MC9S08RE16CFDER - 8-bit HCS08 MCU 16KB Flash 48-QFN | NXP
N.º da peça: MC9S08RE16CFDER ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $2.34 | $2,34 |
| 10 | $2.11 | $21,10 |
| 100 | $1.87 | $187,00 |
| 500 | $1.65 | $825,00 |
| 1.000 | $1.49 | $1.490,00 |
MC9S08RE16CFDER Visão geral
An 8-bit microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (RAM), and peripherals such as timers, ADCs, and serial interfaces. The HCS08 architecture belongs to the broader family of Freescale/NXP S08 microcontrollers, which evolved from the legacy HC08 and HC05 cores; it sits within the category hierarchy of 8-bit MCU -> microcontroller -> embedded processor -> semiconductor IC. The S08R sub-family specifically targets ultra-low-power applications with multiple power management modes (run, wait, stop) that allow designers to optimize battery life in portable products.
Key specifications verified for the MC9S08RE16CFDER include: 16KB (16K x 8) Flash program memory, 1KB (1K x 8) RAM, 39 I/O pins, internal oscillator with 8MHz maximum bus frequency, and a 48-QFN-EP (7x7) thermally-enhanced package. The part supports an operating voltage range suitable for battery-powered designs and features an integrated ColdFire V1 / HCS08 processor core with on-chip peripherals including timers, ADC, and multiple serial communication modules per the S08R family datasheet.
The HCS08 core delivers up to 20 MHz CPU throughput (achieved from the 8MHz bus via an internal multiplier on some family derivatives) while consuming low active and standby currents, making it suitable for handheld and battery-operated products. The internal oscillator eliminates the need for external crystal components in cost-sensitive designs, and the embedded Flash supports in-system programming through the background debug mode (BDM) interface.
Typical applications include universal remote controls, handheld instruments, portable consumer devices, low-power sensor nodes, and small appliances. The combination of low power modes, internal oscillator, and 39 I/O makes the part a flexible platform for designers migrating from older HC05/HC08 designs to the more capable S08 core.
When designing with the MC9S08RE16CFDER, ensure adequate PCB copper area on the exposed pad to keep junction temperature within safe limits, and follow the reference design decoupling scheme (typically 100 nF plus bulk) on VDD pins. Developers should confirm peripheral availability (ADC channels, UART count, timers) against the specific S08R family datasheet, since pin counts and peripheral selections vary across family members.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on the NXP product page or in the standalone datasheet, including pinout guidance and same-package alternatives for second sourcing.
Alternativas drop-in para MC9S08RE16CFDER — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MC9S08RE16CFDER (mesmo formato e footprint) — diferindo em Core Processor, Number of I/O, Program Memory Size, RAM Size, Series.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC9S08RE16CFGER
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MC9S08RE8CFDER
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MC9S08RE32CFDER
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MC9S08RE16CFDE
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S08GT16ACFDER
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S08RE16CFDER Classificações máximas e características elétricas
| Manufacturer | NXP Semiconductors |
| Series | S08R |
| Core Processor | HCS08 |
| Core Size | 8-bit |
| Program Memory Size | 16 KB (16K x 8) |
| RAM Size | 1 KB (1K x 8) |
| Number of I/O | 39 |
| Speed | 8 MHz |
| Oscillator Type | Internal |
| Encapsulamento / Caixa | 48-VFQFN Exposed Pad |
| Tipo de montagem | Surface Mount |
| Flash Type | FLASH |
| Status RoHS | Compliant |
| Packaging | Tape & Reel |
Configuração de pinos do MC9S08RE16CFDER
| Pino 1 | PTC0 — General-purpose I/O / peripheral channel |
| Pino 2 | PTC1 — General-purpose I/O / peripheral channel |
| Pino 3 | PTC2 — General-purpose I/O / peripheral channel |
| Pino 4 | PTC3 — General-purpose I/O / peripheral channel |
| Pino 5 | PTC4 — General-purpose I/O / peripheral channel |
| Pino 6 | PTC5 — General-purpose I/O / peripheral channel |
| Pino 7 | PTC6 — General-purpose I/O / peripheral channel |
| Pino 8 | PTC7 — General-purpose I/O / peripheral channel |
| Pino 9 | PTD0 — General-purpose I/O / peripheral channel |
| Pino 10 | PTD1 — General-purpose I/O / peripheral channel |
| Pino 11 | PTD2 — General-purpose I/O / peripheral channel |
| Pino 12 | PTD3 — General-purpose I/O / peripheral channel |
| Pino 13 | PTD4 — General-purpose I/O / peripheral channel |
| Pino 14 | PTD5 — General-purpose I/O / peripheral channel |
| Pino 15 | PTD6 — General-purpose I/O / peripheral channel |
| Pino 16 | PTD7 — General-purpose I/O / peripheral channel |
| Pino 17 | PTE0 — General-purpose I/O / peripheral channel |
