MCIMX535DVV1CR2 - i.MX53 ARM Cortex-A8 1GHz MPU | NXP
N.º da peça: MCIMX535DVV1CR2 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $36.17 | $36,17 |
| 10 | $32.55 | $325,50 |
| 100 | $29.5 | $2.950,00 |
| 500 | $26.85 | $13.425,00 |
| 1.000 | $24.1 | $24.100,00 |
| 3.000 | $22.4 | $67.200,00 |
MCIMX535DVV1CR2 Visão geral
An MPU (microprocessor unit) is a System-on-Chip (SoC) device that integrates a CPU core, memory controllers, and a wide range of peripherals into a single package, eliminating the need for an external chipset. MPU devices sit at the top of the embedded processing hierarchy (MPU > MCU > discrete microcontroller) and are designed for operating systems such as Linux, Android, and Windows Embedded Compact. The i.MX53 specifically targets multimedia-rich applications where high CPU performance combined with hardware-accelerated video, graphics, and connectivity peripherals is required.
Key features of the MCIMX535DVV1CR2 include the ARM Cortex-A8 single-core architecture with NEON SIMD and VFPv3 floating-point support, dual-display controller hardware (parallel + LVDS), hardware-accelerated video codec for H.264 BP/HP, MPEG-4, H.263, and VC-1, an integrated image processing unit (IPU), and a 10/100 Ethernet MAC with hardware security acceleration (SAHARAS). The 529-FBGA package is designed for high-density surface-mount assembly and supports the full industrial temperature range typical of embedded multimedia designs.
The i.MX53 architecture uses a multi-level memory hierarchy combining L1 cache with the ARM Cortex-A8's NEON engine, plus a unified L2 cache that feeds the Cortex-A8 core. A dedicated Smart Direct Memory Access (SDMA) controller handles high-throughput I/O, while the clock control module provides independent frequency scaling for ARM, L2, AHB, and IPG buses to balance performance against power dissipation in always-on systems.
Typical applications include industrial human-machine interfaces (HMI), point-of-sale (POS) terminals, automotive infotainment heads, medical patient-monitoring displays, barcode scanners, and portable multimedia players. The combination of high CPU frequency with hardware video acceleration makes it suitable where user interfaces need to remain smooth alongside background video processing tasks.
When designing with this device, allocate at least four PCB layers dedicated to the 529-ball BGA escape routing and provide a continuous ground reference plane under the package. The DDR2/LPDDR2 memory interface requires matched-length routing with controlled impedance of 50 ohms single-ended and 100 ohms differential for DQS signals to maintain signal integrity at 200 MHz+ memory bus speeds.
This page synthesizes distributor stock counts, exact-package drop-in alternatives within the i.MX53 family, and practical PCB layout considerations not found on the manufacturer product page.
Alternativas drop-in para MCIMX535DVV1CR2 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MCIMX535DVV1CR2 (mesmo formato e footprint) — diferindo em Core Architecture, Mounting Type, RoHS Status.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MCIMX534AVV8CR2
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MCIMX537DVV1CR2
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MCIMX535DVV1C
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MCIMX535DVV1CR2
✅ Drop-In✓ Em estoque
$22.4 / unidade
Ver ficha técnica →MCIMX51DVV1CR2
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MCIMX535DVV1CR2 Classificações máximas e características elétricas
| Manufacturer | NXP Semiconductors |
| Series | i.MX53 |
| Core Processor | ARM Cortex-A8 |
| Number of Cores | 1 |
| Core Architecture | 32-bit |
| Operating Frequency | 1.0 GHz |
| On-chip SRAM | 128 KB |
| Number of I/O Lines | 224 |
| Core Voltage Range | 0.9 V / 1.25 V / 1.3 V |
| Encapsulamento / Caixa | 529-FBGA / TEBGA-2 (19 mm x 19 mm) |
| Ball Pitch | 0.8 mm |
| Tipo de montagem | Surface Mount |
| Peripherals | LCD, Ethernet, USB, SATA, SDHC, I2C, SPI, UART, CAN |
| Connectivity | 10/100 Ethernet MAC, USB 2.0, SATA-II |
| GPU / Graphics | OpenVG / 2D/3D graphics accelerator |
| Video Processing | IPU + hardware codec (H.264, MPEG-4, VC-1) |
| Security | SAHARAS hardware encryption (AES, SHA, RNG) |
| Status RoHS | Compliant |
| Nível MSL | 3 |
| Temperatura de operação | -40C to +85C (industrial) |
Guia de Configuração de Pinos do MCIMX535DVV1CR2 529-fbga / tebga-2 (19 mm x 19 mm)
Configuração de pinos para MCIMX535DVV1CR2 (pacote 529-fbga / tebga-2 (19 mm x 19 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MCIMX535DVV1CR2.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MCIMX535DVV1CR2 é adequado para 6 aplicaçãos: Industrial Human-Machine Interface (HMI) Panels, Point-of-Sale (POS) and Retail Terminals, Automotive Infotainment Heads and Rear-Seat Displays, Medical Patient-Monitoring Displays, Industrial Barcode Scanners and Imaging Terminals, Portable Multimedia Players and Digital Signage.
