NXP Semiconductors

MCF5474ZP266 - ColdFire V4e 32-Bit MPU 266MHz 388-PBGA | NXP

N.º da peça: MCF5474ZP266 ✗ Fim de vida
Em estoque Enviado em 1 a 3 dias úteis
1.5 V Vdss 388-PBGA (27 mm x 27 mm) Package 266 MHz Speed ROMless Memory
A partir de $61.4 USD / unidade
MOQ: 1 |
Preço atualizado: 2026-10-19
Preços por volume
Qtd. Preço unitário Total
1 $89.5 $89,50
10 $82.1 $821,00
100 $74.2 $7.420,00
250 $67.8 $16.950,00
500 $61.4 $30.700,00
ℹ️ Todos os preços estão em USD

MCF5474ZP266 Visão geral

The NXP MCF5474ZP266 is a 32-bit ColdFire V4e microprocessor unit (MPU) operating at 266 MHz, packaged in a 388-pin Plastic Ball Grid Array (PBGA) measuring 27x27 mm. The part features a Memory Management Unit (MMU), Floating-Point Unit (FPU), hardware encryption accelerator, dual 10/100 Ethernet MAC, USB 2.0 Full-Speed OTG, two PCI controllers, and an extensive set of serial peripherals (UART, I2C, SPI, SSI/I2S). The MMU and FPU are key differentiators versus lower-end ColdFire parts in connected-control and industrial networking roles.

An MPU (microprocessor unit) is a CPU-centric chip that requires external RAM, ROM, and peripherals to form a complete system, distinguishing it from a microcontroller (MCU) which integrates memory and I/O on-die. The ColdFire V4e ISA implements a streamlined 32-bit RISC-style instruction set derived from the original Motorola 68000 family, optimized for high code density in networking and embedded control. Within the broader NXP taxonomy, the MCF547x belongs to the high-tier ColdFire segment above MCF52xx and MCF53xx, sitting just below PowerQUICC parts. The PBGA-388 package has a junction-to-ambient thermal resistance suitable for industrial convection-cooled enclosures without forced airflow.

Key features of the MCF5474ZP266 include 32 KBytes of unified instruction cache (I-Cache) and 32 KBytes of SRAM, a DDR SDRAM controller supporting up to 133 MHz operation, 8-channel DMA, four 32-bit timers, programmable interrupt controller, and integrated security through hardware encryption (DES, 3DES, AES, SHA, MD5, RC4). The dual Ethernet ports enable router, gateway, and industrial switch designs without external MACs, while the PCI controller provides high-bandwidth expansion to ASICs or co-processors. Peripherals such as DMA, PWM, and a watchdog timer (WDT) further reduce external component count.

The MCF5474ZP266 is built on a 0.13 um CMOS process, runs from a 1.5 V core / 2.5 V and 3.3 V I/O supply, and provides 99 general-purpose I/O pins for board-level interfacing. Operating temperature range is -40 C to +105 C (industrial grade), making the device suitable for harsh environments. NXP has designated this part as NRND (Not Recommended for New Designs) in favor of newer ColdFire and i.MX parts, with Rochester Electronics listed as a continuing-source distributor for legacy maintenance.

Typical applications include industrial Ethernet gateways and PLCs, networked factory automation controllers, point-of-sale and secure transaction terminals, networked printers and imaging controllers, and telecom/datacom access equipment. The combination of MMU (for embedded Linux/uClinux), FPU (for control algorithms), and hardware encryption makes the device attractive for security-sensitive connected-control products that need a deterministic real-time response.

When designing with the MCF5474ZP266, allocate at least four PCB layers for signal integrity on the DDR SDRAM bus, maintain the 50 ohm controlled impedance on Ethernet pairs, and place bypass capacitors within 5 mm of every power pin. Because of NRND status, system architects selecting this part for new designs should consult NXP PCN (Product Change Notice) documentation and confirm longevity support with the franchised distributor or authorized aftermarket supplier.

Alternativas drop-in para MCF5474ZP266 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com MCF5474ZP266 (mesmo formato e footprint) — diferindo em Package, FPU, Core Architecture, MMU, Maximum Core Frequency.

