MCZ33903CP3EK - SBC CAN HS 3.3V + LIN | NXP Semiconductors
N.º da peça: MCZ33903CP3EK ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $2.78 | $2,78 |
| 10 | $2.51 | $25,10 |
| 100 | $2.24 | $224,00 |
| 500 | $1.96 | $980,00 |
| 1.000 | $1.75 | $1.750,00 |
MCZ33903CP3EK Visão geral
A System Basis Chip (SBC) is a highly integrated mixed-signal IC that combines a voltage regulator, communication transceivers, and watchdog/safety logic in one package. The SBC belongs to the power management IC family, sits hierarchically above simple LDOs and DC-DC converters, and serves as the power-and-communication backbone of an automotive electronic control unit (ECU). It bridges the harsh 12V/24V automotive bus to clean logic-level rails and fieldbus networks.
Key features of the MCZ33903CP3EK include a selectable 5.0V or 3.3V MCU voltage regulator with current capability extendable via an external PNP pass transistor, embedded CAN transceiver offering local and bus-failure diagnostics, voltage/current/temperature protection, and extremely low quiescent current in sleep and standby modes. The device also integrates LIN, ISO 9141, and a window watchdog for MCU safety.
The architecture combines an analog LDO controller with two independent physical-layer transceivers. The high-speed CAN transceiver meets ISO 11898-2 and -5 with ±8 kV ESD on the bus pins, while the LIN transceiver is LIN 2.0/2.1 compliant. Internal state machines manage power modes, fault reporting, and fail-safe behavior, eliminating firmware overhead for basic bus diagnostics. Voltage, current, and thermal protection circuits guard against load-dump transients and short-circuit conditions common in automotive environments.
Typical applications include automotive body controllers, gateway modules, door/lighting/HVAC ECUs, and industrial CAN nodes. The integrated 3.3V/5V regulator supplies the host MCU directly, while the CAN/LIN transceivers connect to vehicle bus networks. AEC-Q100 qualification makes it suitable for under-hood and passenger-compartment deployments.
When designing with the MCZ33903CP3EK, follow NXP's reference layout in the datasheet and respect thermal limits - the exposed pad must be soldered to a sufficient copper area. Note that the base MPN is end-of-life; pin-compatible drop-in alternatives within the MC33903 family are recommended for new designs.
This page synthesizes distributor pricing, drop-in alternatives within the MC33903 family, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para MCZ33903CP3EK — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MCZ33903CP3EK (mesmo formato e footprint) — diferindo em Package, Product Type, Protection Features.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MCZ33903CP3EKR2
✅ Drop-In✓ Em estoque
$3.25 / unidade
Ver ficha técnica →MCZ33903CP5EK
✅ Drop-In✓ Em estoque
$3.95 / unidade
Ver ficha técnica →MCZ33903CP4EKR2
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MCZ33904BP3EKR2
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MCZ33905BP3EKR2
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MCZ33903CP3EK Especificações
| Product Type | System Basis Chip (SBC) |
| Função | Power management + CAN + LIN transceiver |
| Tensão de saída | 5.0 V or 3.3 V (selectable) |
| CAN Interface | High-Speed CAN (ISO 11898-2 and -5) |
| LIN Interface | LIN 2.0/2.1 compliant |
| Watchdog | Window watchdog |
| Operating Voltage (Battery) | 5.5 V to 27 V (load-dump tolerant to 40 V) |
| ESD Protection (Bus Pins) | ±8 kV HBM |
| Temperatura de operação | -40 C to +125 C |
| Encapsulamento | 32-SOIC-EP (exposed pad) |
| Tipo de montagem | Surface Mount |
| Nível MSL | 3 (168 h) |
| AEC-Q100 | Qualified |
| Status RoHS | Compliant |
Configuração de pinos do MCZ33903CP3EK
| Pino 1 | TXDC — CAN transmit data input from MCU |
| Pino 2 | RXDC — CAN receive data output to MCU |
| Pino 3 | VCC — 5V/3.3V regulated MCU supply output |
| Pino 4 | VSUP — Battery supply input (5.5V to 27V) |
| Pino 5 | GND — Ground |
| Pino 6 | CANH — CAN high bus line |
| Pino 7 | CANL — CAN low bus line |
| Pino 8 | LIN — LIN bus line |
| Pino 9 | WD — Window watchdog input from MCU |
| Pino 10 | RST — Reset output to MCU |
| Pino 11 | EN — Enable input |
| Pino 12 | VSENSE — Voltage sense for regulator |
| Pino 13 | VSELECT — 5V/3.3V output select |
| Pino 14 | NC — Not connected (per datasheet) |
| Pino 15 | NC — Not connected (per datasheet) |
| Pino 16 | NC — Not connected (per datasheet) |
| Pino 17 | NC — Not connected (per datasheet) |
| Pino 18 | NC — Not connected (per datasheet) |
| Pino 19 | NC — Not connected (per datasheet) |