Industrial Human-Machine Interface (HMI) Panels
The MCIMX535DVV1CR2's 1.0 GHz ARM Cortex-A8 throughput, dual-display parallel+LVDS controller, and integrated IPU make it well suited to industrial HMI panels combining touchscreen graphics with process visualization. The hardware-accelerated H.264 video codec handles instructional video loops without CPU loading, while the Ethernet MAC enables real-time PLC communication. The 529-FBGA 19x19 mm footprint integrates into a compact panel-mount PCB, and the i.MX53 BSP supports Qt, GTK, and embedded Web stacks; expect 2-3 W typical power at idle from the 1.25 V core rail.
Recomendado
Point-of-Sale (POS) and Retail Terminals
POS terminals benefit from the i.MX535's cryptography accelerators (SAHARAS) for EMV chip-card and PIN-pad handling, plus the integrated 10/100 Ethernet and USB host for printers, barcode scanners, and cash drawers. The 1.0 GHz ARM Cortex-A8 delivers sub-second boot times with lightweight Linux distros, and the LVDS display output drives the cashier LCD directly. The hardware video engine supports promotional media at the customer-facing display with CPU headroom for transaction processing.
Recomendado
Automotive Infotainment Heads and Rear-Seat Displays
The MCIMX535DVV1CR2's industrial temperature range (-40C to +85C), hardware video decode, and dual-display IPU map directly to automotive infotainment heads requiring LVDS primary display plus a passenger-side secondary screen. The CAN bus interface integrates with vehicle networks, and the SATA-II port supports local media storage. Although the 535 is not AEC-Q100 qualified, it shares the same silicon platform as the automotive-grade i.MX53 derivatives - software reuse between them is straightforward. Expect 5-7 W thermal envelope with continuous video decode.
Recomendado
Medical Patient-Monitoring Displays
Medical bedside monitors leverage the i.MX535's hardware encryption for HIPAA-compliant patient data at rest, the IPU for high-resolution TFT driving, and the deterministic interrupt latency of the ARM Cortex-A8 for waveform capture synchronisation. The low-noise DDR2/LPDDR2 controller paired with on-chip 128 KB SRAM minimises jitter on ECG/EEG signal chains. Designers building IEC 60601-1 compliant systems benefit from the -40C to +85C industrial temperature range and pre-validated BSP lifecycle. The board stack-up must isolate high-frequency balls under the BGA from analog front-end grounds.
Recomendado
Industrial Barcode Scanners and Imaging Terminals
Ruggedised barcode scanners and warehouse terminals depend on the MCIMX535DVV1CR2 for sub-second image processing of 1D/2D codes through the IPU, which offloads camera-into-data tasks from the ARM core. The combination of USB 2.0 high-speed host for tethered scanners, SD/SDHC boot support, and on-chip 128 KB SRAM for buffer queues lets the device handle bursts of decoded results. The industrial temperature grade and the proven 529-FBGA solder-joint reliability of NXP's i.MX53 family support drop/shock testing per IEC 60068.