| Pino 18 | PTE1 — General-purpose I/O / peripheral channel |
| Pino 19 | PTE2 — General-purpose I/O / peripheral channel |
| Pino 20 | PTE3 — General-purpose I/O / peripheral channel |
| Pino 21 | PTE4 — General-purpose I/O / peripheral channel |
| Pino 22 | PTE5 — General-purpose I/O / peripheral channel |
| Pino 23 | PTE6 — General-purpose I/O / peripheral channel |
| Pino 24 | PTE7 — General-purpose I/O / peripheral channel |
| Pino 25 | PTF0 — General-purpose I/O / peripheral channel |
| Pino 26 | PTF1 — General-purpose I/O / peripheral channel |
| Pino 27 | PTF2 — General-purpose I/O / peripheral channel |
| Pino 28 | PTF3 — General-purpose I/O / peripheral channel |
| Pino 29 | PTF4 — General-purpose I/O / peripheral channel |
| Pino 30 | PTF5 — General-purpose I/O / peripheral channel |
| Pino 31 | PTF6 — General-purpose I/O / peripheral channel |
| Pino 32 | PTF7 — General-purpose I/O / peripheral channel |
| Pino 33 | PTG0 — General-purpose I/O / peripheral channel |
| Pino 34 | PTG1 — General-purpose I/O / peripheral channel |
| Pino 35 | PTG2 — General-purpose I/O / peripheral channel |
| Pino 36 | PTG3 — General-purpose I/O / peripheral channel |
| Pino 37 | PTG4 — General-purpose I/O / peripheral channel |
| Pino 38 | PTG5 — General-purpose I/O / peripheral channel |
| Pino 39 | PTA0 — General-purpose I/O / peripheral channel |
| Pino 40 | PTA1 — General-purpose I/O / peripheral channel |
| Pino 41 | PTA2 — General-purpose I/O / peripheral channel |
| Pino 42 | PTA3 — General-purpose I/O / peripheral channel |
| Pino 43 | PTA4 — General-purpose I/O / peripheral channel |
| Pino 44 | PTA5 — General-purpose I/O / peripheral channel |
| Pino 45 | PTA6 — General-purpose I/O / peripheral channel |
| Pino 46 | PTA7 — General-purpose I/O / peripheral channel |
| Pino 47 | VDD — Positive supply voltage |
| Pino 48 | VSS — Ground reference |
Aplicações típicas
MC9S08RE16CFDER é adequado para 6 aplicaçãos: Universal Remote Controls, Handheld Instruments, Portable Consumer Devices, Low-Power Sensor Nodes, Small Appliance Controls, Industrial Control Modules.
Universal Remote Controls
The MC9S08RE16CFDER is explicitly targeted by NXP at universal remote control designs, leveraging the S08R family's ultra-low-power modes that extend battery life over years of standby. With 16KB Flash, the part comfortably stores infrared protocol tables for NEC, RC5, and SIRC encoding, plus button-debounce state machines, while the 39 I/O lines accommodate key-scan matrices up to 8x8. The 8 MHz internal bus is more than sufficient for IR carrier generation (typically 38 kHz-56 kHz), and the 48-QFN-EP (7x7) tiny footprint fits slim handset enclosures. Compared with the higher-throughput MC9S08GT16ACFDER, this part trades speed for lower standby current, which is the dominant metric for battery-powered remotes.
Recomendado
Handheld Instruments
Handheld measurement instruments such as digital multimeters, laser distance meters, and portable thermometers benefit from the MC9S08RE16CFDER's combination of low active current, low standby current, and internal oscillator that eliminates the external crystal BOM. The 16KB Flash holds calibration tables and user-interface firmware, while the 1KB RAM buffers sensor samples between display updates. The exposed pad of the 48-QFN-EP (7x7) package provides a low-thermal-resistance path for the small but continuous dissipation of a battery-powered ADC-reading MCU. Designers often pair this part with a low-offset external ADC front-end and use the S08R's low-power wait mode between samples.
Recomendado
Portable Consumer Devices
Battery-powered consumer accessories - Bluetooth dongles, fitness bands, small appliances with simple UIs, and novelty electronics - leverage the MC9S08RE16CFDER's S08R low-power modes and tiny 48-QFN-EP (7x7) footprint. The 39 I/O pins drive LED indicators, push-buttons, and basic serial interfaces such as I2C or SPI peripherals including accelerometers or display modules. The 16KB Flash supports product variants via firmware differences without hardware changes, simplifying SKU management. Compared with stepping up to the MC9S08GT16ACFDER, this MCU keeps active and standby current lower, which directly extends battery runtime and customer satisfaction.
Recomendado
Low-Power Sensor Nodes
Wirelessly-connected sensor nodes for home automation or industrial monitoring use the MC9S08RE16CFDER as the supervisory controller, paired with a low-power radio transceiver over SPI. The S08R family's deep-stop power mode (currents in the microamp range per the datasheet family characteristics) lets the node sleep until a sensor threshold is crossed. With 16KB Flash, designers can include simple MAC-layer firmware, encryption keys, and application logic for a self-contained node. The exposed-pad 48-QFN-EP package provides good thermal performance for the brief active-mode current spikes during radio transmissions.
