MCF53017CMJ240J - 240MHz ColdFire V3 MPU | NXP
N.º da peça: MCF53017CMJ240J ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $19.2507 | $19,25 |
| 10 | $19.2507 | $192,51 |
| 100 | $19.2507 | $1.925,07 |
| 500 | $19.2507 | $9.625,35 |
| 1.000 | $19.2507 | $19.250,70 |
MCF53017CMJ240J Visão geral
What is a ColdFire V3 microprocessor? A ColdFire V3 microprocessor is a 32-bit embedded processor within the ColdFire family of RISC processors. It provides substantially more processing capability than a small 8-bit or 16-bit controller while integrating communication and timing resources needed by industrial control equipment. In the product hierarchy, it sits between a general-purpose microprocessor and a microcontroller-oriented system-on-chip.
The most prominent verified specifications are a 240 MHz operating frequency, 32-bit architecture, ROMless configuration, and 256-ball MAPBGA package. The part is listed as industrial temperature grade by a distributor and as last-time-buy by another result, so procurement should be planned carefully. Its 83 I/O count and broad peripheral set support connected embedded products, but the supplied data does not provide complete memory, voltage, power, or timing values.
The MCF5301x family is positioned for industrial control with embedded voice applications. Its voice-codec integration can reduce the need for a separate audio interface, while Ethernet and USB support broader connectivity. The ROMless architecture means external program memory is required according to the system memory design; exact memory-device requirements are not available in the verified data.
A critical design consideration is that this is a high-pin-count BGA device with 256 balls and a 17 mm by 17 mm footprint. Layout, routing, thermal performance, and manufacturing capability must be validated before release. The supplied evidence does not provide the complete pinout, recommended memory configuration, power-supply limits, or package thermal resistance, so those values must be confirmed from the manufacturer datasheet before schematic or PCB sign-off.
This product data combines verified distributor availability, lifecycle information, package information, and application positioning with practical sourcing and design guidance. It does not invent missing electrical parameters or claim a drop-in replacement where verified compatibility evidence is absent.
Alternativas drop-in para MCF53017CMJ240J — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MCF53017CMJ240J (mesmo formato e footprint) — diferindo em Package, Ethernet MAC, Processor Core, RoHS Status, Mounting Type.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MCF53015CMJ240J
✅ Drop-In✓ Em estoque
$22.85 / unidade
Ver ficha técnica →MCF53013CQT240
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →MCF5327CVM240J
✅ Drop-In✓ Em estoque
$15.95 / unidade
Ver ficha técnica →MPC555LFAVR40
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →MPC555LFMZP40
✅ Drop-In✓ Em estoque
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Ver ficha técnica →MCF53017CMJ240J Classificações máximas e características elétricas
| Processor Core | ColdFire V3 |
| Processor Architecture | 32-bit RISC |
| Operating Frequency | 240 MHz |
| Device Type | 32-bit ROMless microprocessor |
| Encapsulamento | 256-ball MAPBGA, 17 mm x 17 mm |
| Number of Balls | 256 |
| I/O Count | 83 |
| Temperature Grade | Industrial |
| Ethernet Connectivity | Supported |
| USB Connectivity | Supported |
| USB OTG Connectivity | Supported |
| Serial Interfaces | I2C, SPI, SSI, UART/USART |
| External Bus Interfaces | EBI/EMI and memory-card connectivity |
| Peripheral Support | DMA, PWM and watchdog timer |
| Voice Codec | Integrated voice-codec functionality |
| Status do ciclo de vida | Last Time Buy |
Guia de Configuração de Pinos do MCF53017CMJ240J 256-ball mapbga, 17 mm x 17 mm
Configuração de pinos para MCF53017CMJ240J (pacote 256-ball mapbga, 17 mm x 17 mm). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MCF53017CMJ240J.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MCF53017CMJ240J é adequado para 6 aplicaçãos: Industrial Voice Control Systems, Networked Industrial Controllers, Embedded Voice Terminals, USB-Connected Equipment, Industrial Data Acquisition, Embedded Human-Machine Interfaces.
Industrial Voice Control Systems
The MCF53017CMJ240J fits industrial voice-control equipment because it combines a 240 MHz ColdFire V3 processor with the family positioning for industrial control and embedded voice applications. Its listed voice-codec functionality can support local audio conversion while Ethernet and USB connectivity connects the controller to supervisory equipment. The ROMless architecture makes external program-memory design part of the system architecture, so engineers should verify memory-interface requirements before schematic capture. Its 256-ball MAPBGA also demands controlled PCB routing and assembly capability.
Recomendado
Networked Industrial Controllers
The MCF53017CMJ240J is suitable for connected industrial controllers requiring 32-bit processing and multiple communication paths. Ethernet, UART/USART, SPI, SSI, I2C, USB, and USB OTG are listed in the verified product data, enabling integration with sensors, operator interfaces, storage, and service equipment. The 240 MHz core provides processing headroom for control logic, while the 83 I/O count supports external interfaces. Exact peripheral electrical limits and memory timing remain datasheet-dependent.
