MCIMX507CVM1BR2 - i.MX50 ARM Cortex-A8 800MHz MPU | NXP | Industrial
N.º da peça: MCIMX507CVM1BR2 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $12.73 | $12,73 |
| 10 | $11.95 | $119,50 |
| 100 | $10.85 | $1.085,00 |
| 500 | $9.95 | $4.975,00 |
| 1.000 | $9.2 | $9.200,00 |
| 3.000 | $8.55 | $25.650,00 |
MCIMX507CVM1BR2 Visão geral
A microprocessor is an integrated circuit that integrates a CPU core, memory interfaces, and I/O peripherals on a single die, sitting at the apex of the embedded processor hierarchy (MPU -> microprocessor -> processor -> SoC -> integrated circuit). The Cortex-A8 core within the i.MX50 family delivers ARMv7-A instruction set support with floating point, enabling full Linux and Android operating system capability. As an applications processor (rather than a microcontroller), the i.MX507 expects external DDR memory and external storage, integrating only on-chip SRAM and the system control fabric.
Key features include a single Cortex-A8 core at 800 MHz, hardware NEON SIMD and VFPv3 floating-point engines, integrated LCD controller for TFT panels, MIPI display serial interface, 24-bit parallel camera sensor interface, dual SD/MMC card controllers, NAND flash controller, hardware accelerated 2D graphics (BLT engine), and a rich set of connectivity peripherals including USB 2.0 OTG, Ethernet MAC, I2C, SPI, UART, and I2S audio. The device supports external LPDDR/DDR2 memory and operates from a 1.0V core supply with 1.8V/3.3V I/O.
The i.MX50 architecture pairs the Cortex-A8 with a multi-layer AHB-Lite bus matrix and dedicated DMA channels for memory and peripherals, allowing sustained throughput on display and camera pipelines. The integrated power management unit (PMU) and on-chip LDOs simplify the external power tree, while the 400-ball MAPBGA provides the I/O density needed for memory bus, camera bus, and display bus combination.
Typical applications include industrial human-machine interfaces (HMI), eReader and electronic price label controllers, portable point-of-sale terminals, building automation touch panels, medical patient information displays, and automotive infotainment rear-seat displays (non-safety-critical).
When designing with this device, ensure the PCB can accommodate the 17x17 mm 400-ball BGA fanout with proper microvia stack-up and matched-length DDR traces. Validate thermal performance with at least a 4-layer stack-up; the 800 MHz core may require thermal vias under the exposed die region for sustained industrial temperature operation. Verify all peripheral pin assignments against the reference manual because several functions are multiplexed and require careful IOMUX configuration.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para MCIMX507CVM1BR2 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MCIMX507CVM1BR2 (mesmo formato e footprint) — diferindo em Mounting Type, Package.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MCIMX507CVM1B
✅ Drop-In✓ Em estoque
$13.45 / unidade
Ver ficha técnica →MCIMX508CVM8B
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MCIMX51CVVMN8C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MCIMX53CVVM5B
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MCIMX507CVM1BR2 Classificações máximas e características elétricas
| Core Architecture | ARM Cortex-A8 (ARMv7-A) |
| Number of Cores | 1 |
| Maximum CPU Clock | 800 MHz |
| Largura do barramento de dados | 32-bit |
| Encapsulamento | 400-LFBGA (17x17 mm) |
| Package Type | MAPBGA-400 |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40C to +85C (Industrial) |
| SIMD / Floating Point | NEON SIMD, VFPv3 |
| Graphics Accelerator | 2D BLT (bit-blit) hardware |
| Display Controller | Integrated LCD controller (parallel TFT) + MIPI DSI |
| Camera Interface | 24-bit parallel CSI |
| External Memory Support | DDR2 / LPDDR |
| Storage Interfaces | NAND flash, 2x SD/MMC, eMMC |
| Connectivity | USB 2.0 OTG, Ethernet MAC, I2C, SPI, UART, I2S |
| Status RoHS | Compliant |
| Lead-Free | Yes |
Guia de Configuração de Pinos do MCIMX507CVM1BR2 mapbga-400
Configuração de pinos para MCIMX507CVM1BR2 (pacote mapbga-400). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MCIMX507CVM1BR2.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MCIMX507CVM1BR2 é adequado para 7 aplicaçãos: Industrial Human-Machine Interface (HMI) Panels, eReader and Electronic Price Label Controllers, Portable Point-of-Sale Terminals, Building Automation Touch Panels, Medical Patient Information Displays, Automotive Rear-Seat Infotainment (Non-Safety), Industrial Machine Vision Terminals.
