MC9328MX21CVK - i.MX21 ARM926EJ-S MPU 266MHz | NXP
N.º da peça: MC9328MX21CVK ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.2 | $252,00 |
| 100 | $22.1 | $2.210,00 |
| 500 | $19.8 | $9.900,00 |
| 1.000 | $17.95 | $17.950,00 |
MC9328MX21CVK Visão geral
An applications processor (AP) is a System-on-Chip variant of a microprocessor that integrates peripherals and accelerators oriented toward a target end-application rather than general-purpose computing. Applications processors sit at the hierarchy of microprocessor -> embedded MPU -> applications processor -> SoC, and they typically pair a high-performance CPU core with image, display, connectivity, and multimedia peripherals.
Key features include the ARM926EJ-S 32-bit RISC core with a 16KB instruction cache, 16KB data cache, and tightly-coupled memory for deterministic interrupt latency. Memory is supported externally through SDRAM, NOR flash, NAND flash, and PCMCIA/CF interfaces. The integrated LCD controller supports TFT panels up to SVGA resolution, the CMOS sensor interface connects directly to image sensors, and USB On-The-Go allows the device to act as either host or peripheral. An on-chip video accelerator offloads MPEG-4/H.263 encoding/decoding, and a hardware security module provides a secure boot flow.
Technical depth: the ARM926EJ-S core is a five-stage pipeline Harvard architecture with MMU support for full Linux and Windows CE. Power management integrates dynamic voltage and frequency scaling with multiple low-power modes (Run, Wait, Doze, Stop, Standby). Operating voltage is typically 1.5V core / 1.8V/2.8V/3.3V I/O. Industrial-grade operating range is -40C to +85C.
Typical applications include portable media players, point-of-sale terminals, industrial human-machine interfaces, single-board computers, GPS personal navigation devices, and biometric/medical data terminals. The combination of LCD controller, CMOS sensor interface, and USB OTG allows system designers to build self-contained units without external companion chips.
When designing with this device, allocate generous decoupling on all supply rails and respect the 289-ball BGA keep-out regions in PCB layout. Consider the latest i.MX28 or i.MX6 parts for new designs, since the i.MX21 family has been declared End-of-Life.
This page consolidates distributor pricing, drop-in alternatives, lifecycle notes and PCB design guidance not all available on the manufacturer product page.
Alternativas drop-in para MC9328MX21CVK — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MC9328MX21CVK (mesmo formato e footprint) — diferindo em Core Architecture, Mounting Type, Package, LCD Controller, On-chip Modules.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC9328MX21CVKR2
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9328MX21CVM
✅ Drop-In✓ Em estoque
$11.4 / unidade
Ver ficha técnica →MC9328MX21DVK
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$20.62 / unidade
Ver ficha técnica →MCIMX27CVOP4A
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9328MXSCVP10
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MC9328MX21CVK Classificações máximas e características elétricas
| MPU Family | i.MX21 |
| Core Architecture | ARM926EJ-S (32-bit RISC) |
| Maximum CPU Frequency | 266 MHz |
| Number of Cores | 1 |
| Largura do barramento de dados | 32-bit |
| L1 Instruction Cache | 16 KB |
| L1 Data Cache | 16 KB |
| On-chip Modules | LCD controller, USB OTG, video accelerator, CMOS sensor interface, 1-Wire, SSI, MMC/SD, PCMCIA/CF |
| External Memory Bus | SDRAM, NOR flash, NAND flash, PCMCIA/CF |
| USB | USB On-The-Go (host + peripheral) |
| Temperatura de operação | -40C to +85C (industrial) |
| Encapsulamento | 289-LFBGA (14x14 mm) |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
| Lead-free | Yes |
Guia de Configuração de Pinos do MC9328MX21CVK 289-lfbga (14x14 mm)
Configuração de pinos para MC9328MX21CVK (pacote 289-lfbga (14x14 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MC9328MX21CVK.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MC9328MX21CVK é adequado para 6 aplicaçãos: Portable Media Player, Point-of-Sale Terminal, GPS Personal Navigation Device, Industrial Human-Machine Interface, Biometric Data Terminal, Single-Board Computer / Embedded Gateway.
Portable Media Player
The MC9328MX21CVK is well-matched to portable media players because its ARM926EJ-S core handles audio/video decoding workloads while the integrated LCD controller drives a TFT display directly and the USB OTG port allows drag-and-drop media transfer. The on-chip video accelerator offloads MPEG-4/H.263 decoding at up to 30 fps at CIF resolution, freeing the CPU for UI and audio mixing. Designers typically place the MPU with 64 MB SDRAM and 32 MB NOR/NAND flash; the chip's low-power modes enable 8-12 hours of playback on a single Li-ion cell.