Recomendado
Embedded Voice Terminals
An embedded voice terminal can use MCF53017CMJ240J for application processing and audio-related integration because the verified family description specifically identifies industrial control with embedded voice. The ColdFire V3 core operates at 240 MHz, while the listed connectivity supports system-level links to storage, service interfaces, and network equipment. Designers should treat the voice codec as a family-level feature until the exact MCF53017CMJ240J signal details are confirmed in the manufacturer datasheet.
Recomendado
USB-Connected Equipment
MCF53017CMJ240J can fit USB-connected equipment where a high-performance 32-bit processor is needed alongside USB and USB OTG support. The verified data also lists UART/USART, I2C, SPI, and SSI, allowing the same device to connect local peripherals and an external host or service interface. The part is ROMless, so storage architecture and boot behavior must be designed explicitly. Its 256-ball package requires a capable assembly and inspection flow.
Recomendado
Industrial Data Acquisition
The MCF53017CMJ240J is a candidate for industrial data-acquisition equipment requiring 32-bit processing and multiple peripheral interfaces. Its listed EBI/EMI, memory-card, SPI, SSI, I2C, UART/USART, Ethernet, and USB connectivity can connect sensors, local storage, and supervisory systems. The 240 MHz core and 83 I/O provide a substantial processing and interface foundation, although timing, voltage, and external-memory limits are not included in the verified sources.
Recomendado
Embedded Human-Machine Interfaces
MCF53017CMJ240J can support a human-machine interface that combines local control logic with Ethernet, USB, serial, or memory-card connectivity. The ColdFire V3 processor provides a 32-bit RISC platform at 240 MHz, while the listed DMA, PWM, and watchdog resources support responsive control and system monitoring. Because the device is supplied in a 256-ball MAPBGA, display and touch-interface boards must account for BGA assembly, escape routing, and thermal verification before production.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MCF53017CMJ240J — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MCF53015CMJ240J | MCF53013CQT240 | MCF5327CVM240J | MPC555LFAVR40 | MPC555LFMZP40 |
|---|---|---|---|---|---|---|
| Brand | NXP | NXP | NXP | NXP | NXP | NXP |
Principais diferenciais
- MCF53017CMJ240J is explicitly positioned for industrial control with embedded voice (vs MCF53015CMJ240J)
- Verified connectivity set for connected embedded designs (vs MCF53013CQT240)
- 240 MHz 32-bit RISC processing with 83 I/O (vs MCF5327CVM240J)
- Industrial-grade application positioning (vs MPC555LFAVR40)
Notas de projeto
The MCF53017CMJ240J uses a 256-ball MAPBGA, so the PCB footprint must be created from the current manufacturer package drawing rather than inferred from a distributor family name. Confirm ball numbering, pad geometry, solder-mask definition, paste stencil design, and assembly tolerances before release. The supplied data confirms a 17 mm by 17 mm package but does not provide the complete ball map or recommended land pattern.
Thermal design cannot be finalized from the supplied records because MCF53017CMJ240J operating voltage, core current, package thermal resistance, and maximum junction temperature are not provided. Before production, obtain the manufacturer electrical characteristics and calculate worst-case dissipation for the actual clock, memory, I/O, and peripheral load. Use PCB thermal relief and enclosure temperature data to determine whether the BGA requires additional copper or heat sinking.
Because this is a ROMless 240 MHz processor, external program-memory and I/O power requirements must be treated as a complete memory-subsystem design problem. Confirm supply rails, sequencing, decoupling, input thresholds, and external-memory timing from the manufacturer datasheet. Do not infer voltage ranges from related MCF5301x parts or distributor descriptions; the verified sources do not provide operating voltage.
Do not treat the MCF53015CMJ240J, MCF53013CQT240, MCF5327CVM240J, MPC555LFAVR40, or MPC555LFMZP40 listings as drop-in parts merely because they appear in the same broad embedded-processor ecosystem. The supplied cross-reference results do not prove identical ball mapping, memory interfaces, electrical limits, peripherals, boot behavior, or software compatibility. Validate each candidate against the official package and migration documentation.
Plan the BGA escape routing early and preserve access to test points for power rails, reset, clocks, and key communication interfaces. Keep high-speed or sensitive routes away from noisy switching regions once the complete power and signal specifications are available. Because pin functions and recommended layout guidance are not included in the supplied data, follow the manufacturer reference design and hardware manual during implementation.
Informações de conformidade
The supplied verified results identify industrial temperature grade and last-time-buy status but do not provide RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declarations. These fields must be confirmed from current NXP documentation or the supplier.