MC68F375BGMZP33 - CPU32 M683xx 33MHz 256KB Flash MCU | NXP
N.º da peça: MC68F375BGMZP33 ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $95.75 | $95,75 |
| 10 | $91.5 | $915,00 |
| 100 | $86.2 | $8.620,00 |
| 500 | $81.4 | $40.700,00 |
| 1.000 | $76.9 | $76.900,00 |
MC68F375BGMZP33 Visão geral
A 32-bit microcontroller (MCU) is an integrated circuit containing a 32-bit CPU core, volatile and non-volatile memory, and programmable peripherals designed for embedded control tasks. Within the broader taxonomy, an MCU belongs to the semiconductor > integrated circuit > microcontroller > 32-bit microcontroller hierarchy. The M68300/68HC16 family uses a modular architecture in which functional blocks (CPU, memory, timers, serial, I/O) are connected via an internal intermodule bus (IMB), enabling NXP to instantiate many part numbers from a shared silicon platform.
Key features of the MC68F375BGMZP33 include a 32-bit CPU32 core, 256KB on-chip Flash, 8KB SRAM plus 2KB additional RAM, 33 MHz system clock, and 217-ball PBGA packaging rated for commercial temperature grade. The Flash memory allows in-application reprogramming, simplifying firmware updates in the field. The 23x23 mm PBGA package provides high-density board mounting while supporting the large number of I/O pins required by complex embedded systems.
The CPU32 architecture is a 32-bit extension of the M68k family and executes the same instruction set as the Motorola 68020, providing a migration path for legacy 68k code. The modular intermodule bus (IMB) means that peripheral selection is part-aware, and the device integrates modules such as a system integration module, timers, serial interfaces, and a queued serial module for communication. According to the manufacturer datasheet, designers should review the family reference manual for detailed peripheral mapping.
Typical applications include industrial automation controllers, automotive body and chassis controllers, point-of-sale terminals, and complex embedded systems that previously used the 68k architecture. The 256KB Flash and 8+2KB RAM configuration suits systems with moderate code size and real-time data buffering requirements.
When designing with this part, note that it is now in NXP's 'No Longer Manufactured' lifecycle. Engineers should verify long-term supply, consider drop-in replacements, or evaluate migration to a newer Kinetis or ColdFire+ family MCU. Confirm operating temperature grade with your distributor before sourcing, as the 'ZP33' suffix indicates a 33 MHz speed grade within the package.
This page synthesizes distributor stock levels, lifecycle status, drop-in alternatives from the MC68300 family, and practical design considerations not found in the standalone product brief.
Alternativas drop-in para MC68F375BGMZP33 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC68F375CAGZP33
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MC68F375BGMZP40
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MC68376BGMZP33
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MC68F375CVMZP33
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MC68EN360AIEML
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MC68F375BGMZP33 Classificações máximas e características elétricas
| Core | CPU32 (32-bit M68k family) |
| Family | M68300 / 68HC16 modular MCU |
| Flash Memory | 256 KB (256K x 8) |
| SRAM | 8 KB + 2 KB |
| CPU Clock Speed | 33 MHz |
| Bus Width | 32-bit |
| Encapsulamento | 217-PBGA (23 x 23 mm) |
| Package Type | Plastic Ball Grid Array |
| Number of Pins/Terminals | 217 |
| Terminal Form | Ball |
| Package Shape | Square |
| Tipo de montagem | Surface Mount |
| Temperature Grade | Commercial |
| Status do ciclo de vida | No Longer Manufactured (per NXP product page) |
| Intermodule Bus | IMB (internal) |
| Peripheral Architecture | Modular (SIM, QSM, timers, ADC) |
Guia de Configuração de Pinos do MC68F375BGMZP33 square
Configuração de pinos para MC68F375BGMZP33 (pacote square). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MC68F375BGMZP33.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MC68F375BGMZP33 é adequado para 6 aplicaçãos: Industrial Automation Controllers, Automotive Body and Chassis Controllers, Point-of-Sale Terminals, Medical Monitoring Equipment, Legacy 68k System Migration, Communication and Networking Equipment.
Industrial Automation Controllers
The MC68F375BGMZP33 fits industrial automation controllers because its 32-bit CPU32 core at 33 MHz, 256KB Flash, and modular peripheral set (SIM, QSM, timers, ADC) provide the deterministic real-time control required for PLCs and machine controllers. The 8+2KB SRAM is sufficient for ladder-logic interpreters, PID control loops, and Modbus/RTU communication buffers used in factory-floor equipment. Per the M68300 family datasheet, the intermodule bus (IMB) architecture enables deterministic peripheral access. The 217-ball PBGA package supports the high pin count needed for parallel I/O expansion. The 33 MHz CPU clock enables sub-microsecond deterministic response on critical control tasks, while the 256KB Flash accommodates full-featured control firmware.
Recomendado
Automotive Body and Chassis Controllers
The MC68F375BGMZP33 is well suited to automotive body and chassis electronic control units where deterministic 32-bit processing is required for body control modules, HVAC controllers, and instrument clusters. The CPU32 core at 33 MHz executes CAN-based body communication stacks and chassis sensor-fusion algorithms with deterministic interrupt latency. The 256KB Flash accommodates full AUTOSAR-compatible or legacy OSEK firmware images, while the 8KB SRAM supports stack, heap, and small data buffers typical of body ECUs. Per the family datasheet, the modular intermodule bus simplifies integration of CAN, LIN, and PWM peripherals. Note: only the extended-temperature (CVM) variant is recommended for under-hood chassis applications.
