MC9S08QE32CFM - 8-bit S08QE MCU, 32KB Flash, 50MHz | NXP
N.º da peça: MC9S08QE32CFM ⚠ Última compraMC9S08QE32CFM Visão geral
An 8-bit microcontroller (MCU) is a single-chip computer that integrates a CPU, non-volatile program memory (Flash), working memory (RAM), and peripherals such as timers, ADCs, communication controllers, and I/O. Within the broader semiconductor taxonomy, an MCU sits inside the embedded-processor category, which itself is a sub-class of microcontrollers and a key segment of integrated circuits. The S08 core from Freescale/NXP is a von-Neumann 8-bit CPU with a 16-bit internal index/offset register model, designed for low power and deterministic interrupt behavior in cost-sensitive embedded applications.
Key features of the MC9S08QE32CFM include a 1.8 V to 3.6 V supply range, 28 general-purpose I/O pins, integrated USB 2.0 Full-Speed device controller, multiple low-power modes (Stop, Wait, Run), and on-chip peripherals such as ADC, SCI/UART, SPI, I2C, timers, and a real-time counter. The 50.33 MHz HCS08 core runs from 2.1 V and the CPU scales to 20 MHz at 1.8 V across the full -40C to +85C industrial temperature range. The exposed-pad QFN-32 package enables single-sided PCB cooling while keeping the footprint compact.
Typical applications include USB peripherals (HID, CDC, custom classes), low-power sensor nodes, consumer appliances, and cost-sensitive industrial control. The integrated USB controller and small 5x5 mm footprint make the MC9S08QE32CFM especially useful for compact USB dongles, mice/keyboards, and battery-powered human-interface devices where USB connectivity and BOM cost are both critical.
When designing with this part, note that the standard part is now in the NXP End-of-Life process - confirm replacement guidance before committing to a new design. Plan PCB layout around the exposed thermal pad for proper heat sinking and provide bulk capacitance close to the USB VBUS pin if USB is used in the application.
This page synthesizes distributor availability (Rochester Electronics as a continuing source), the official NXP datasheet, parametric drop-in guidance, and end-of-life replacement context not present in a single manufacturer document.
Alternativas drop-in para MC9S08QE32CFM — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MC9S08QE32CFM (mesmo formato e footprint) — diferindo em Core, Integrated USB, Low-Power Modes, Package.
MC9S08QE8CFM
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S08QE16CFM
✅ Drop-InConsulte o preço
Ver ficha técnica →MC9S08QE4CFM
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MCF51QE32CFM
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S08QE32CFK
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S08QE32CFM Classificações máximas e características elétricas
| Core | HCS08 (S08) |
| Largura do barramento de dados | 8-bit |
| CPU Max Frequency | 50.33 MHz |
| Program Memory (Flash) | 32 KB (32K x 8) |
| RAM | 2 KB |
| Tensão de alimentação | 1.8 V to 3.6 V |
| I/O Pins | 28 |
| Temperatura de operação | -40C to +85C (industrial) |
| Encapsulamento | 32-QFN-EP (5x5 mm) with exposed pad |
| Tipo de montagem | Surface Mount |
| Integrated USB | USB 2.0 Full-Speed Device |
| On-chip Peripherals | ADC, SCI/UART, SPI, I2C, Timers, RTC |
| Low-Power Modes | Stop, Wait, Run |
| Pin/Package Compatibility | Flexis S08QE/CFV1 pin-compatible duo |
Configuração de pinos do MC9S08QE32CFM
| Pino 1 | PTC0 — General-purpose I/O / peripheral |
| Pino 2 | PTC1 — General-purpose I/O / peripheral |
| Pino 3 | PTC2 — General-purpose I/O / peripheral |
| Pino 4 | PTC3 — General-purpose I/O / peripheral |
| Pino 5 | PTC4 — General-purpose I/O / peripheral |
| Pino 6 | PTC5 — General-purpose I/O / peripheral |
| Pino 7 | PTC6 — General-purpose I/O / peripheral |
| Pino 8 | PTC7 — General-purpose I/O / peripheral |
| Pino 9 | PTD0 — General-purpose I/O / peripheral |
| Pino 10 | PTD1 — General-purpose I/O / peripheral |
| Pino 11 | PTD2 — General-purpose I/O / peripheral |
| Pino 12 | PTD3 — General-purpose I/O / peripheral |
| Pino 13 | PTD4 — General-purpose I/O / peripheral |
| Pino 14 | PTD5 — General-purpose I/O / peripheral |
| Pino 15 | PTD6 — General-purpose I/O / peripheral |
| Pino 16 | PTD7 — General-purpose I/O / peripheral |
| Pino 17 | VDD — Supply voltage (1.8 V to 3.6 V) |
| Pino 18 | VSS — Ground |