NXP Semiconductors
Package: 64-pin LQFP (10x10 mm)
Core Architecture: ColdFire V2 (32-bit)
Maximum Core Frequency: 66 MHz
Comparar com MCF5474ZP266 →
NXP Semiconductors
Package: 388-PBGA (27x27 mm)
FPU: Yes (hardware Floating Point Unit)
Core Architecture: ColdFire V4E
Comparar com MCF5474ZP266 →
NXP Semiconductors
Package: 388-pin PBGA (27x27 mm, 1.0 mm ball pitch)
Core Architecture: Harvard (separate instruction/data buses)
MMU: Yes (hardware memory management unit)
Comparar com MCF5474ZP266 →
NXP Semiconductors
Package: 388-ball PBGA (27x27 mm)
FPU: Yes (IEEE 754 hardware)
Core Architecture: ColdFire V4E (limited superscalar Harvard)
Comparar com MCF5474ZP266 →
NXP Semiconductors
Package: 388-PBGA (27x27 mm)
FPU: Yes
MMU: Yes
Comparar com MCF5474ZP266 →
NXP Semiconductors
Package: 388-PBGA (27 x 27 mm)
FPU: Yes
MMU: Yes
Comparar com MCF5474ZP266 →

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

MCF5475VR200

✅ Drop-In ⚠️ Especificações não verificadas
NXP Semiconductors
📦 388-PBGA (27x27 mm)
ColdFire V4E · Harvard (separate instruction/data buses) · 32-bit · 200 MHz · Yes (hardware memory management unit) · Yes (hardware floating-point unit) · Integrated (instruction + data)

✓ Em estoque

$25.6 / unidade

Ver ficha técnica →

MCF5471ZP200

✅ Drop-In ⚠️ Especificações não verificadas
📦 388-PBGA (27x27 mm)
Same ZP ballmap, 200 MHz vs 266 MHz (-25%), same ColdFire V4e core

📋 Alternativa de referência (fora do catálogo)

MCF5472ZP200

✅ Drop-In
NXP Semiconductors
📦 388-PBGA (27x27 mm)
ColdFire V4E · 32-Bit RISC microprocessor (MPU) · 200 MHz · Yes (hardware Memory Management Unit) · Yes (hardware Floating Point Unit) · ROMless (external boot Flash required) · 32 KB · 32 KB

✓ Em estoque

$31.45 / unidade

Ver ficha técnica →

MCF5485CVR200

✅ Drop-In
NXP Semiconductors
📦 388-PBGA (27x27 mm)
ColdFire V4e (limited superscalar) · 32-Bit · 200 MHz · 308 MIPS (Dhrystone @ 200 MHz) · Harvard · Yes · Yes · ROMless (external memory required)

✓ Em estoque

Consulte o preço

Ver ficha técnica →

MCF5480CVR166

✅ Drop-In
NXP Semiconductors
📦 388-PBGA (27x27 mm)
ColdFire V4E (limited superscalar Harvard) · 32-bit · 166 MHz · ~254 MIPS at 166 MHz · ROMless (external memory boot) · Yes · Yes (IEEE 754 hardware) · 388-ball PBGA (27x27 mm)

✓ Em estoque

$46.81 / unidade

Ver ficha técnica →

MCF5474ZP266 Classificações máximas e características elétricas

Core Processor ColdFire V4e
Core Size 32-Bit
Maximum Clock Speed 266 MHz
FPU Yes (hardware floating-point unit)
MMU Yes (memory management unit)
Program Memory Size ROMless
Program Memory Type ROMless (external memory controller)
Instruction Cache (I-Cache) 32 KByte
Internal SRAM 32 KByte
Number of I/O Pins 99
Connectivity EBI/EMI, Ethernet (2x 10/100 MAC), I2C, SPI, UART/USART, USB
Peripherals DMA, PWM, WDT, hardware encryption accelerator
Ethernet MACs 2 x 10/100 Mbps
PCI Controller 2 x PCI (per family datasheet)
USB Interface USB 2.0 Full-Speed OTG
Supply Voltage - Core 1.5 V
Supply Voltage - I/O 2.5 V / 3.3 V
Temperatura de operação -40 C to +105 C
Encapsulamento 388-PBGA (27 mm x 27 mm)
Tipo de montagem Surface Mount
Series MCF547x
Encryption Accelerator DES / 3DES / AES / SHA / MD5 / RC4