Recomendado
Point-of-Sale Terminal
The MC9328MX21CVK fits POS terminals because the LCD controller drives the operator display, the CMOS sensor interface connects to a 2D barcode imager, and the USB OTG port accepts peripheral accessories such as receipt printers or customer displays. The 266 MHz ARM926EJ-S executes encryption and payment protocols with the hardware security module supporting secure boot and key storage. Operating temperature -40C to +85C covers the wider thermal envelope of POS deployments in unconditioned retail spaces.
Recomendado
GPS Personal Navigation Device
In GPS PND designs the MC9328MX21CVK drives the LCD touchscreen, interfaces with a GPS receiver over UART or SSI, and renders vector maps via the hardware-accelerated 2D engine. The 16KB/16KB cache hierarchy keeps map tile rendering responsive while the integrated LCD controller with TFT support simplifies the BOM. Real-world units typically add 32-64 MB mobile SDRAM and an MMC/SD slot for offline map storage, both of which the i.MX21 supports natively.
Recomendado
Industrial Human-Machine Interface
The MC9328MX21CVK's industrial -40C to +85C operation and integrated LCD + touchscreen interface make it a fit for factory HMI panels and equipment status displays. USB OTG enables field-service software updates via USB stick, eliminating the need for a network connection during commissioning. The MMU-supported ARM926EJ-S allows full Linux with Qt or similar toolkits; software reuse from other ARM9 designs shortens time-to-market. The 289-ball LFBGA is well-suited to high-vibration factory environments.
Recomendado
Biometric Data Terminal
The MC9328MX21CVK pairs naturally with fingerprint and palm-vein sensors because the CMOS sensor interface accepts sensor data directly without external bridge chips and the hardware security module safeguards biometric templates. The 266 MHz core runs matching algorithms in 200-400 ms for typical databases, and the USB OTG port enables enrollment upload to a host PC. Designers add an LCD + keypad for standalone operation and an encrypted SD card slot for audit logging.
Recomendado
Single-Board Computer / Embedded Gateway
Engineering single-board computers is straightforward with the MC9328MX21CVK because it exposes PCMCIA/CF, USB OTG, MMC/SD, Ethernet MAC, and multiple serial interfaces directly. Linux/WinCE BSPs from NXP accelerate boot. Power consumption is low enough to allow fanless SBC operation with a small aluminium heatsink or none at all, suitable for industrial gateways, kiosk controllers, and remote sensor aggregation devices.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC9328MX21CVK — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC9328MX21CVKR2 | MC9328MX21CVM | MC9328MX21DVK | MCIMX27CVOP4A | MC9328MXSCVP10 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Maximum CPU Frequency | 266 MHz | 266 MHz | 266 MHz | 266 MHz | up to 400-532 MHz | 100 MHz |
| Core Architecture | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S | ARM920T |
| L1 Instruction Cache | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB |
| L1 Data Cache | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB |
| USB OTG | Yes | Yes | Yes | Yes | Yes | Yes |
| LCD Controller | Yes (TFT up to SVGA) | Yes | Yes | Yes | Yes | Yes |
| Lifecycle Status | EOL | EOL | EOL | EOL | EOL | EOL |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Principais diferenciais
- EOL status with established NXP BSP (vs newer i.MX28/i.MX6 parts)
- Integrated USB OTG and 1-Wire (vs MC9328MXSCVP10 at 100 MHz)
- Same-package drop-in variants available (vs MCIMX27CVOP4A (different package))
Notas de projeto
The 289-ball LFBGA at 0.8 mm pitch demands a multi-layer PCB with controlled-impedance routing. Use at least 4 layers with dedicated power and ground planes. Escape routing under the BGA should fan-out on the top layer with microvias; avoid vias in pads when possible to reduce solder joint stress. Reference designators should be silkscreened outside the package keep-out region.
Decouple each supply rail with a 0.1 uF X7R ceramic placed as close to the corresponding ball as possible, plus a bulk 10-22 uF tantalum or polymer. The i.MX21 power sequencing requires core voltage to come up before I/O rails; verify against the datasheet sequence diagram before bringing the system out of reset. Inrush during PLL lock can exceed steady-state by 30-50%.
The LFBGA package exposes a thermal pad that must be soldered to a copper pour on the top layer connected via thermal vias to inner ground planes. Without a thermal pad, junction temperature can exceed 100C at moderate activity. Estimated: at 266 MHz core activity and 1.5V core, expect 0.5-0.9W power dissipation under typical Linux workloads; pad-attached copper pour should spread this efficiently.
Informações de conformidade
RoHS and lead-free compliance per NXP product page material declarations. AEC-Q100 not applicable - this is an applications processor, not an automotive-grade discrete. Halogen-free status not explicitly stated in retrieved data.