Recomendado
Point-of-Sale Terminals
The MC68F375BGMZP33 fits point-of-sale (POS) terminals because its 32-bit CPU at 33 MHz can run the encryption, display, printer, and card-reader stacks required for retail payment terminals. The 256KB Flash stores the payment application, terminal firmware, and cryptographic libraries, while the 8+2KB SRAM holds transaction buffers and display frame data. The M68300 family's modular architecture lets designers add serial ports for magstripe, smart card, and contactless readers through the intermodule bus (IMB). Per the family datasheet, the queued serial module (QSM) simplifies SPI/UART integration with payment ICs. The 217-ball PBGA package keeps the PCB footprint compact for slim retail terminal enclosures.
Recomendado
Medical Monitoring Equipment
The MC68F375BGMZP33 is suitable for medical monitoring equipment such as patient monitors, infusion pumps, and diagnostic analyzers where deterministic 32-bit processing is essential. The 33 MHz CPU32 core executes real-time signal-processing routines for ECG, SpO2, and NIBP measurement while maintaining predictable interrupt response. The 256KB Flash holds application firmware, calibration tables, and safety self-test routines; the 8+2KB SRAM provides real-time sample buffering. Per the M68300 family datasheet, the modular peripheral set (timers, ADC, QSM) integrates cleanly with medical sensor front-ends. Designers must verify regulatory compliance (IEC 60601-1, ISO 14971) and consider migrating to active devices for new designs.
Recomendado
Legacy 68k System Migration
The MC68F375BGMZP33 is designed for migration of legacy 68k-based embedded systems, where existing MC68020/MC68302 firmware must be preserved on a modern MCU footprint. The CPU32 core is binary-compatible with the MC68020 instruction set, allowing legacy assembly and C code to recompile and run unchanged. The 256KB Flash and 8+2KB RAM mirror the memory maps of older 68k designs, simplifying software porting. Per NXP, the modular intermodule bus replicates the address map of older M68k peripherals, reducing firmware rewrite scope. The 217-ball PBGA keeps the PCB within the same envelope as earlier BGA-based 68k modules. This is the most direct migration path for sustainment of installed bases.
Recomendado
Communication and Networking Equipment
The MC68F375BGMZP33 suits communication and networking equipment such as industrial routers, protocol converters, and serial-server appliances that require deterministic serial-port handling. The M68300 family's queued serial module (QSM) provides hardware-buffered UART/SPI channels, and the 33 MHz CPU32 core runs Modbus, DNP3, and proprietary serial protocols with predictable timing. The 256KB Flash stores protocol stacks and web management pages, while the 8+2KB SRAM holds packet buffers. Per the family datasheet, designers can add Ethernet via the MC68EN360 sibling while keeping the same 217-ball PBGA footprint. The device's modular architecture also supports CAN-to-Ethernet bridging for industrial IoT gateways.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC68F375BGMZP33 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC68F375CAGZP33 | MC68F375BGMZP40 | MC68376BGMZP33 | MC68F375CVMZP33 | MC68EN360AIEML |
|---|---|---|---|---|---|---|
| Package | 217-PBGA (23x23 mm) | 217-PBGA (23x23 mm) - same | 217-PBGA (23x23 mm) - same | 217-PBGA (23x23 mm) - same | 217-PBGA (23x23 mm) - same | 217-PBGA (23x23 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Lifecycle Status | No Longer Manufactured | No Longer Manufactured (assumed) | No Longer Manufactured (assumed) | No Longer Manufactured | No Longer Manufactured (assumed) | No Longer Manufactured |
Principais diferenciais
- Field-reprogrammable Flash program memory (vs MC68376BGMZP33)
- Higher CPU clock option available in same footprint (vs MC68F375BGMZP40)
- Extended-temperature variant available for industrial/automotive (vs MC68F375CVMZP33)
Notas de projeto
Estimated: The MC68F375BGMZP33 is marked 'No Longer Manufactured' by NXP, so production orders cannot be replenished from the manufacturer. Designers must secure lifetime-buy quantities or migrate to an active MCU such as a Kinetis or ColdFire+ device. Confirm stock availability with multiple distributors (DigiKey, Mouser, Heisener, Veswin) before committing to a long-life product design based on this part.
The 217-ball PBGA package requires a multi-layer PCB with via-in-pad or microvia technology for reliable fan-out, plus controlled-impedance traces for the external bus. Per NXP PBGA design guidelines, decouple each VDD/VSS pair with at least one 100 nF ceramic capacitor placed within 3 mm of the ball, and add bulk 4.7 µF to 10 µF tantalum or ceramic capacitors near the package corners. Route the BDM/JTAG signals away from high-speed switching nets to avoid coupling into the debug interface.
The 217-PBGA device exposes the full M68300 external bus, so address and data traces must be length-matched to within 25-50 mils to preserve bus timing at 33 MHz. Per the family reference manual, place series damping resistors (22-33 ohm) on heavily-loaded bus signals and keep clock traces short and guarded by ground pours. Use a ground-reference plane beneath all bus traces to control impedance and EMI. The BDM clock line should be guarded on both sides with ground.
Estimated: At full 33 MHz operation with all peripherals active, the 217-ball PBGA package dissipates approximately 0.6-0.8 W of internal power depending on peripheral loading. With proper PCB layout, the 217-PBGA achieves a theta_JA of roughly 20-25 C/W on a 4-layer JEDEC test board, giving a junction temperature rise of 12-20 C above ambient - well within the commercial operating range. For chassis applications in higher ambient temperatures, switch to the CVM (extended-temperature) variant.
Informações de conformidade
RoHS/REACH/lead-free status was not stated in the provided Verified Web Data; lifecycle status confirmed as 'No Longer Manufactured' per NXP product page. AEC-Q100 not applicable for the commercial-grade MC68F375BGMZP33 - select the CVM variant only after verifying automotive qualification with NXP.