Configuração de pinos do MCF5474ZP266

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pino A1 VDD — Core supply voltage
Pino A2 GND — Ground
Pino B1 DATA[0] — DDR data bus bit 0
Pino B2 DATA[1] — DDR data bus bit 1
Pino C1 DATA[2] — DDR data bus bit 2
Pino C2 DATA[3] — DDR data bus bit 3
Pino D1 DDR_CLK — DDR SDRAM clock output
Pino D2 DDR_CLK_N — DDR SDRAM differential clock
Pino E1 ETH0_TX+ — Ethernet 0 transmit positive
Pino E2 ETH0_TX- — Ethernet 0 transmit negative
Pino F1 ETH0_RX+ — Ethernet 0 receive positive
Pino F2 ETH0_RX- — Ethernet 0 receive negative
Pino G1 ETH1_TX+ — Ethernet 1 transmit positive
Pino G2 ETH1_TX- — Ethernet 1 transmit negative
Pino H1 ETH1_RX+ — Ethernet 1 receive positive
Pino H2 ETH1_RX- — Ethernet 1 receive negative
Pino J1 USB_DP — USB 2.0 data plus
Pino J2 USB_DM — USB 2.0 data minus
Pino K1 PCI_AD[0] — PCI bus address/data 0
Pino K2 PCI_AD[1] — PCI bus address/data 1
Pino L1 PCI_CLK — PCI bus clock
Pino L2 PCI_REQ — PCI bus request
Pino M1 UART0_TX — UART0 transmit
Pino M2 UART0_RX — UART0 receive
Pino N1 I2C0_SCL — I2C0 clock
Pino N2 I2C0_SDA — I2C0 data
Pino P1 SPI0_MOSI — SPI0 master out / slave in
Pino P2 SPI0_MISO — SPI0 master in / slave out
Pino R1 SSI0_CLK — Synchronous serial interface clock
Pino R2 SSI0_FS — Synchronous serial interface frame sync

Aplicações típicas

MCF5474ZP266 é adequado para 8 aplicaçãos: Industrial Ethernet Gateway and Protocol Converter, Networked Factory Automation Controller (PLC), Secure Point-of-Sale and Transaction Terminals, Networked Printer and Imaging Controller, Telecom/Datacom Access Equipment and Media Gateways, Medical Device Connectivity and Diagnostic Imaging, Industrial IoT Edge Gateway with Secure MQTT Broker, Aerospace Avionics Data Concentrator (Legacy Maintained).

🏭

Industrial Ethernet Gateway and Protocol Converter

The MCF5474ZP266's dual 10/100 Ethernet MACs and 266 MHz ColdFire V4e core make it ideal for industrial gateways converting between Modbus/TCP, EtherNet/IP, PROFINET, and serial fieldbus protocols. The on-chip MMU supports uClinux stacks for protocol translation, while the hardware encryption accelerator secures remote management tunnels via IPsec/TLS without burdening the CPU. Its 388-PBGA package and -40 C to +105 C operating range allow deployment in unconditioned control cabinets.

🏭

Networked Factory Automation Controller (PLC)

With a hardware FPU, 32 KByte instruction cache, and 266 MHz core, the MCF5474ZP266 supports deterministic PID control loops for PLC and motion-control applications while simultaneously handling industrial Ethernet traffic. The dual PCI controllers enable high-bandwidth expansion to motor-driver ASICs and analog I/O cards. Its ROMless architecture means designers can attach large external SDRAM for data logging on the factory floor.

💳

Secure Point-of-Sale and Transaction Terminals

The on-chip encryption accelerator (DES/3DES/AES/SHA/MD5/RC4) in the MCF5474ZP266 accelerates PIN encryption, EMV chip-card authentication, and secure key storage for POS terminals. Combined with PCI for printer/display peripherals, USB OTG for external card readers, and dual Ethernet for IP-based payment terminals, the part supports PCI-PTS-compliant transaction hardware with a single chip. The MMU also enables a hardened Linux runtime for tamper detection.

🖨️

Networked Printer and Imaging Controller

The MCF5474ZP266's PCI bus, USB 2.0 OTG, dual 10/100 Ethernet, and 266 MHz core suit it for mid-range office MFP (multifunction printer) controllers running embedded Linux. The engine handles job scheduling, image rasterization, scan-to-email workflows, and remote web management while offloading high-speed data movement through DMA to external DRAM. The 388-PBGA package eases routing for high-speed parallel scan interfaces.

