MCF5270VM100J - 100MHz ColdFire V2 MPU, 196-LBGA | NXP
N.º da peça: MCF5270VM100J ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $48.75 | $48,75 |
| 10 | $43.2 | $432,00 |
| 100 | $38.1 | $3.810,00 |
| 500 | $33.55 | $16.775,00 |
| 1.000 | $29.8 | $29.800,00 |
MCF5270VM100J Visão geral
Background: A microprocessor (MPU) is the central processing unit of an embedded system, executing instructions, managing memory, and interfacing with peripherals via internal buses. The ColdFire V2 family sits within the broader microcontroller/MPU taxonomy as a 32-bit RISC processor line optimized for cost-sensitive, power-conscious applications. It bridges 8-bit microcontroller simplicity and high-end MPU complexity, making it well suited to industrial control and connectivity nodes where deterministic interrupt response and rich connectivity matter more than raw clock frequency.
Key features of the MCF5270VM100J include 100 MHz maximum core frequency, 32-bit data path, ROMless architecture for off-chip flash/SRAM, four-channel DMA, integrated fast Ethernet MAC, USB 1.1 device interface, two CAN 2.0B controllers, three UARTs, QSPI, I2C bus, and a 4-channel 32-bit timer/PWM unit. The integrated peripherals significantly reduce external component count for connected industrial nodes.
Architecturally, the ColdFire V2 core uses a Harvard-style internal bus with separate instruction and data paths to the internal SRAM, plus a unified external bus controller that supports DRAM, SDRAM, SRAM, and flash. The on-chip SRAM is single-cycle accessible, while external memory transactions go through the bus controller. The MMU/side-band stack translation assists in real-time operating-system contexts such as uClinux and eCos, balancing deterministic interrupt latency with virtualization of system memory.
Typical applications include factory automation controllers, networked industrial gateways, building automation panels, point-of-sale terminals, and embedded web/Ethernet nodes. Designers select the MCF5270VM100J when a 32-bit ColdFire upgrade is needed for legacy 68k designs and where power-conscious operation over industrial temperature ranges is essential.
Key design consideration: at high CPU utilization (above ~80%) the core dissipates substantial power; a 4-layer PCB with a dedicated ground pour is recommended to keep junction temperature within the rated industrial operating range. Designers should also bias the unused balls to defined logic levels to reduce EMI from floating MAP-BGA pads.
This page synthesizes distributor pricing across DigiKey, Mouser, and Octopart, drop-in alternatives within the MCF527x family, and practical design notes beyond what the manufacturer datasheet alone provides.
Alternativas drop-in para MCF5270VM100J — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MCF5270VM100J (mesmo formato e footprint) — diferindo em Timers, UART, Ethernet, MSL Level, Mounting Type.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MCF5275VM100J
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MCF5274VM100J
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MCF5271CVM100J
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MCF5270VM100
✅ Drop-In✓ Em estoque
$23.12 / unidade
Ver ficha técnica →MCF5270CVM100J
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MCF5270VM100J Classificações máximas e características elétricas
| Core Architecture | ColdFire V2 (32-bit RISC) |
| Maximum Core Frequency | 100 MHz |
| Largura do barramento de dados | 32-bit |
| Program Memory Type | ROMless (external) |
| Internal SRAM | 64 KB (single-cycle) |
| Number of I/O Lines | 61 |
| Encapsulamento / Caixa | 196-LBGA (MAP-BGA, 15x15 mm) |
| Tensão de alimentação | 1.5 V core / 3.3 V I/O (typical) |
| Faixa de temperatura de operação | -40C to +85C (industrial) |
| Tipo de montagem | Surface Mount (BGA) |
| Ethernet | 10/100 Fast Ethernet MAC (integrated) |
| USB | USB 1.1 Device/Host/OTG |
| CAN | 2x CAN 2.0B controllers |
| UART | 3x UART |
| Serial Interfaces | QSPI, I2C |
| DMA | 4-channel |
| Timers | 4x 32-bit timer/PWM |
| Nível MSL | 3 (168 hours) |
| Status RoHS | Compliant |
| Packaging | Tray |
Guia de Configuração de Pinos do MCF5270VM100J 196-lbga (map-bga, 15x15 mm)
Configuração de pinos para MCF5270VM100J (pacote 196-lbga (map-bga, 15x15 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MCF5270VM100J.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MCF5270VM100J é adequado para 6 aplicaçãos: Industrial Ethernet Gateway, Factory Automation Controller, Building Automation Panel, Point-of-Sale Terminal, Connected Medical Device, Embedded Web Server / IoT Appliance.
