MCF52210CEP66 - 32-bit ColdFire V2 MCU, 64KB Flash, USB | NXP
N.º da peça: MCF52210CEP66 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $13.5 | $13,50 |
| 10 | $12.1 | $121,00 |
| 100 | $10.45 | $1.045,00 |
| 500 | $9.2 | $4.600,00 |
| 1.000 | $8.1 | $8.100,00 |
MCF52210CEP66 Visão geral
A microcontroller (MCU) is an integrated circuit that combines a CPU core, program memory (Flash/ROM), data memory (RAM), and peripheral interfaces on a single die. The ColdFire V2 core is Freescale/NXP's RISC-descended 32-bit architecture optimized for code density and deterministic real-time performance, positioned within NXP's ColdFire family below the V3/V4 cores. The MCF52210 lineage falls in the mid-density Flash tier of the MCF522xx series, designed as a drop-in footprint option between 32-pin and 80-pin variants in the same family.
Key features include 64 KB on-chip Flash, 8 KB SRAM, an integrated USB 2.0 full-speed device/host/OTG controller, a 12-bit SAR ADC with up to 8 input channels, four 32-bit timers with PWM capability, and a fast Ethernet-friendly peripheral set. The 66 MHz core delivers approximately 56 MIPS of Dhrystone performance, with hardware multiplication and an enhanced multiply-accumulate (EMAC) unit for DSP-style arithmetic.
The MCF52210 employs a 3.3 V single-supply design with an internal voltage regulator for the core. The integrated USB OTG controller, DMA-driven FlexCAN (on select family members), and a flexible interrupt controller reduce external component count. ColdFire V2 instructions remain source-compatible upward with V3/V4 cores, allowing code migration as application needs grow. Industrial temperature grade (-40C to +85C) and the 9x9 mm QFN-EP footprint make it suitable for space-constrained industrial modules.
Typical applications include industrial USB peripherals, point-of-sale terminals, USB-to-serial bridges, embedded data loggers, and motor-control sub-modules. Automotive body controllers and HVAC interfaces can use variants in the wider MCF522xx family.
When designing with the MCF52210, ensure the USB DP/DM lines include 90-ohm differential-controlled impedance and ESD protection. Free ColdFire development tools (CodeWarrior, Eclipse-based MCU Eclipse IDE) and a USB stack from NXP simplify firmware development for this part.
This page synthesizes distributor pricing, drop-in alternatives from the same MCF5221x family, and USB-rail design considerations not found in the bare manufacturer datasheet.
Alternativas drop-in para MCF52210CEP66 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MCF52210CEP66 (mesmo formato e footprint) — diferindo em Package, Core Architecture, Supply Voltage, Data Bus Width, Program Memory Size.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MCF52211CEP66
✅ Drop-In✓ Em estoque
$10.95 / unidade
Ver ficha técnica →MCF52110CEP66
✅ Drop-In✓ Em estoque
$5.74 / unidade
Ver ficha técnica →MCF52100CEP66
✅ Drop-In✓ Em estoque
$6.1 / unidade
Ver ficha técnica →MCF52212CEP66
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MCF52210CEP66 Classificações máximas e características elétricas
| Core Architecture | ColdFire V2 (32-bit RISC) |
| Maximum CPU Frequency | 66 MHz |
| Program Memory (Flash) | 64 KB (64K x 8) |
| Tensão de alimentação | 3.3 V typical (range see datasheet) |
| Temperatura de operação | -40C to +85C (industrial) |
| Encapsulamento | 64-QFN-EP (9x9 mm) with exposed thermal pad |
| USB Interface | USB 2.0 Full-Speed Device/Host/OTG |
| Communication Interfaces | UART, I2C, SPI, USB |
| Tipo de montagem | Surface Mount |
| Tray Packaging | Tray (per AiPCBA datasheet header) |
| Status RoHS | Details available on distributor page |
| Manufacturer (Original) | Freescale Semiconductor (acquired by NXP) |
Guia de Configuração de Pinos do MCF52210CEP66 64-qfn-ep (9x9 mm) with exposed thermal pad
Configuração de pinos para MCF52210CEP66 (pacote 64-qfn-ep (9x9 mm) with exposed thermal pad). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MCF52210CEP66.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MCF52210CEP66 é adequado para 6 aplicaçãos: Industrial USB Peripherals, USB-to-Serial Bridge / Bridge Device, Point-of-Sale Terminal Sub-system, Embedded Data Logger, Industrial Sensor Hub / IoT Edge Node, Motor Control Sub-Module (Low-Power).