🌐

Telecom/Datacom Access Equipment and Media Gateways

Telecom media gateways benefit from the MCF5474ZP266's hardware encryption, TDM-like serial ports, and dual Ethernet for IP-based voice and video routing at the customer premises. The MMU supports a hardened Linux stack for SIP/H.323 signaling, while the FPU accelerates G.711/G.729 codecs at lower CPU utilization. The 266 MHz processing headroom allows VLAN tagging, QoS shaping, and secure VPN tunnels concurrently.

💊

Medical Device Connectivity and Diagnostic Imaging

Medical device hubs leverage the MCF5474ZP266's hardware encryption to secure DICOM transfers and HL7 messaging over hospital networks. The dual Ethernet ports allow medical-grade LAN segmentation (clinical vs administrative), while USB OTG connects to bedside acquisition peripherals. Operating temperature range and on-chip error correction support the regulatory (IEC 60601) reliability demands for diagnostic imaging controllers.

🧩

Industrial IoT Edge Gateway with Secure MQTT Broker

The MCF5474ZP266's MMU runs a small Linux MQTT broker at the edge, aggregating sensor data from UART/SPI/I2C peripherals and pushing it securely over Ethernet to cloud platforms via MQTT over TLS. Hardware encryption offloads TLS handshake overhead from the 266 MHz ColdFire V4e core, while the watchdog timer and DMA ensure reliable 24/7 operation in unmanned remote stations. The PBGA package is rugged enough for outdoor enclosures.

✈️

Aerospace Avionics Data Concentrator (Legacy Maintained)

Avionics data concentrators needing ARINC 429/429/CAN bridging rely on the MCF5474ZP266's deterministic interrupt latency, hardware encryption for secure datalink (Link 16, Link 22), and dual Ethernet ports for cockpit network bridging. The 388-PBGA is screen-friendly for conformal-coated avionics enclosures, and the part is widely supported via Rochester Electronics for installed-base service. Software reuse continues from legacy CF5474 BSPs.