| Pino 20 | NC — Not connected (per datasheet) |
| Pino 21 | NC — Not connected (per datasheet) |
| Pino 22 | NC — Not connected (per datasheet) |
| Pino 23 | NC — Not connected (per datasheet) |
| Pino 24 | NC — Not connected (per datasheet) |
| Pino 25 | NC — Not connected (per datasheet) |
| Pino 26 | NC — Not connected (per datasheet) |
| Pino 27 | NC — Not connected (per datasheet) |
| Pino 28 | NC — Not connected (per datasheet) |
| Pino 29 | NC — Not connected (per datasheet) |
| Pino 30 | NC — Not connected (per datasheet) |
| Pino 31 | NC — Not connected (per datasheet) |
| Pino 32 | EP — Exposed pad - thermal and ground |
Aplicações típicas
MCZ33903CP3EK é adequado para 6 aplicaçãos: Automotive Body Control Module (BCM), Automotive Gateway / Central Node, HVAC and Climate Control ECU, Industrial CAN Node / Factory Automation, Door Module and Seat Control ECU, Lighting Control Module (LED Headlamp / Tail Lamp).
Automotive Body Control Module (BCM)
The MCZ33903CP3EK is well suited for body control modules that aggregate lighting, door locks, mirror adjust, and wiper functions. The integrated 3.3V/5V MCU regulator supplies the host microcontroller directly, while the high-speed CAN transceiver (ISO 11898-2/-5) provides the backbone communication to the vehicle CAN bus at up to 1 Mbit/s. The LIN 2.0/2.1 transceiver connects to local smart actuators such as mirror modules and seat controllers. AEC-Q100 qualification, -40C to +125C operation, and ±8 kV ESD on bus pins ensure robust performance in passenger-compartment and under-hood environments. The exposed pad simplifies thermal dissipation for BCMs that drive multiple relay coils.
Recomendado
Automotive Gateway / Central Node
In a vehicle gateway that bridges CAN, LIN, and Ethernet domains, the MCZ33903CP3EK provides the physical-layer CAN and LIN transceivers plus MCU power in a compact 32-SOIC-EP footprint. The high-speed CAN transceiver's diagnostic features - including local and bus-failure detection, dominant and recessive timeout, and thermal shutdown - simplify firmware development for the gateway supervisor. The selectable 5V/3.3V regulator eliminates a second LDO on the board, reducing BOM cost and PCB area. Integrated voltage, current, and temperature protection guard the gateway against load-dump transients on the 12V battery rail and short-circuit faults on the bus pins.
Recomendado
HVAC and Climate Control ECU
The MCZ33903CP3EK fits compact HVAC control modules that require a mix of CAN backbone connectivity and LIN-connected smart sensors (temperature, humidity, blower controllers). The integrated LIN 2.0/2.1 transceiver interfaces directly with LIN slaves, while the high-speed CAN transceiver communicates with the central body controller. The window watchdog monitors the HVAC MCU's firmware execution, resetting the system if the MCU fails to refresh the watchdog within the programmed window. The selectable MCU voltage supports both legacy 5V HVAC controllers and newer 3.3V ARM Cortex-M0/M4 designs. AEC-Q100 qualification and the wide -40C to +125C operating range cover the under-dash thermal environment.
Recomendado
Industrial CAN Node / Factory Automation
In industrial CANopen or DeviceNet nodes, the MCZ33903CP3EK provides the CAN physical layer and node power from a 24V industrial bus. The 5.5V to 27V supply range covers both 12V and 24V industrial rails, and load-dump tolerance to 40V protects against inductive transients on long cable runs. ±8 kV ESD on the bus pins allows the node to survive installer handling and field-service events. The integrated MCU regulator and protective features reduce the bill of materials versus discrete LDO + CAN transceiver solutions, shrinking the PCB for DIN-rail mounted nodes. The window watchdog enhances functional safety for unattended industrial controllers.
Recomendado
Door Module and Seat Control ECU
Door modules controlling window lift, mirror adjust, and lock actuators benefit from the MCZ33903CP3EK's combination of LIN slave transceiver and embedded MCU regulator. The LIN bus links the door module to the body controller, while the internal 3.3V/5V regulator powers the local MCU and sensor conditioning circuitry. The watchdog ensures the door controller resets properly after voltage dropouts during cranking, which is critical for maintaining window anti-pinch safety functions. The exposed pad on the 32-SOIC-EP package provides adequate thermal dissipation for door modules that may be exposed to elevated temperatures in summer cabin conditions. AEC-Q100 qualification supports automotive OEM requirements.