Industrial USB Peripherals
The MCF52210CEP66 is a strong fit for industrial USB peripherals because its integrated USB 2.0 full-speed OTG controller removes the need for an external USB PHY or companion bridge chip. At 66 MHz the ColdFire V2 core delivers enough throughput for HID-class and CDC-class USB devices while keeping firmware in 64 KB of on-chip Flash. Typical board role: place the device at the bus-end of the USB line-up, route 90-ohm differential impedance on DP/DM, and add 15 kV-rated ESD protection. The QFN-EP 9x9 mm footprint enables compact industrial-form-factor enclosures. Versus external-USB-MCU+bridge designs, the part reduces BOM count by ~3 components and simplifies USB enumeration in cold-start environments.
Recomendado
USB-to-Serial Bridge / Bridge Device
The MCF52210CEP66 fits USB-to-UART/SPI/I2C bridge applications thanks to its integrated USB controller plus 2-3 UART channels, I2C, and SPI peripherals. It eliminates the USB-IF PHD requirement of external bridges by running an on-chip CDC-class firmware stack. Typical application: USB host-side converts to RS-232/SPI master for legacy industrial equipment. 64 KB Flash holds both USB stack and bridge protocol handlers. QoS trade-off vs purpose-built bridge ASICS like FT232H: lower per-unit cost at low volume, full firmware customization, but engineers must implement USB enumeration in software rather than relying on silicon state machines.
Recomendado
Point-of-Sale Terminal Sub-system
The MCF52210CEP66 suits POS terminal sub-systems where a USB-connected local controller handles peripherals (magnetic-stripe reader, keypad, NFC front-end) and reports to a host. ColdFire V2's deterministic interrupt response and 66 MHz performance deliver low-latency I/O handling. Industrial temperature grade (-40C to +85C) meets retail-environment reliability. Typical board role: stack on top of a higher-level application processor via USB or UART; provide 3.3 V power from the main rail. The QFN-EP exposed thermal pad enables low-temperature-rise operation when the MCU drives multiple GPIOs simultaneously, and the 9x9 mm body fits within typical POS peripheral boards.
Recomendado
Embedded Data Logger
The MCF52210CEP66 fits compact data-logger designs that record to external SPI Flash or microSD via USB-host bootloader. The 66 MHz core handles multi-channel ADC sampling at up to several kS/s while the integrated USB allows stored logs to be retrieved. SRAM is sufficient to buffer one full sample burst before write-out. Trade-off vs 16-bit MSP430 loggers: higher throughput but higher active current draw. The 64-QFN-EP footprint and industrial temperature grade cover most industrial-logger enclosures. For battery-powered versions consider a low-power ColdFire variant with sleep modes.
Recomendado
Industrial Sensor Hub / IoT Edge Node
The MCF52210CEP66 is well-suited to industrial IoT edge nodes that aggregate sensor readings over I2C/SPI and forward them via USB to a gateway or host. The ColdFire V2 EMAC unit accelerates polynomial arithmetic for sensor-error-detection routines (CRC, Fletcher). ColdFire's deterministic interrupt latency (vs Cortex-M) is preferred in some industrial deterministic-control applications. Typical board role: front-end of the sensor hub; USB uplinks to an embedded Linux gateway. The part supports industrial -40C to +85C operation and fits on a 25 mm x 25 mm PCB with the 64-QFN-EP form factor.