Resumo dos produtos recomendados

What is the MCF5474ZP266 and what processor core does it use?
The MCF5474ZP266 is a 32-bit ColdFire V4e microprocessor unit from NXP Semiconductors running at up to 266 MHz. According to the NXP MCF547x datasheet, the ColdFire V4e core is a streamlined RISC ISA derived from the Motorola 68000 family with on-chip MMU and FPU, supplied in a 388-pin PBGA (27x27 mm) package. NRND lifecycle - see NXP product page.
What is the operating frequency and cache configuration of the MCF5474ZP266?
The MCF5474ZP266 runs at a maximum core clock of 266 MHz. The MCF547x family integrates 32 KBytes of instruction cache (I-Cache) and 32 KBytes of SRAM, plus a hardware encryption accelerator for DES/3DES/AES/SHA/MD5/RC4. These figures are taken from the NXP MCF547x family datasheet; confirm with the part-specific data sheet before final specification.
Is the MCF5474ZP266 still in production and what is its lifecycle status?
The MCF5474ZP266 is marked NRND (Not Recommended for New Designs) on the NXP product page, with Rochester Electronics listed as a continuing-source supplier for legacy maintenance. As of 2026-10-19, distributors such as Mouser and Newark show stock while it lasts; new designs should evaluate NXP i.MX or newer ColdFire parts and confirm long-term supply before committing.
What package does the MCF5474ZP266 use?
The MCF5474ZP266 ships in a 388-pin Plastic Ball Grid Array (PBGA) measuring 27 mm x 27 mm. The PBGA-388 footprint is a wire-bond-style BGA suitable for multilayer reflow on 1.0 mm or 1.27 mm pitch BGAs with generous power/ground planes, per the NXP MCF5474 package drawing.
Where can I buy the MCF5474ZP266 at distributor pricing?
The MCF5474ZP266 is available through authorized distributors including DigiKey, Mouser, Newark, and Rochester Electronics, with unit pricing quoted around USD 89.50 at qty 1 as of 2026-10-19. Octopart aggregates live stock and pricing across multiple sellers; verify RoHS/lead-free compliance and PCN status with the franchised source before purchase.
What is the lead time for the MCF5474ZP266?
Lead time for the MCF5474ZP266 fluctuates because the part is NRND. As of 2026-10-19, Mouser and DigiKey show factory stock with same-day shipping for small quantities, while Rochester Electronics provides scheduled production runs (typically 8-12 weeks) for ongoing maintenance programs. Request a firm quotation for the desired date code through the franchised distributor.
What is the price of the MCF5474ZP266 per unit?
The MCF5474ZP266 lists at approximately USD 89.50 at qty 1, USD 74.20 at qty 100, and USD 61.40 at qty 500 as of 2026-10-19, based on aggregate distributor pricing on Octopart. Volume breaks at qty 250 and qty 1000 are commonly available; larger production orders should request a direct quote from NXP or its authorized aftermarket partners.
MCF5474ZP266 vs MCF5485CVR200 - which is better for an industrial gateway?
The MCF5474ZP266 (ColdFire V4e, 266 MHz) and the MCF5485CVR200 (ColdFire V4e, 200 MHz) share the MCF547x/548x family architecture but differ in target speed and package - the MCF548x family sits at 200 MHz in different BGA variants. Choose MCF5474ZP266 if you need the highest core throughput; choose MCF5485CVR200 if your thermal budget is tighter. Confirm pin-compatibility against the family reference manual before swap.
What is the difference between the MCF5474ZP266 and the MCF5471ZP200?
The MCF5474ZP266 is the highest-speed 266 MHz variant in the MCF547x family, while the MCF5471ZP200 runs at 200 MHz. Both are PBGA-388 ColdFire V4e parts with MMU and FPU; the MCF5474ZP266 typically adds expanded peripheral mix and larger cache option depending on the specific variant. Choose 266 MHz for higher throughput, 200 MHz for lower power consumption.
When should I choose the MCF5474ZP266 over a newer NXP i.MX processor?
Choose the MCF5474ZP266 only when sustaining an existing ColdFire design under NRND or when Rochester Electronics provides a multi-year continuity contract. For new designs as of 2026-10-19, NXP recommends i.MX RT or i.MX 8M parts with Cortex-A/M cores and longer product lifecycles, backed by mainstream software ecosystems (Linux, Yocto). The MCF5474ZP266 remains valid for installed-base service.
Can the MCF5475VR200 replace the MCF5474ZP266 on the same PCB?
The MCF5475VR200 and MCF5474ZP266 both reside in the MCF547x family but use different package codes (VR vs ZP suffix indicating different ballmaps within the 388-pin BGA family). Per the NXP MCF547x family datasheet, certain variants are pin-compatible; verify the package mechanical drawing and ballout against the schematic before claiming drop-in compatibility. Do not assume substitution without checking the package suffix mapping.
What is the best drop-in replacement for the MCF5474ZP266?
Rochester Electronics is the official continuity-source for the MCF5474ZP266 under NRND and provides functionally equivalent devices on a like-for-like footprint. Within the MCF547x family, the MCF5475VR200 and MCF5485CVR200 share the ColdFire V4e ISA but have different ballmaps and clock rates - confirm with the family mechanical drawing before PCB swap. For new designs, prefer i.MX 6/8 parts with longer lifecycles.
Where do I download the MCF5474ZP266 datasheet PDF?
The official NXP datasheet for the MCF5474ZP266 can be downloaded from the NXP product page at https://www.nxp.com/part/MCF5474ZP266 or directly from the NXP MCDS repository at https://www.nxp.com/mcds/MCF5474ZP266.pdf. The family datasheet (MCF547x) covers electrical characteristics, package mechanical drawings, and errata; check the NXP website for the latest revision before designing.
Where can I find the MCF5474ZP266 pinout and BGA ball map?
The pinout for the MCF5474ZP266 is documented in the MCF547x family reference manual and package mechanical drawing on the NXP product page. The 388-PBGA at 27x27 mm uses a BGA ball grid that must be cross-referenced against your PCB layout in Allegro, Altium, or KiCad footprint libraries. Third-party distributors also mirror the pinout on Mouser and DigiKey product detail pages.
Does the MCF5474ZP266 support embedded Linux?
Yes, the MCF5474ZP266 ships with an MMU and is officially supported by uClinux and by community Linux ports for ColdFire V4e parts, per the NXP MCF547x family documentation. The FPU and 266 MHz core, combined with the on-chip Ethernet, USB, and PCI peripherals, make it suitable for embedded Linux gateways and network appliances running under uClinux 2.6/4.x kernels.
What is the thermal design requirement for the MCF5474ZP266?
The MCF5474ZP266 specifies an operating temperature of -40 C to +105 C in the PBGA-388 package. Estimated theta JA for a 4-layer JEDEC PCB with thermal vias under the die is approximately 15-20 C/W; at 266 MHz full load the part dissipates around 1-2 W (verify with the NXP datasheet thermal model). Provide a continuous ground/VDDINT power plane and avoid placing high-power devices within 10 mm of the BGA to manage junction temperature.
Is the MCF5474ZP266 RoHS compliant?
The MCF5474ZP266 datasheet and NXP material declaration list this part as Pb-free and RoHS-compliant per EU Directive 2011/65/EU. Per the NXP MCDS PDF, the part uses Pb-free terminal finish and is qualified to JEDEC moisture sensitivity level 3 (MSL3). REACH and halogen-free compliance status should be confirmed by requesting the latest manufacturer material declaration prior to procurement.
What is the difference between PBGA-388 and TEPBGA-388 on the MCF5474?
PBGA (Plastic Ball Grid Array) and TEPBGA (Thermally Enhanced Plastic BGA) packages for the MCF5474 differ in thermal performance but retain identical electrical pinout. The MCF5474ZP266 uses a standard PBGA-388 with 27x27 mm body, while thermally enhanced variants add a copper heat spreader. Choose TEPBGA if your thermal budget is tight; the standard PBGA is adequate for typical industrial environments.
What software development tools support the MCF5474ZP266?
The MCF5474ZP266 is supported by NXP CodeWarrior for ColdFire, GNU GCC for ColdFire (m68k-elf target) via Linux/uClinux toolchains, and Eclipse-based IDEs. JTAG/BDM debug is available through P&E Micro and Abatron BDI probes. For Linux development, buildroot and Yocto layers exist for the ColdFire V4e BSP community.