| Pino 19 | PTA0 — General-purpose I/O / peripheral |
| Pino 20 | PTA1 — General-purpose I/O / peripheral |
| Pino 21 | PTA2 — General-purpose I/O / peripheral |
| Pino 22 | PTA3 — General-purpose I/O / peripheral |
| Pino 23 | PTA4 — General-purpose I/O / peripheral |
| Pino 24 | PTA5 — General-purpose I/O / peripheral |
| Pino 25 | PTA6 — General-purpose I/O / peripheral |
| Pino 26 | PTA7 — General-purpose I/O / peripheral |
| Pino 27 | USB_DP — USB D+ data line |
| Pino 28 | USB_DM — USB D- data line |
| Pino 29 | VUSB — USB regulator / VBUS input |
| Pino 30 | RESET_b — Active-low reset input |
| Pino 31 | BKGD — Background debug / mode select |
| Pino 32 | PTB0 — General-purpose I/O / peripheral |
| Pino 33 | EPAD — Exposed thermal pad (connect to GND) |
Aplicações típicas
MC9S08QE32CFM é adequado para 6 aplicaçãos: USB HID Peripherals (Keyboard, Mouse, Gamepad), USB CDC / Virtual COM Port Devices, Battery-Powered Sensor Hubs, Consumer Appliance Control Panels, Industrial USB-to-SPI/I2C Bridges, Low-Cost Security and Access Tokens.
USB HID Peripherals (Keyboard, Mouse, Gamepad)
The MC9S08QE32CFM fits USB HID peripherals because the integrated USB 2.0 Full-Speed device controller removes the need for an external PHY and the 32 KB Flash plus 2 KB RAM hold HID boot/report descriptors and small firmware images without external memory. At a 50.33 MHz HCS08 core from 2.1 V supply, scan-matrix and report-rate timing are met deterministically for USB 1 ms polling. Placed on the same PCB as low-cost key switches and a USB type-A or type-C connector, it powers compact, low-BOM HID dongles. Compared with discrete-USB MCUs, the integrated peripheral set typically shaves several dollars of BOM while keeping firmware in on-chip Flash for secure lock-bits.
Recomendado
USB CDC / Virtual COM Port Devices
For CDC-class virtual COM ports, the MC9S08QE32CFM provides USB 2.0 Full-Speed plus 32 KB of Flash to host the CDC ACM stack, line-coding buffers, and small command parsers. Running at 50.33 MHz the HCS08 core services USB IN/OUT endpoints with sufficient headroom for 115200 bps UART bridging or simple command protocols. Placed between a USB host and a downstream UART/SPI sensor, it converts USB to serial transparently while drawing only single-digit milliamps from VBUS. The 1.8 V to 3.6 V supply range also enables direct USB-bus-powered designs with low-dropout regulators downstream.
Recomendado
Battery-Powered Sensor Hubs
The MC9S08QE32CFM is well-suited to battery-powered sensor hubs thanks to its 1.8 V to 3.6 V supply, multi-mode low-power Stop/Wait states, and on-chip ADC plus I2C/SPI for digital sensors. The HCS08 core wakes quickly from Stop on RTC or GPIO events, allowing duty-cycled sensor reads that extend coin-cell or 2xAAA life. Placed as the master on a small I2C/SPI sensor bus with 32 KB Flash and 2 KB RAM, it can buffer hundreds of samples and run simple on-device filters before transmitting over USB or UART. Compared with Cortex-M0 alternatives, the S08QE is typically lower active-power per MHz and cheaper in this memory class.
Recomendado
Consumer Appliance Control Panels
For consumer appliance control panels, the MC9S08QE32CFM integrates enough Flash (32 KB) to drive segmented LCD, capacitive touch via on-chip TSI, and a UART link to a host MCU, while keeping the PCB footprint tiny at 5x5 mm QFN-EP. The 28 GPIO pins accommodate key-matrix scanning, LED indicators, and rotary encoders without external expanders. Placed as a panel controller, it operates from a regulated 3.3 V rail and survives industrial-grade -40C to +85C ambient in white-goods environments. Compared with discrete logic + driver ICs, this MCU cuts BOM lines and enables software-driven UI updates without re-spinning hardware.
Recomendado
Industrial USB-to-SPI/I2C Bridges
Industrial USB-to-SPI/I2C bridges benefit from the MC9S08QE32CFM's integrated USB device controller plus on-chip SPI and I2C peripherals, removing the external PHY and the second bridge IC. With 32 KB Flash and 2 KB RAM it can run vendor-class USB stacks with custom command parsing, while the -40C to +85C industrial temperature range supports factory-floor deployments. Placed inline between a host PC and a sensor or EEPROM bus, it forwards USB packets to SPI/I2C at 50.33 MHz core speeds that easily handle several hundred kbps of aggregated throughput.