Recomendado
Portable Multimedia Players and Digital Signage
The MCIMX535DVV1CR2's hardware H.264/HP/BP, MPEG-4, H.263, and VC-1 codec plus 2D/3D OpenVG GPU deliver smooth 1080p video at 30 fps without external DSP, paired with LVDS output to large LCD panels. SATA-II attaches local storage for media libraries, while the dedicated IPU handles dual-pipe blending for digital signage overlays. Power management scales ARM, L2, AHB, and IPG clocks independently - at idle the system draws under 1 W, allowing battery or PoE signage installations.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MCIMX535DVV1CR2 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MCIMX534AVV8CR2 | MCIMX537DVV1CR2 | MCIMX535DVV1C | MCIMX51DVV1CR2 |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 529-TEPBGA-2 (19x19) | 529-TEPBGA-2 (19x19) - same | 529-TEPBGA-2 (19x19) - same | 529-TEPBGA-2 (19x19) - same | 529-TEPBGA-2 (19x19) - same |
| Core Frequency | 1.0 GHz | 800 MHz | 1.0 GHz | 1.0 GHz | 800 MHz |
| On-chip SRAM | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
| Core Architecture | ARM Cortex-A8 32-bit | ARM Cortex-A8 32-bit | ARM Cortex-A8 32-bit | ARM Cortex-A8 32-bit | ARM Cortex-A8 32-bit |
| I/O Lines | 224 | 224 | 224 | 224 | 224 |
| Hardware Video Codec | H.264/MPEG-4/VC-1 | H.264/MPEG-4/VC-1 | H.264/MPEG-4/VC-1 | H.264/MPEG-4/VC-1 | MPEG-4/H.263 only |
| Temperature Grade | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Principais diferenciais
- Higher ARM Cortex-A8 clock than the i.MX534 sibling at identical footprint (vs MCIMX534AVV8CR2)
- Top-of-stack i.MX53 SKU with full hardware video codec engine (vs MCIMX51DVV1CR2)
- Revision 2.1 silicon with revised errata compared to earlier revisions (vs MCIMX535DVV1C)
- Single-core Cortex-A8 power efficient envelope vs i.MX6 dual-core migration cost (vs MCIMX6G2 series)
Notas de projeto
Estimated: 529-ball BGA at 0.8 mm pitch in 19x19 mm package requires minimum 4 PCB layers with 0.4 mm microvia laser drilling and 0.2 mm trace/space escape routing. Place a continuous ground reference plane directly under the BGA on layer 2 to provide a controlled-impedance return path for DDR signals. Use the BGA break-out dog-bone fan-out or via-in-pad (VIPPO) techniques; route differential pairs for DQS lines to within 5 mil length matching for 100 ohm differential impedance.
Decouple each VDD ball with a 100 nF X7R ceramic placed within 1 mm of the ball pad. Add a 10 uF bulk capacitor per voltage rail near the MPU. The core rail at 1.25 V (or 1.3 V under load) should be sequenced after the 3.3 V rail; use NXP's PF0100 Power Management IC specifically validated for the i.MX53 to handle all voltage rails, watchdog, and reset sequencing in one reference design.
Estimated: At maximum CPU loading (1080p H.264 decode with parallel display active), the MCIMX535DVV1CR2 dissipates approximately 2-3 W. Theta-JA for the 529-TEPBGA-2 on a 4-layer JEDEC test board is approximately 18 C/W, yielding a junction-to-ambient rise of 36-54 C. Industrial enclosures with passive cooling and copper-in-pad PCB construction are typically adequate; for sealed enclosures with limited airflow, add a small aluminum heatsink or thermal interface material over the package.
DDR2/LPDDR2 memory interface signals require matched-length routing. Per NXP i.MX53 hardware reference design guidelines, DQS-to-DQ skew should be kept within 25 ps, address/command-to-clock within 50 ps, and the entire memory bus terminated with 50 ohm single-ended impedance to ground. Power the DDR rail through a dedicated LDO (NUP3115 or similar) to prevent switching noise from the core rail interfering with memory access timing.
Avoid pulling the boot mode pins (BOOT_MODE[1:0]) to ground through long traces - these inputs are sampled immediately after POR and require clean logic levels at reset. Do not use the JTAG pins as GPIO in production without disabling boundary-scan logic, otherwise impedance mismatches during boundary-scan tests cause false failures. Always use NXP's supplied U-Boot bootloader image and DDR3 calibration routine; the register initialization sequence is critical and following generic ARM Cortex-A8 port guide code will leave the DDR controller misconfigured.
Informações de conformidade
RoHS and REACH compliant per NXP product page. Not AEC-Q100 qualified - choose i.MX53 automotive derivatives for vehicle applications. Lead-free Pb-free SAC ball finish.