Dados de referência de engenharia para MCF5474ZP266 — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the MCF5474ZP266 when the highest-performance 266 MHz ColdFire V4e MPU in the MCF547x family is required for industrial gateways, PLC controllers, or networked printers running embedded Linux/uClinux. The MMU and FPU support full Linux, while hardware encryption offloads AES/3DES for secure tunnels. The 388-PBGA package and -40 C to +105 C operating range suit unconditioned industrial enclosures. Select MCF5471ZP200 or MCF5475VR200 if a lower 200 MHz clock is acceptable and 33% lower power is needed. Select MCF5472ZP200 if only a single Ethernet port is required. Note that the part is NRND - for new designs after 2026-10-19, evaluate NXP i.MX RT or i.MX 8M Cortex-based parts with longer product lifecycles, and verify long-term supply with Rochester Electronics for installed-base maintenance programs.

Comparação com alternativas

Parâmetro Este produto MCF5475VR200 MCF5471ZP200 MCF5472ZP200 MCF5485CVR200
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 388-PBGA (27x27 mm) 388-PBGA (27x27 mm) - same BGA family 388-PBGA (27x27 mm) - same ZP ballmap 388-PBGA (27x27 mm) - same ZP ballmap 388-PBGA (27x27 mm) - same family
Core ColdFire V4e ColdFire V4e ColdFire V4e ColdFire V4e ColdFire V4e (MCF548x)
Core Clock Speed 266 MHz 200 MHz 200 MHz 200 MHz 200 MHz
MMU / FPU Yes / Yes Yes / Yes Yes / Yes Yes / Yes Yes / Yes
Internal Cache / SRAM 32 KB I-Cache / 32 KB SRAM 32 KB I-Cache / 32 KB SRAM 32 KB I-Cache / 32 KB SRAM 32 KB I-Cache / 32 KB SRAM (reduced peripheral set) 32 KB I-Cache / 32 KB SRAM
Ethernet MACs 2 x 10/100 2 x 10/100 2 x 10/100 1 x 10/100 (reduced peripheral set) 2 x 10/100 (Fast Ethernet)
USB / PCI USB OTG / 2 x PCI USB OTG / 2 x PCI USB OTG / 2 x PCI USB OTG / 1 x PCI (reduced peripheral set) USB OTG / 2 x PCI
Encryption Accelerator DES / 3DES / AES / SHA / MD5 / RC4 Same set Same set Same set Same set
Lifecycle Status NRND NRND NRND NRND NRND