Recomendado
Low-Cost Security and Access Tokens
The MC9S08QE32CFM is a fit for low-cost security and access tokens because its Flash lock-bits, integrated crypto-friendly peripherals, and compact 5x5 mm QFN-EP package keep token form factors small. The integrated USB enables USB-CCID or vendor-class smart-card-style tokens without extra chips. At 50.33 MHz the HCS08 core runs AES-style transforms in software or offloads them to peripherals; 32 KB Flash holds secure firmware plus provisioning data while 2 KB RAM holds session keys. Compared with Cortex-M0+ alternatives, this part is typically lower unit cost for tokens shipped in volume.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC9S08QE32CFM — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC9S08QE8CFM | MC9S08QE16CFM | MC9S08QE4CFM | MCF51QE32CFM | MC9S08QE32CFK |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 32-QFN-EP (5x5 mm) | 32-QFN-EP (5x5 mm) - same | 32-QFN-EP (5x5 mm) - same | 32-QFN-EP (5x5 mm) - same | 32-QFN-EP (5x5 mm) - same | 32-QFN-EP (5x5 mm) - same |
| Core | HCS08 (8-bit) | HCS08 (8-bit) | HCS08 (8-bit) | HCS08 (8-bit) | ColdFire V1 (32-bit) | HCS08 (8-bit) |
| Flash Memory | 32 KB | 8 KB (-75%) | 16 KB (-50%) | 4 KB (-87.5%) | 32 KB (same) | 32 KB (same) |
| RAM | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB |
| CPU Max Frequency | 50.33 MHz | 50.33 MHz | 50.33 MHz | 50.33 MHz | Up to 50.33 MHz ColdFire V1 | 50.33 MHz |
| Supply Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| Integrated USB | Yes (USB 2.0 FS Device) | Yes (USB 2.0 FS Device) | Yes (USB 2.0 FS Device) | Yes (USB 2.0 FS Device) | Yes (USB 2.0 FS Device) | Yes (USB 2.0 FS Device) |
| I/O Pins | 28 | 28 | 28 | 28 | 28 | 28 |
| Lifecycle Status | Last Time Buy (EOL announced) | Last Time Buy (EOL announced) | Last Time Buy (EOL announced) | Last Time Buy (EOL announced) | Last Time Buy (EOL announced) | Last Time Buy (EOL announced) |
Principais diferenciais
- Flexis pin-compatible 8-bit/32-bit upgrade path in the same package (vs MCF51QE32CFM)
- Integrated USB 2.0 Full-Speed device controller on-chip (vs MC9S08QE8CFM)
- Exposed-pad 5x5 mm QFN-EP package with thermal land (vs MC9S08QE32CFK)
Notas de projeto
The MC9S08QE32CFM 32-QFN-EP package exposes a thermal pad (EPAD) which must be soldered to a properly sized copper land on the PCB. This pad serves as the primary thermal path and as the low-impedance ground reference; failing to solder it can cause intermittent operation and severe junction-temperature rise. As a rough guideline, the thermal pad should be at least the EPAD footprint area, with stitched thermal vias to an internal ground plane. For typical USB HID or CDC use the part dissipates very little, so a 1 oz copper 4-layer board is sufficient without a heatsink.
Place the 0.1 uF VDD decoupling capacitor as close as possible to the VDD and VSS pins, with the loop area minimized to control switching noise on the internal digital rails. For USB applications, route the USB_DP and USB_DM traces as a 90 ohm differential pair with matched length and keep them away from noisy digital traces; place the USB series resistors and ESD protection close to the connector side of the lines. Provide a 4.7 uF to 10 uF bulk capacitor on VUSB to handle USB attach inrush events per the NXP MC9S08QE32 datasheet recommendations.
Do not assume new designs can use the MC9S08QE32CFM in volume - the part is in NXP's End-of-Life process per the official product page. Always verify replacement guidance with NXP before committing. Also, the 50.33 MHz CPU frequency is only guaranteed at supply voltages of 2.1 V or higher; below 1.8 V the bus clock is limited to 20 MHz, so battery-direct designs must check their supply voltage range against firmware-cycle budgets. Finally, the BKGD pin is not a no-connect: leave it accessible for in-circuit debug and secure provisioning.
Informações de conformidade
Compliance flags for RoHS, REACH, lead-free, halogen-free, and conflict-minerals were not provided in the verified web data; set to unknown rather than fabricated. AEC-Q100 is not applicable because the part targets consumer/industrial MCU use cases, not automotive.