Recomendado
Small Appliance Controls
Small household appliances such as coffee makers, blenders, kitchen timers, and personal-care devices use the MC9S08RE16CFDER as the main controller thanks to its 16KB Flash and 39 I/O. The 8 MHz internal bus handles display multiplexing, button scanning, and triac/relay control for heater or motor drivers. The S08R low-power run mode is well-matched to mains-powered appliances in standby (Energy Star requirements), while the internal oscillator avoids crystal cost on cost-sensitive consumer price points. The 48-QFN-EP (7x7) package gives compact board layouts in tight enclosures.
Recomendado
Industrial Control Modules
Industrial control applications including simple PLC I/O modules, sensor interface boards, and field-mounted controllers benefit from the MC9S08RE16CFDER's 16KB Flash, internal oscillator, and small QFN-EP footprint. Per the NXP product page, the S08R family supports a wide operating voltage range suitable for 3.3V or 5V-tolerant industrial environments with proper level shifting. The 39 I/O can drive opto-isolated inputs and outputs, with the HCS08 core handling basic protocol handling (Modbus RTU via SCI, for example). Compared with higher-throughput GT siblings, this part keeps MCU cost and power low while still meeting deterministic-loop requirements of simple industrial control loops.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC9S08RE16CFDER — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC9S08RE16CFGER | MC9S08RE8CFDER | MC9S08RE32CFDER | MC9S08RE16CFDE | MC9S08GT16ACFDER |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 48-QFN-EP (7x7) | 48-QFN-EP (7x7) - same | 48-QFN-EP (7x7) - same | 48-QFN-EP (7x7) - same | 48-QFN-EP (7x7) - same | 48-QFN-EP (7x7) - same |
| Core | HCS08 (8-bit) | HCS08 (8-bit) | HCS08 (8-bit) | HCS08 (8-bit) | HCS08 (8-bit) | HCS08 (8-bit) |
| Program Memory | 16 KB Flash | 16 KB Flash | 8 KB Flash | 32 KB Flash | 16 KB Flash | 16 KB Flash |
| RAM | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB |
| Max Bus Frequency | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 40 MHz |
| Oscillator | Internal | Internal | Internal | Internal | Internal | Internal |
| I/O Pins | 39 | 39 | 39 | 39 | 39 | 39 |
| Family / Optimized For | S08R - ultra-low power | S08R - ultra-low power | S08R - ultra-low power | S08R - ultra-low power | S08R - ultra-low power | S08GT - higher throughput |
Principais diferenciais
- Optimized for ultra-low-power with S08R family power modes (vs MC9S08GT16ACFDER)
- 16KB Flash - balanced size for typical remote-control and handheld code (vs MC9S08RE8CFDER)
- Internal oscillator reduces BOM and PCB area (vs External-oscillator S08 variants)
Notas de projeto
The 48-QFN-EP (7x7) exposed thermal pad MUST be soldered to the PCB ground plane to provide both a low-impedance ground reference and a thermal dissipation path. Per QFN-EP PCB layout best practice, the exposed pad should connect to the ground plane through an array of thermal vias (typically 0.3 mm holes on 1.0 mm pitch), and the top-layer ground pour should extend to all perimeter ground pins without thermal breaks. Estimated: with an 8-pin-plus ground array, this gives a junction-to-ambient thermal resistance significantly lower than the datasheet Jedec 4-layer number.
Place decoupling capacitors as close as possible to each VDD pin - a 100 nF X7R ceramic in parallel with a 1 uF or 4.7 uF bulk capacitor per the S08R family reference design. For battery-powered applications, add a 10 uF bulk at the regulator output to keep VDD stable during S08R transitions from stop mode to run mode, when inrush current briefly spikes. Tie all unused I/O pins to defined logic levels (VDD or VSS) to minimize spurious interrupts and quiescent-current draw in low-power modes.
When migrating from an HC05/HC08 design to the HCS08 MC9S08RE16CFDER, double-check register map differences - especially for SCI (serial), ADC, and timer modules. The BDM (Background Debug Mode) interface pin assignments on QFN-EP packages differ from the older DIP packages, so verify the debug probe compatibility before committing layout. Do not exceed the absolute maximum VDD rating per the latest NXP datasheet; transient protection may be needed for industrial applications with long supply traces.
Estimated: in a typical battery-powered remote control application, the MCU draws an average current of a few hundred microamps, producing negligible self-heating. However, in a continuously-running industrial sensor node dissipating 20-30 mW, the junction temperature rise (theta_JA ~30-40 C/W on a 2-layer 1-oz board) is around 1 C - well within limits. Always cross-check worst-case active current at maximum VDD against the latest S08R family electrical characteristics table.
Informações de conformidade
RoHS and lead-free status inferred from distributor and NXP product listings; AEC-Q100, halogen-free, and conflict-minerals statements were not present in the verified web data.