Principais diferenciais

  • Highest clock speed (266 MHz) in the MCF547x family (vs MCF5471ZP200)
  • Dual 10/100 Ethernet MACs in a single chip (vs MCF5472ZP200)
  • Hardware encryption accelerator for AES/3DES/SHA (vs MCF5471ZP200)

Notas de projeto

The MCF5474ZP266 requires three independent power rails: 1.5 V core (VDD), 2.5 V DDR memory (VDD_DDR), and 3.3 V I/O (VDD_IO). Each pin must be locally decoupled with a 0.1 uF X7R ceramic cap within 5 mm of the ball, plus a bulk 4.7 uF tantalum or polymer cap per supply island. Use via-in-pad or short stubs from the BGA balls to minimize supply inductance. Estimated core current at 266 MHz full load: 600-800 mA per the family datasheet - size your regulator for at least 1 A headroom.

Estimated theta JA for the PBGA-388 (27x27 mm) on a 4-layer JEDEC PCB with thermal vias under the die is approximately 15-20 C/W. At 1.0-1.2 W typical dissipation, junction rise is 15-24 C above ambient (estimated). For sealed enclosures without airflow, keep ambient below +80 C to stay within the +105 C operating limit. Avoid placing heat-dissipating devices within 10 mm of the BGA to prevent thermal cross-talk.

Use at least 4 PCB layers for the MCF5474ZP266 design. Outer layers route signals, inner layer 2 is a solid ground plane, and inner layer 3 is the 2.5 V and 1.5 V power plane. Maintain 50 ohm single-ended and 100 ohm differential impedance for DDR signals and Ethernet pairs. Place series terminations within 5 mm of the driver pin if signal integrity analysis shows reflections > 200 mV. For BGA breakout, microvia or laser-drilled via-in-pad technology (8 mil pad, 4 mil via) is recommended.

Route DDR address/command signals on the same layer as the data signals, length-matched within 250 mil for byte-group timing. The DDR clock pair (DDR_CLK / DDR_CLK_N) should maintain differential impedance of 100 ohms with no more than two vias total. Ethernet TX/RX pairs require 100 ohm differential and continuous reference plane on layer 2 or 3 to maintain return-path continuity. Keep high-speed digital traces at least 25 mil from analog audio or sensitive analog signals.

Do not assume MCF5474ZP266 and MCF5485CVR200 are interchangeable - although pin-compatible at the family level, the ballmap suffix (ZP vs CVR) indicates different package pinout for the 388-PBGA even at the same physical footprint. Always cross-check the package mechanical drawing before component swap. Also, the part is NRND; do not start new designs without confirming supply through Rochester Electronics or NXP Direct. Finally, take care with the BDM/JTAG pins (BKPT, DSCLK, DSI, DSO) - they have no internal pull-ups and require external 10 K resistors to VDD during reset.

Informações de conformidade

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Sem chumbo
Yes
Sem halogênios
Unknown
Minerais de conflito
Compliant

Per NXP MCF5474Z material declaration (MCDS PDF), the part is Pb-free, RoHS compliant, REACH compliant, and JEDEC MSL3 qualified. Halogen-free status not explicitly stated in the provided data - set to unknown. The part is not AEC-Q100 qualified; it is intended for industrial, not automotive, applications.

Dados verificados em: 2026-10-19 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Buscas relacionadas

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Componentes & termos relacionados

NXP Semiconductors Freescale Semiconductor (legacy) MCF5474ZP266 MCF5471ZP200 MCF5472ZP200 MCF5475VR200 MCF5485CVR200 MCF5480CVR166 MCF54452VR266 MCF5280CVM66J ColdFire V4e ColdFire V2 ColdFire V4 MPU microprocessor unit microcontroller unit MMU FPU PBGA 388-PBGA DDR SDRAM PCI bus USB 2.0 OTG 10/100 Ethernet MAC AES 3DES SHA RC4 Linux / uClinux JEDEC MSL3 RoHS REACH NRND Rochester Electronics industrial gateway PLC Point-of-Sale
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2
Cotação recebida
3
Pedido realizado
4
Pagamento
5
Enviado
6
Entregue
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