Recomendado
Motor Control Sub-Module (Low-Power)
The MCF52210CEP66 fits low-power motor-control sub-modules (small DC, stepper, BLDC <= 1 A continuous) where its 4-channel PWM timers and quadrature-encoder inputs handle a single motor axis at up to ~30 kHz PWM without saturating the core. ColdFire V2 at 66 MHz delivers instruction headroom for trapezoidal and entry-level FOC algorithms. Pair with external MOSFET gate drivers and current-sense ADCs. Trade-off vs dedicated motor-MCUs (e.g., Kinetis KM series): more flexible peripheral mix but no integrated analog comparators; designers add external current-sense conditioning. Industrial temperature grade suits motor ambient conditions.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MCF52210CEP66 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MCF52211CEP66 | MCF52110CEP66 | MCF52100CEP66 |
|---|---|---|---|---|
| Brand | NXP Semiconductors (formerly Freescale) | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 64-QFN-EP (9x9 mm) | 64-QFN-EP (9x9 mm) - same | 64-QFN-EP (9x9 mm) - same | 64-QFN-EP (9x9 mm) - same |
| Core Architecture | ColdFire V2 (32-bit RISC) | ColdFire V2 (32-bit RISC) | ColdFire V2 (32-bit RISC) | ColdFire V2 (32-bit RISC) |
| Maximum CPU Frequency | 66 MHz | 66 MHz | 66 MHz | 66 MHz |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) |
| Supply Voltage | 3.3 V typical | 3.3 V typical | 3.3 V typical | 3.3 V typical |
Principais diferenciais
- Integrated USB 2.0 OTG without external PHY (vs MCF52110CEP66)
- Same 64-QFN-EP 9x9 mm footprint as MCF52211CEP66 (vs MCF52211CEP66)
- ColdFire V2 source-code compatibility upward (vs ARM Cortex-M Kinetis K20)
Notas de projeto
Route the USB DP/DM pair with 90-ohm differential impedance (trace width and spacing per stackup calculator). Place the ESD protection array (e.g., NXP PRTR5V0U4D or equivalent TVS) within 5 mm of the USB connector, with its ground bonded directly to the chassis/shield ground rather than the digital ground. Keep DP/DM traces matched within 150 mil length difference to maintain signal-integrity margins on the full-speed eye diagram.
The 64-QFN-EP exposed thermal pad is electrically ground. Solder it to a continuous PCB ground plane using an array of thermal vias (typically 5x5 grid of 0.3 mm drilled, 0.2 mm copper) to achieve the lowest thermal resistance. Without this, junction temperature can rise ~20C higher per watt of dissipation, reducing the operating-temperature headroom in industrial enclosures. Datasheet theta-JA vs copper area is not in the web-data summary; see packaging appendix for thermal-design tables.
Decouple VDD pins with 100 nF X7R ceramic per pin plus a single bulk 10 uF tantalum or ceramic on the regulator output. Place the 100 nF caps within 2 mm of the supply pins with wide traces to minimize series inductance. ColdFire V2 cores clock-gate internally but will draw transient current at peripheral-event boundaries; ensure the 3.3 V regulator can source 80-100 mA peaks during USB enumeration bursts.
Do not assume pin 1 is at the same corner orientation across all MCF5221x 64-QFN-EP variants - verify against the device marking and the datasheet pinout for each specific OPN (CEP66 vs CAFP66 vs other suffixes). Some suffixes change pin functions (e.g., debug-port and JTAG remapping). Also note: BDM (background-debug-mode) requires a 4-pin connection (BKPT, DSCLK, DSI, DSO); do not connect these to GPIOs without proper BDM-driver firmware considerations. Toolchain pick: CodeWarrior legacy or NXP MCUXpresso for newer projects.
Informações de conformidade
RoHS-compliant per NXP/Freescale product data; manufacturer-confirmed compliance statements available via NXP's PCN portal. MCF52210CEP66 is industrial-grade (-40C to +85C) and not AEC-Q100 automotive qualified; for automotive body/HVAC designs consider automotive-grade Freescale/NXP S12 or Kinetis parts.
