MCIMX31CJMN4D - i.MX31 400MHz ARM1136 MPU 473-LFBGA | NXP
N.º da peça: MCIMX31CJMN4D ✗ Fim de vidaMCIMX31CJMN4D Visão geral
An applications processor is a system-on-chip that integrates a CPU core with specialized multimedia, graphics, and connectivity peripherals into a single die, providing higher integration than a discrete MPU + external ASIC combination. Applications processors sit at the top of the embedded hierarchy: applications processor -> microprocessor (MPU) -> microcontroller (MCU) -> integrated circuit -> semiconductor. The i.MX family from NXP targets multimedia-rich embedded designs where ARM processing meets hardware-accelerated video, image, and audio blocks.
Key features of the MCIMX31CJMN4D include the ARM1136JF-S core with Jazelle Java acceleration and VFPv3 floating point, an integrated LCD controller up to XGA resolution (1024x768), a CMOS sensor interface (CSI) for camera input, an MPEG-4/H.263 codec engine, and a multi-layer AHB/IPS bus matrix with bandwidth reduction logic. The 473-LFBGA package exposes wide I/O including 32-bit SDRAM, USB 2.0 OTG, 3.3V/1.8V I/O, and a 10/100 Ethernet MAC.
Architecturally, the i.MX31 uses a hierarchical bus fabric with separate instruction and data AHB paths feeding into the ARM core, while peripherals attach through a peripheral bus (IPS). The on-chip image-processing unit (IPU) handles display and camera pipelines in hardware, offloading real-time pixel processing from the ARM core. This hardware partitioning enables full-motion video decode at low CPU utilization.
Typical applications include in-vehicle infotainment head units, industrial HMI panels, portable patient monitors, point-of-sale terminals, and ruggedized multimedia handhelds. The wide operating temperature range and automotive qualification make the part suited for cabin-mounted displays and industrial control cabinets.
When designing with this 473-ball LFBGA, use a minimum 6-layer PCB stackup with controlled-impedance routing for SDRAM and reference clock traces. The exposed die requires thermal vias under the package center, and decoupling must combine bulk, mid-frequency, and high-frequency ceramics to manage simultaneous switching noise on the parallel bus.
This page synthesizes distributor pricing, NXP lifecycle status, drop-in variants from the i.MX31 family, and practical board-design notes that are not collected together in the manufacturer's datasheet.
Alternativas drop-in para MCIMX31CJMN4D — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MCIMX31CJMN4D (mesmo formato e footprint) — diferindo em Core Architecture, Floating Point Unit, Operating Temperature Range.
Nenhuma alternativa drop-in disponível para este produto.
Solicitar alternativasMCIMX31CJMN4D Classificações máximas e características elétricas
| Core Architecture | ARM1136JF-S (32-bit) |
| Maximum Core Frequency | 400 MHz |
| Core Count | 1 |
| Bit Width | 32-bit |
| Floating Point Unit | VFPv3 hardware FPU |
| Jazelle Java Acceleration | Yes |
| L1 Instruction Cache | 16 KB |
| L1 Data Cache | 16 KB |
| Hardware Video Accelerator | MPEG-4/H.263 encode-decode |
| Image Processing Unit | Yes (camera + display pipelines) |
| LCD Controller Resolution | Up to XGA (1024x768) |
| External Memory Bus | 32-bit SDRAM (mDDR/SDR) |
| Flash Support | NAND, NOR, OneNAND |
| USB Interface | USB 2.0 OTG (high-speed) |
| Ethernet MAC | 10/100 Mbit/s |
| Encapsulamento | 473-LFBGA (19x19 mm) |
| Faixa de temperatura de operação | -40C to +85C (industrial) |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do MCIMX31CJMN4D 473-lfbga (19x19 mm)
Configuração de pinos para MCIMX31CJMN4D (pacote 473-lfbga (19x19 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MCIMX31CJMN4D.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MCIMX31CJMN4D é adequado para 8 aplicaçãos: In-Vehicle Infotainment (IVI) Head Unit, Industrial HMI Touch Panel, Portable Medical Patient Monitor, Point-of-Sale (POS) Terminal, Ruggedized Multimedia Handheld, Automotive Rear-Seat Entertainment Display, Kiosk and Digital Signage Player, Industrial Telematics Gateway.