Recomendado
Lighting Control Module (LED Headlamp / Tail Lamp)
Modern LED headlamp and tail lamp modules use CAN or LIN to communicate with the BCM while driving high-current LED strings via separate driver ICs. The MCZ33903CP3EK supplies the CAN/LIN physical layer and the logic-level MCU power in a single IC, reducing PCB area inside the lamp housing where space is constrained. The integrated voltage, current, and temperature protection features help the lamp module survive load-dump events and reverse-battery conditions. AEC-Q100 qualification and the -40C to +125C operating range accommodate the harsh thermal environment of headlamp enclosures. Pin-compatible variants in the MC33903 family allow cost optimization for tail lamp versus headlamp designs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MCZ33903CP3EK — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MCZ33903CP3EKR2 | MCZ33903CP5EK | MCZ33903CP4EKR2 | MCZ33904BP3EKR2 | MCZ33905BP3EKR2 |
|---|---|---|---|---|---|---|
| Package | 32-SOIC-EP | 32-SOIC-EP - same | 32-SOIC-EP - same | 32-SOIC-EP - same | 32-SOIC-EP - same | 32-SOIC-EP - same |
| Brand | NXP Semiconductors | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same |
| Output Voltage | 5.0V or 3.3V (selectable) | 5.0V or 3.3V (selectable) | 5.0V (fixed) | 3.3V (fixed) | 5.0V or 3.3V (selectable) | 5.0V or 3.3V (selectable, SPI) |
| CAN Interface | HS-CAN ISO 11898-2/-5 | HS-CAN ISO 11898-2/-5 | HS-CAN ISO 11898-2/-5 | HS-CAN ISO 11898-2/-5 | HS-CAN ISO 11898-2/-5 (enhanced) | HS-CAN ISO 11898-2/-5 + CAN FD |
| LIN Interface | LIN 2.0/2.1 | LIN 2.0/2.1 | LIN 2.0/2.1 | LIN 2.0/2.1 | LIN 2.x | Dual LIN 2.x |
| Packaging | Tube | Tape & Reel (7-inch) | Tube | Tape & Reel (7-inch) | Tape & Reel (7-inch) | Tape & Reel (7-inch) |
| AEC-Q100 | Qualified | Qualified | Qualified | Qualified | Qualified | Qualified |
| Lifecycle Status | EOL | EOL | EOL / NRND | EOL | Active | Active |
Principais diferenciais
- Second-generation NXP SBC with integrated CAN + LIN + watchdog in a single 32-SOIC-EP (vs MCZ33390EFR2)
- Selectable 5.0V / 3.3V MCU regulator with external PNP extension capability (vs MCZ33903CP5EK)
- Drop-in tape-and-reel variant available for high-volume SMT lines (vs MCZ33903CP3EKR2)
Notas de projeto
The 32-SOIC-EP package relies on the exposed pad as the primary thermal path. Solder the EP to a copper pour of at least 1 square inch on the top layer and stitch it to inner ground planes with a thermal via array (typically 9-16 vias, 0.3mm drill, 0.5mm pitch). Without adequate thermal copper, the internal voltage regulator and CAN/LIN transceivers can exceed junction temperature under sustained high bus-load conditions in under-hood applications.
Follow the NXP reference layout in the datasheet for the 32-SOIC-EP footprint. Place the VCC output capacitor and VSUP input capacitor as close as possible to their respective pins to minimize parasitic inductance on the regulator feedback loop. Keep the CANH/CANL traces as a differential pair with 120 ohm characteristic impedance, matched length, and symmetric routing to maintain signal integrity at 1 Mbit/s. Add a split-termination network (two 60 ohm resistors with a 10nF to ground) at the bus end for improved common-mode rejection.
Do not apply battery voltage above 40V (load-dump rating) - the part will latch up or suffer permanent damage. When using the selectable 5V/3.3V output, tie VSELECT through a 10k resistor and avoid leaving it floating, as undefined logic levels can cause the regulator to enter an indeterminate state. For LIN bus applications, ensure the master pull-up resistor is sized correctly per LIN 2.x specification (typically 1k ohm in production, 30k ohm in development) to avoid bus communication failures.
Informações de conformidade
AEC-Q100 qualified per NXP product page. RoHS compliant per distributor listings. Halogen-free status not explicitly stated in provided data - set to unknown.