Industrial Human-Machine Interface (HMI) Panels
Why NIX HC's i.MX50 fits HMI: The MCIMX507CVM1BR2's 800 MHz Cortex-A8, integrated 24-bit parallel LCD controller, MIPI DSI output, and hardware 2D BLT engine deliver responsive Qt/Linux HMI graphics at BOM levels below the i.MX6 family. Operating temperature of -40C to +85C meets industrial panel requirements. The integrated display controller supports TFT panels up to XGA/WXGA without external bridges, reducing system cost. Performance consideration: when displaying complex SVG icons or high-resolution dashboards, prefer the NEON-optimized Qt rendering pipeline over software paths. The 400-ball LFBGA pin density accommodates both the parallel RGB LCD bus and the touch I2C bus without pin contention.
Recomendado
eReader and Electronic Price Label Controllers
Why NIX HC fits eReaders: As the i.MX508 successor, the MCIMX507CVM1BR2 was designed for next-generation eReader displays, pairing the Cortex-A8 with optimized LCD pipeline and integrated power management. The 800 MHz core handles ePaper refresh algorithms and EPUB rendering smoothly under Linux. The integrated LCD controller supports the wide parallel bus needed for large ePaper panels. Performance consideration: ePaper refresh power profile benefits from the i.MX50's gated peripheral power domains; disable the LCD controller when the panel is idle to extend battery life. External LPDDR/DDR2 interface supports the burst bandwidth needed for high-resolution page turns.
Recomendado
Portable Point-of-Sale Terminals
Why NIX HC fits portable POS: The MCIMX507CVM1BR2's USB 2.0 OTG, Ethernet MAC, SD/MMC controllers, I2S audio, and integrated display pipeline provide a single-chip solution for handheld POS terminals. The 800 MHz Cortex-A8 handles EMV transaction stacks and signature capture firmware with adequate margin. The industrial -40C to +85C temperature range supports outdoor retail and cold-storage environments. Performance consideration: allocate the NEON engine to accelerate cryptography libraries (AES, RSA) used for payment tokenization. The parallel camera interface integrates a 1DBS barcode scanner camera directly without external ISP, simplifying POS BOM.
Recomendado
Building Automation Touch Panels
Why NIX HC fits building automation: The MCIMX507CVM1BR2 provides Linux-ready compute for BACnet, KNX, and Modbus gateways while driving the touch panel UI. The 400-ball LFBGA pin map exposes UART, SPI, I2C, and USB-OTG for connecting building-automation transceivers, and the Ethernet MAC integrates IP-20 LAN directly. The 1DBS 2D BLT engine accelerates graphical floorplan UIs. Performance consideration: dedicate one DMA channel to the display pipeline and a separate DMA channel for the Ethernet MAC to avoid starvation on busy networks. Industrial temperature operation supports unheated electrical closets.
Recomendado
Medical Patient Information Displays
Why NIX HC fits medical displays: The MCIMX507CVM1BR2 powers bedside patient information displays in non-safety-critical applications. The integrated LCD controller drives 1080p-class medical panels via parallel RGB or MIPI DSI, and the I2S audio path supports nurse-station intercom audio. The -40C to +85C range handles hospital HVAC variations. Performance consideration: use the hardware 2D BLT engine for windowed video overlay in patient education content; software rendering will starve at 1080p. Confirm IEC 60601 EMI margins early because the parallel LCD bus is a strong radiated emitter. Add common-mode chokes on USB if connected to medical peripherals.
Recomendado
Automotive Rear-Seat Infotainment (Non-Safety)
Why NIX HC fits rear-seat infotainment: For non-safety-critical rear-seat displays, the MCIMX507CVM1BR2 drives the rear LCD panel and handles streaming media via Ethernet MAC or USB. The 800 MHz Cortex-A8 decodes SD-resolution video with the NEON engine. The industrial temperature grade supports cabin temperature excursions. Performance consideration: the i.MX50 is not AEC-Q100 qualified, so do not use it for safety-critical ECUs. For dashboard or driver-display applications, choose a proper AEC-Q100 qualified part. The MIPI DSI interface allows direct connection to automotive-grade rear-seat panels without external bridges.