In-Vehicle Infotainment (IVI) Head Unit
The MCIMX31CJMN4D fits IVI head units because its ARM1136JF-S core at 400 MHz plus the on-chip MPEG-4/H.263 hardware accelerator decode the typical MP4/3GP media streams that passengers consume, while the integrated image processing unit (IPU) handles the camera and XGA-resolution display pipelines required for rear-view and cluster-share use cases. The 473-LFBGA package exposes the 32-bit SDRAM bus, USB 2.0 OTG, and 10/100 Ethernet MAC needed to bridge vehicle networks. Designers typically pair it with 128-256 MB mobile DDR and 256 MB-1 GB NAND. Compared to a software-decoded approach, the hardware video engine reduces ARM utilization to single-digit percentages, leaving headroom for Bluetooth, navigation, and CAN stacks.
Recomendado
Industrial HMI Touch Panel
The MCIMX31CJMN4D drives industrial HMI panels where its LCD controller supports XGA (1024x768) TFT panels with hardware color-space conversion and alpha blending, eliminating the need for an external graphics controller. The on-chip image processing unit accelerates overlays and 2D blits used in operator interfaces, while the USB 2.0 OTG and 10/100 Ethernet provide host connectivity to PLCs, sensors, and SCADA backbones. The -40C to +85C industrial temperature grade makes the part suitable for cabinet-mounted and factory-floor displays. Engineers pair it with 64-128 MB mobile DDR and industrial-grade NAND to reach 7-10 year deployment lifetimes.
Recomendado
Portable Medical Patient Monitor
The MCIMX31CJMN4D suits portable patient monitors because the ARM1136JF-S core provides deterministic 32-bit performance for real-time vital-sign DSP code while the integrated display controller interfaces directly with bedside TFT panels. The hardware image processing unit offloads waveform rendering, allowing the ARM core to focus on signal processing. USB 2.0 OTG supports tethered data export to hospital EMR systems, and the 10/100 Ethernet enables wired network connectivity at nurse stations. Designers value the part for its mature, well-documented software ecosystem and reliability in regulated medical device designs.
Recomendado
Point-of-Sale (POS) Terminal
The MCIMX31CJMN4D integrates most peripherals required by a POS terminal: USB 2.0 OTG for barcode scanners and payment peripherals, 10/100 Ethernet for store-network backhaul, an SD card interface for transaction logs, and an LCD controller for the operator display. The ARM1136JF-S core at 400 MHz handles Linux/WinCE POS middleware and EMV transaction stacks in real time. Customers value the 473-LFBGA package for its compact 19x19 mm footprint, enabling thin all-in-one terminal designs. The part's mature kernel support reduces software development risk.
Recomendado
Ruggedized Multimedia Handheld
The MCIMX31CJMN4D is widely used in ruggedized handhelds for field service, public safety, and warehouse logistics because its -40C to +85C industrial temperature range and ARM11 performance meet demanding environmental requirements while the integrated CSI camera interface and LCD controller enable barcode scanning, photo capture, and map rendering. The hardware MPEG-4/H.263 accelerator provides smooth video playback for training material and live camera feeds. USB OTG supports charging and tethered data sync; the 10/100 MAC allows drop-in network connectivity.
Recomendado
Automotive Rear-Seat Entertainment Display
The MCIMX31CJMN4D powers rear-seat entertainment (RSE) displays in passenger vehicles because its hardware MPEG-4/H.263 decoder handles headrest-mounted XGA panels without taxing the ARM core. The on-chip image processing unit drives dual-display rendering for split-screen passenger content, and the 32-bit SDRAM bus supports 720p video at sustained frame rates. The part's industrial/automotive qualification and the 473-LFBGA package's exposed die enable efficient thermal management in confined headrest enclosures. Designers pair it with a companion tuner/satellite receiver over the USB or SDIO links.
Kiosk and Digital Signage Player
The MCIMX31CJMN4D drives interactive kiosks and digital signage players where the ARM1136JF-S core runs embedded Linux distributions that manage content scheduling, touch input, and remote management. The LCD controller supports large-format XGA panels, while the 10/100 Ethernet MAC enables cloud-based content updates and remote diagnostics. The USB 2.0 OTG port supports peripherals such as printers, scanners, and payment terminals commonly integrated with kiosks. The 473-LFBGA package and industrial temperature grade make it suitable for unattended indoor environments with continuous uptime requirements.