Industrial Ethernet Gateway
The MCF5270VM100J's integrated 10/100 Fast Ethernet MAC with dedicated DMA channels makes it a strong fit for industrial Ethernet gateways. At 100 MHz the ColdFire V2 core delivers enough headroom to run a TCP/IP stack (uIP or lwIP) while the peripheral DMA offloads packet buffering. The 64 KB on-chip SRAM is sufficient for socket state and protocol tables, with external SDRAM handling bulk buffers. Designers can place the part between a PHY transceiver and a 24V industrial backplane, using the integrated CAN controllers for side-band fieldbus traffic. The wide industrial temperature range (-40C to +85C) supports cabinet-mounted installations in factory environments where ambient temperature varies with seasonal load.
Recomendado
Factory Automation Controller
For factory automation controllers the MCF5270VM100J delivers 100 MIPS of deterministic control processing while exposing two CAN 2.0B channels for fieldbus connectivity. The four-channel DMA and 32-bit timers/PWMs let the part drive motor-control loops, sensor-sampling, and actuator sequencing in parallel. Its 32-bit external bus interface can address up to 1 GB of off-chip SDRAM, enough to run eCos RTOS with multi-tasking control firmware. The 196-MAP-BGA footprint supports compact PCB designs and the 1.5 V core / 3.3 V I/O dual-rail supply simplifies interface to standard 3.3 V industrial sensors.
Recomendado
Building Automation Panel
Building automation panels benefit from the MCF5270VM100J's mix of Ethernet, USB, and CAN interfaces, which collectively replace a multichip discrete solution. The 32-bit ColdFire V2 core runs BACnet, KNX, or proprietary building protocols concurrently with user-interface code. The integrated QSPI bus supports external display-driver ICs and SPI-flash storage for firmware update banks. Power-sensitive installations (battery-backed panels) appreciate the low active power of the ColdFire V2 core relative to higher-MIPS alternatives. Industrial temperature screening ensures reliability in unconditioned electrical closets.
Recomendado
Point-of-Sale Terminal
POS terminals rely on fast encryption, peripheral connectivity, and reliable operation in retail environments. The MCF5270VM100J's 100 MHz ColdFire V2 core executes DES/AES transaction-encryption in software while the integrated Ethernet and USB drive payment-network and scanner interfaces. The 64 KB on-chip SRAM caches key tables and session state for fast transaction turnaround. The 196-MAP-BGA package supports compact board layouts typical of handheld POS hardware. Real-time clock and watchdog timer support tamper detection and long-term unattended operation.
Recomendado
Connected Medical Device
Connected medical devices need deterministic response, robust connectivity, and industrial temperature reliability. The MCF5270VM100J delivers 100 MIPS for control loops and user-interface rendering, integrated Ethernet for HL7/DICOM data exchange, and USB 1.1 for service-port diagnostics. The 32-bit external bus supports external flash-backed firmware with CRC verification. Designers should note: this part is not AEC-Q100 qualified, but its industrial temperature range and integrated peripherals make it suitable for non-life-support medical peripherals (patient monitors, infusion displays, lab analyzers).