Recomendado
Industrial Machine Vision Terminals
Why NIX HC fits machine vision terminals: The MCIMX507CVM1BR2's 24-bit parallel CSI interface accepts industrial camera sensor output, and the Cortex-A8 + NEON engine runs OpenCV-based inspection firmware. The USB 2.0 OTG supports gigE-vision or USB3-vision camera bridges, and the integrated display drives the operator panel showing pass/fail results. Performance consideration: dedicated DMA for the CSI interface prevents frame drop on high-resolution sensors; place the camera sensor on its own dedicated voltage rail for noise isolation. The 400-ball LFBGA's pin density allows parallel camera bus and parallel display bus to coexist.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MCIMX507CVM1BR2 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MCIMX507CVM1B | MCIMX508CVM8B | MCIMX51CVVMN8C | MCIMX53CVVM5B |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 400-LFBGA (17x17 mm) | 400-LFBGA (17x17 mm) - same | 400-LFBGA (17x17 mm) - same | MAPBGA-400 - same family | MAPBGA-400 - same family |
| Core Architecture | ARM Cortex-A8 (ARMv7-A) | ARM Cortex-A8 (same die) | ARM Cortex-A8 (same) | ARM Cortex-A8 (same family) | ARM Cortex-A8 (same family) |
| Maximum CPU Clock | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 1 GHz (faster, same family) |
| Cores | 1 | 1 | 1 | 1 | 1 |
| Data Bus Width | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit |
| External Memory | DDR2 / LPDDR | DDR2 / LPDDR | DDR2 / LPDDR | DDR2 / LPDDR | DDR2 / LPDDR |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Lifecycle | Active | Active | Active (predecessor) | Active | Active |
Principais diferenciais
- i.MX508 successor with optimized LCD pipeline (vs MCIMX508CVM8B)
- Pin-compatible upgrade path within i.MX family (vs MCIMX53CVVM5B)
- Cost-optimized Cortex-A8 in MAPBGA-400 (vs i.MX6 family)
Notas de projeto
The 400-ball LFBGA at 17x17 mm requires a high-density PCB stack-up with microvias. Estimated: use a 4-layer 1 oz copper stack-up with 0.4 mm pitch BGA escape routing on inner layers and laser-drilled microvias (0.1 mm) on outer layers for breakout. Matched-length DDR2/LPDDR traces must be routed on inner layers with reference planes on adjacent layers for impedance control of 50 ohm single-ended and 100 ohm differential. Maintain via-in-pad thermal pattern under the BGA to keep junction temperature within -40C to +85C ambient.
Estimated: at 800 MHz Cortex-A8 with NEON active under Linux, the i.MX50 die dissipates approximately 1.0 to 1.5 W in typical HMI workloads. For sustained industrial operation at +85C ambient, provide at least 4 thermal vias in the central BGA ball array connected to an inner copper plane. Without thermal management, the silicon may throttle. The reference design includes a heatsink land pattern; consult the i.MX50 hardware design guide for the recommended copper pour geometry.
Do not assume boot configuration is automatic; the i.MX50 boot mode fuses and GPIO strapping must be set correctly per reference manual. Mistaking the NAND boot pins for SD boot pins is a common mistake. Ensure the external LPDDR/LDDR2 memory is on the correct chip select; alternatively, select external DDR2 on the right chip-select. Verify the PMIC sequencing against the i.MX50 power-up timing diagram. Confirm the LVDS display panel mapping against the IOMUX configuration in software. Lastly, allow for the boot device and per-ball mechanical tolerance before depending on external libraries for the same.
Estimated: the i.MX50 requires a multi-rail power supply. Core voltage is typically 1.0 V (up to 1.2 A at 800 MHz), periphery loads typically 1.8 V (up to 0.3 A) and 3.3 V (up to 0.2 A). Use an integrated PMIC such as the NXP PF0100 or a discrete buck/boost tree. Add bulk capacitance of at least 47 uF on each rail plus 100 nF decoupling on every VDD ball. Keep the analog supply isolated from the digital core to avoid display pixel jitter and CSI noise injection.
Informações de conformidade
RoHS and REACH compliant per NXP product page; lead-free. Not AEC-Q100 qualified - do not use in safety-critical automotive ECUs. Halogen-free status not explicitly confirmed in web data.
