cpga128), 34.55 x 34.55 mm
Configuração de pinos para MC68030CRC33C (pacote 128-pga (cpga128), 34.55 x 34.55 mm). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MC68030CRC33C.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MC68030CRC33C é adequado para 6 aplicaçãos: VMEbus Single-Board Computers (SBC), Telecom Switching Infrastructure, Industrial PLC / Motor Controllers, Military / Aerospace Mission Computers, Laser Printer Controllers, Legacy Medical Imaging Equipment.
VMEbus Single-Board Computers (SBC)
The MC68030CRC33C's 32-bit non-multiplexed address/data bus and integrated MMU make it ideal for legacy VMEbus SBCs used in industrial control and instrumentation. Its 33 MHz clock and dual 4 KB caches deliver sufficient throughput for real-time data acquisition boards. Placed with a VMEbus interface controller (e.g., MCVME chipset), it services the VMEbus interrupt hierarchy via IPL0-IPL2 pins. Compared to newer ARM SBCs, the 68030 maintains software compatibility with legacy VxWorks 5.x and OS-9 deployments common in industrial automation.
Recomendado
Telecom Switching Infrastructure
Long-lifecycle telecom switching systems use the MC68030CRC33C in central-office line cards and switch fabric controllers. The on-chip MMU supports paged-memory operating systems (VxWorks, pSOS) for deterministic scheduling of voice/data traffic. Its 33 MHz throughput with dual caches handles SS7 signaling stacks and TDM routing tables. The ceramic CPGA128 package withstands the elevated ambient temperature of telecom bays; Rochester Electronics' franchised inventory helps operators sustain 25-year service programs.
Recomendado
Industrial PLC / Motor Controllers
The MC68030CRC33C drives high-end industrial PLCs and standalone motion controllers where deterministic control loops and floating-point math are required. With external 68882 FPU support on the M68k coprocessor interface, engineers implement PID loops and servo controls at kHz rates. Its 4 KB instruction cache is critical when running ladder-logic interpreters. The 33 MHz speed, full 32-bit address space, and rugged ceramic package fit harsh factory environments; engineers pair the chip with optically-isolated I/O and SERCOS or CAN glue logic for fieldbus connectivity.
Recomendado
Military / Aerospace Mission Computers
Defense and aerospace programs use the MC68030CRC33C in CPGA128 form factor for command-and-control computers, navigation subsystems, and ruggedized displays. The ceramic PGA package is hermetic, leaded, and qualified for MIL-STD-883 vibration and thermal cycling, and the 33 MHz clock meets real-time avionic requirements. The chip's deterministic interrupt response (via IPL0-IPL2) enables time-critical flight-control tasks. Long qualification cycles (15-25 years) sustain ongoing procurement despite the part being past active production.
Recomendado
Laser Printer Controllers
The MC68030CRC33C served as the main CPU in high-speed PostScript laser printer controllers from the early 1990s. Its dual on-chip caches accelerate RIP (raster image processor) rendering, while the MMU enables protected-mode multi-page image pipelines. The 33 MHz clock was sufficient for 16-32 ppm print engines. Engineers paired the chip with frame buffer DRAM, motor-control ASICs, and PCL/PostScript interpreters. Although modern printers have migrated to SoCs, thousands of industrial label printers retain original 68030 hardware.
Recomendado
Legacy Medical Imaging Equipment
Ultrasound and CT imaging systems from the late 1980s/early 1990s use the MC68030CRC33C as a main controller for sequence generation, image buffer management, and operator panel handling. The MMU supports protected-mode medical imaging software (often home-grown), and the dual caches handle image-processing kernels such as convolution and FFT in real time. Hospitals maintaining this equipment rely on the M68k family's longevity. The CPGA128 ceramic package tolerates the temperature profile of medical imaging equipment racks better than plastic-grid equivalents.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC68030CRC33C — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC68030CRC40C | MC68030CRC33B | MC68030RC33 | MC68030RC25 | MC68030CRC25C |
|---|---|---|---|---|---|---|
| Package | 128-PGA (CPGA128), ceramic | 128-PGA (CPGA128), ceramic - same | 128-PGA (CPGA128), ceramic - same | 128-PGA, plastic - same footprint | 128-PGA, plastic - same footprint | 128-PGA (CPGA128), ceramic - same |
| Brand | NXP Semiconductors (successor) | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same |
| Clock Frequency | 33 MHz | 40 MHz | 33 MHz | 33 MHz | 25 MHz | 25 MHz |
| On-chip I-Cache | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| On-chip D-Cache | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| MMU | On-chip | On-chip | On-chip | On-chip | On-chip | On-chip |
| Supply Voltage | 5 V (HCMOS) | 5 V | 5 V | 5 V | 5 V | 5 V |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
Principais diferenciais
- Higher clock frequency at same footprint (vs MC68030CRC25C)
- Ceramic hermetic package for harsh environments (vs MC68030RC33)
- M68k software compatibility with modern ColdFire (vs MC68EC020)
- Lower cost and broader distributor availability than 040 family (vs MC68EC040RC25A)
Notas de projeto
Estimated: the MC68030CRC33C is a legacy HCMOS 5 V part - supply decoupling must use 0.1uF ceramic and 22uF tantalum bulk caps per datasheet. Place decoupling within 5 mm of every Vcc/GND pin pair on the 128-PGA package; the ceramic PGA typically has 16+ Vcc/GND pins distributed across the die. Estimated: at 33 MHz the chip core current is approximately 200-300 mA, peaking during external bus cycles. Add a soft-start resistor and bulk capacitor on the 5 V rail to limit inrush into the HCMOS logic gates.
The ceramic PGA128 package has a theta_JA around 30 C/W with a heatsink (or 50 C/W without). At typical 5 V and approximately 200 mA active current with cache hit, internal dissipation is approximately 1 W, putting the junction at 30-50 C above ambient - well within HCMOS limits. Engineers in sealed enclosures should still mount the chip to a chassis heatsink via thermal compound and a clip, since PGA-style chips exchange heat through the ceramic substrate, not just convection.
The 128-PGA footprint requires either a PGA socket or hand-soldered through-hole pads with 0.1 in (2.54 mm) grid pitch. New designs should use a PGA socket (Mill-Max or equivalent) to allow field replacement. Trace the full 32-bit data bus with matched lengths; series-terminate at the driver with 33 ohm resistors to suppress reflection on long M68k bus runs. Place external cache SRAM, ROM, and bus arbitration chips in mirrored timing zones relative to the central PGA.
Do not enable the on-chip instruction cache before locking down the cache-disable (CDIS) and MMU-disable logic; mis-ordered initialization can cause early boot glitches on real MC68030 silicon. The 33 MHz part requires precise bus timing - extend wait states on slow peripherals using the bus controller's DSACK handshake. Lastly: HCMOS parts are static-sensitive; the ceramic PGA package's hermeticity is irrelevant if mishandled with bare finger on pins (use ESD-safe PGA carriers during transfer).
Informações de conformidade
Ceramic PGA package is leaded; ceramic substrate is not RoHS compliant. Reach status not explicitly disclosed by NXP. Not AEC-Q100 (automotive is not the target market). Conflict-minerals compliance per NXP supplier program.