Recomendado
Embedded Web Server / IoT Appliance
The MCF5270VM100J's integrated 10/100 MAC plus 32-bit ColdFire V2 core supports running an embedded HTTP server, MQTT client, or Modbus gateway in a small footprint. With 64 KB internal SRAM and external SDRAM expansion, the part can run an HTTPS stack with TLS handshake in firmware. Two CAN channels provide side-band communication for legacy industrial equipment. The 196-MAP-BGA package lends itself to compact appliance-style designs where mechanical ruggedness matters. uClinux-based designs benefit from the ColdFire community support still actively maintained.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MCF5270VM100J — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MCF5275VM100J | MCF5274VM100J | MCF5271CVM100J | MCF5270VM100 | MCF5270CVM100J |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same |
| Package | 196-LBGA (MAP-BGA, 15x15) | 196-LBGA (MAP-BGA, 15x15) - same | 196-LBGA (MAP-BGA, 15x15) - same | 196-LBGA (MAP-BGA, 15x15) - same | 196-LBGA (MAP-BGA, 15x15) - same | 196-LBGA (MAP-BGA, 15x15) - same |
| Core Architecture | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 |
| Maximum Clock Frequency | 100 MHz | 100-166 MHz (family) | 100-150 MHz (family) | 100 MHz | 100 MHz | 100 MHz |
| Internal SRAM | 64 KB | 64-256 KB (family) | 64-128 KB (family) | 64 KB | 64 KB | 64 KB |
| Ethernet MAC | 10/100 integrated | 10/100 integrated | 10/100 integrated | 10/100 integrated | 10/100 integrated | 10/100 integrated |
| USB Interface | USB 1.1 Device/Host/OTG | USB 1.1 Device/Host/OTG | USB 1.1 Device/Host/OTG | USB 1.1 Device/Host/OTG | USB 1.1 Device/Host/OTG | USB 1.1 Device/Host/OTG |
| Lifecycle Status | NRND | Active | Active | Active | NRND | NRND |
Principais diferenciais
- Pin-compatible higher-speed variants available in same family (vs MCF5275VM100J)
- MMU-enabled ColdFire V2 alternative for full Linux (vs MCF5271CVM100J)
- Lower-cost non-JEDEC-screening variant in identical footprint (vs MCF5270VM100)
Notas de projeto
The 196-MAP-BGA package with 1.0 mm ball pitch requires 4-layer PCB construction with micro-via-in-pad technology for production assembly reliability. The NXP hardware specification calls for matched-impedance routing on the external bus (SDRAM signals) of approximately 50 ohms. Place decoupling capacitors (0.1 uF ceramic, 4.7 uF bulk) within 5 mm of every power-pin cluster to suppress switching transients at the 100 MHz core frequency. Maintain continuous ground plane under the MAP-BGA and avoid signal routing through the BGA escape region to minimize crosstalk.
At full 100 MHz CPU utilization across the industrial temperature range, the MCF5270VM100J can dissipate approximately 0.8-1.2 W of power depending on peripheral activity. The 196-MAP-BGA package exposes no dedicated thermal pad; thermal dissipation relies on the full ball grid array plus board copper. Designers should implement at least four inner-plane thermal vias under the package center and use a 1-oz copper layer on top/bottom to spread heat. At sustained industrial-high ambient (85C), confirm derating with EDA thermal simulation before finalizing enclosure mechanicals.
Avoid floating MAP-BGA balls. Per the NXP hardware specification, every ball must connect to a defined logic level (VCC, GND, or input via resistor) to prevent shoot-through and ESD susceptibility. Do not omit external bus pull-up resistors on chip-select lines, as the default-released state without bus masters can cause spurious SDRAM transactions at power-up. Use the Boot-CFG pins to configure boot source (external flash, serial flash, or no-boot) - misconfiguration is a common reason for first-PCB bring-up failures.
Informações de conformidade
RoHS compliant per NXP product page. Not AEC-Q100 qualified (industrial MPU, not automotive grade). Lead-free BGA packaging qualified to JEDEC J-STD-020 reflow profile.