Recomendado
Industrial Telematics Gateway
The MCIMX31CJMN4D is a strong fit for industrial telematics gateways that aggregate CAN/J1939 vehicle data and stream it to fleet management cloud services. Its 10/100 Ethernet MAC and USB 2.0 OTG provide network and peripheral connectivity, while the ARM1136JF-S core runs protocol stacks and buffering logic. The hardware image processing unit is leveraged for driver-facing camera analytics, and the 32-bit SDRAM bus allows buffering of GPRS/3G modem data. The wide temperature range and mature software ecosystem support deployments in trucks and heavy equipment.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MCIMX31CJMN4D — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MCIMX31CVMN4D | MCIMX31LCVMN4D | MCIMX31LCVMN4C | MCIMX31CJMN4C | MCIMX31LCVMN4DR2 |
|---|---|---|---|---|---|---|
| Package | 473-LFBGA (19x19 mm) | 473-LFBGA (19x19 mm) - same | 473-LFBGA (19x19 mm) - same | 473-LFBGA (19x19 mm) - same | 473-LFBGA (19x19 mm) - same | 473-LFBGA (19x19 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | ARM1136JF-S 32-bit | ARM1136JF-S 32-bit | ARM1136JF-S 32-bit | ARM1136JF-S 32-bit | ARM1136JF-S 32-bit | ARM1136JF-S 32-bit |
| Maximum Frequency | 400 MHz | 400 MHz | 400 MHz | 400 MHz | 400 MHz | 400 MHz |
| Family Position | i.MX31 (C variant) | i.MX31 (C variant) | i.MX31 (LC variant) | i.MX31 (LC variant, C revision) | i.MX31 (C variant, C revision) | i.MX31 (LC variant, R2 reel) |
| MPEG-4/H.263 Engine | Yes | Yes | Reduced scope | Reduced scope | Yes | Reduced scope |
| USB 2.0 OTG | Yes | Yes | Yes | Yes | Yes | Yes |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Lifecycle Status | Obsolete (Oct 2026) | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principais diferenciais
- ARM1136JF-S with hardware VFPv3 and Jazelle (vs MCIMX27MJP4A)
- On-chip MPEG-4/H.263 hardware codec (vs i.MX27MJP4A)
- Mature automotive and industrial qualification (vs Generic ARM9 competitors)
Notas de projeto
Estimated: at the typical 400 MHz operating point the MCIMX31CJMN4D dissipates roughly 1.0-1.5 W. With a junction-to-ambient thermal resistance around 25-30 C/W for a 6-layer 19x19 mm PCB padstack, this implies a 25-45 C junction temperature rise above ambient. Place thermal vias on a 1.0-1.2 mm pitch directly under the LFBGA die, fill them with epoxy, and use a continuous ground/power plane beneath the package. For sealed enclosures used in automotive head units, design the thermal path to a chassis spreader.
The 473-ball LFBGA requires microvia (HDI) PCB technology with 0.5 mm or finer pitch. Keep the SDRAM bus traces matched within 50 mil (1.27 mm) and reference them to a continuous ground plane. Place an SDRAM guard trace between clock and address/control lines to reduce crosstalk, and isolate the USB DP/DM pair as a 90-ohm differential. AC-coupling and common-mode chokes on USB 2.0 lines improve EMI margins on CISPR 25 testing.
Use a bulk tantalum or polymer capacitor at the regulator output (typically 22-47 uF) plus three parallel ceramic decoupling caps (1 uF, 100 nF, 10 nF) within 100 mils of each VDD/VSS pair. The simultaneous switching noise on the parallel SDRAM bus can collapse the core voltage if decoupling is inadequate. Place a ferrite bead between the 1.8 V and 2.5 V analog supplies to attenuate digital noise coupled into the ADC reference. Estimate: core current peaks at 700-900 mA on VDDARM during memory bursts.
Avoid placing the LFBGA on the PCB edge closer than 3 mm or signal traces within 1 mm of the package outline to reduce stress during depanelization. Configure boot mode pins correctly via eFuses or external resistors; misconfigured boot modes result in non-booting boards that are difficult to recover without JTAG. Always include a JTAG header (TDI/TDO/TMS/TCK/TRST) accessible from the enclosure for field debug, since the obsolete part has limited rework infrastructure.
Informações de conformidade
Marked obsolete by NXP; AEC-Q100 qualified for automotive per industrial/automotive product positioning; halogen-free status not explicitly stated in verified web data.
