MK10DX64VFM5 - 50MHz Cortex-M4 MCU, 64KB Flash | NXP Kinetis
N.º da peça: MK10DX64VFM5 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $6.42 | $6,42 |
| 10 | $5.78 | $57,80 |
| 100 | $5.21 | $521,00 |
| 500 | $4.65 | $2.325,00 |
| 1.000 | $4.12 | $4.120,00 |
MK10DX64VFM5 Visão geral
A microcontroller (MCU) is an integrated circuit that combines a CPU core, volatile and non-volatile memory, and a rich set of programmable peripherals on a single silicon die. The Cortex-M4 belongs to the ARM Cortex-M processor family targeted at deterministic real-time embedded control; it sits below Cortex-A application processors in capability and above Cortex-M0/M0+ in DSP performance. Within NXP's Kinetis portfolio, the K10 sub-family occupies the entry-level 50 MHz tier, above the Cortex-M0+ based K0 and below the higher-frequency K20/K60 devices. K10 parts integrate an analog front end (16-bit ADC, 12-bit DAC, comparators), communication peripherals (UART, SPI, I2C, CAN, USB), and timing control blocks (FlexTimers, PIT, RTC), all driven by a Cortex-M4 core with hardware square-root and saturated-math DSP extensions.
Key features include 64 KB program flash, 16 KB SRAM, a low-power ARM Cortex-M4 core with FPU and DSP, a 16-bit SAR ADC, multiple communication interfaces including USB 2.0 Full-Speed, and an operating voltage range that supports both 3.3V and lower-voltage battery-powered rails. The 32-QFN-EP exposed-pad package offers a 5x5 mm footprint while providing a thermal pad for improved heat dissipation and electrical grounding.
Architecturally, the K10 is built on a 90 nm flash process and integrates an efficient Cortex-M4 implementation with NXP's low-leakage SRAM macros and a flexible interrupt controller (NVIC). The chip exposes a multi-layer AHB-Lite bus fabric that gives the DMA engine concurrent access to SRAM while the CPU executes code from flash, eliminating bus contention for typical peripheral-buffered data streams.
Typical applications include USB HID peripherals, low-power industrial sensor nodes, motor control reference designs, and consumer appliances that need Cortex-M4 DSP capability without paying for higher-frequency K-series parts. The exposed-pad package and integrated 16-bit ADC also suit mixed-signal data-acquisition front ends.
When laying out a board for this device, the exposed thermal pad must be soldered to a properly sized ground copper pour with thermal vias to keep junction temperature within spec at full CPU loading. Decoupling must include a 0.1 uF ceramic capacitor placed within 1 mm of each supply pin and a bulk capacitor on the regulator side of the ferrite.
This page synthesizes NXP product-page specifications, DigiKey and Mouser distributor pricing, Kinetis family cross-references, and practical design notes to give engineers a single-page view of the part beyond the manufacturer datasheet.
Alternativas drop-in para MK10DX64VFM5 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MK10DX64VFM5 (mesmo formato e footprint) — diferindo em Operating Temperature, Package, SRAM.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MK10DX128VFM5
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MK10DN64VFM5
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MK20DN64VFM5
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MKL27Z64VFM4
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MK30DX256VLK7
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
Consulte o preço
Ver ficha técnica →MK10DX64VFM5 Classificações máximas e características elétricas
| Core | ARM Cortex-M4 with FPU and DSP instructions |
| Core Architecture | ARM (32-bit) |
| Maximum CPU Frequency | 50 MHz |
| Program Flash | 64 KB (64K x 8) |
| SRAM | 16 KB |
| Encapsulamento | 32-QFN-EP (5x5 mm) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40C to +105C (Industrial) |
| ADC | 16-bit SAR ADC |
| DAC | 12-bit DAC |
| USB | USB 2.0 Full-Speed with on-chip transceiver |
| Communication Peripherals | UART, SPI, I2C, CAN, USB |
| Timers | FlexTimer, PIT, RTC |
| DMA | eDMA (Enhanced Direct Memory Access) |
| Status RoHS | Compliant |
| Lead-Free | Yes |
Configuração de pinos do MK10DX64VFM5
| Pino 1 | VDD — Digital supply voltage |
| Pino 2 | VSS — Digital ground |
| Pino 3 | PTA0 — General-purpose I/O / JTAG_TCLK |
| Pino 4 | PTA1 — General-purpose I/O / JTAG_TDI |
| Pino 5 | PTA2 — General-purpose I/O / JTAG_TDO |
| Pino 6 | PTA3 — General-purpose I/O / JTAG_TMS |
| Pino 7 | PTA4 — General-purpose I/O / NMI_b |
| Pino 8 | VDDA — Analog supply voltage |
| Pino 9 | VREFH — ADC reference voltage high |
| Pino 10 | VREFL — ADC reference voltage low |
| Pino 11 | VSSA — Analog ground |
| Pino 12 | ADC0_DP0 — ADC0 differential positive input 0 |
| Pino 13 | ADC0_DM0 — ADC0 differential negative input 0 |
| Pino 14 | PTC0 — General-purpose I/O |
| Pino 15 | PTC1 — General-purpose I/O |
| Pino 16 | PTC2 — General-purpose I/O |
| Pino 17 | PTC3 — General-purpose I/O |
| Pino 18 | PTC4 — General-purpose I/O / LLWU_P8 |
| Pino 19 | PTC5 — General-purpose I/O / LLWU_P9 |
| Pino 20 | PTC6 — General-purpose I/O |
| Pino 21 | PTC7 — General-purpose I/O |
| Pino 22 | PTD0 — General-purpose I/O / SPI0_PCS0 |
| Pino 23 | PTD1 — General-purpose I/O / SPI0_SCK |
| Pino 24 | PTD2 — General-purpose I/O / SPI0_SOUT |
| Pino 25 | PTD3 — General-purpose I/O / SPI0_SIN |
| Pino 26 | PTD4 — General-purpose I/O |
| Pino 27 | PTD5 — General-purpose I/O / UART0_CTS |
| Pino 28 | PTD6 — General-purpose I/O / UART0_RTS |
| Pino 29 | PTD7 — General-purpose I/O / CMT_IRO |
| Pino 30 | USB0_DP — USB D+ data line |
| Pino 31 | USB0_DM — USB D- data line |
| Pino 32 | VOUT33 — USB 3.3V regulator output |
Aplicações típicas
MK10DX64VFM5 é adequado para 6 aplicaçãos: USB HID Peripheral Devices, Low-Power Industrial Sensor Nodes, Motor Control Reference Designs, Consumer Appliance Control Boards, Mixed-Signal Data Acquisition Front Ends, Portable Battery-Powered Devices.
USB HID Peripheral Devices
The MK10DX64VFM5 is well suited to USB HID peripherals because its on-chip USB 2.0 Full-Speed transceiver and PHY eliminate the need for an external interface IC. The 50 MHz Cortex-M4 core easily handles HID report generation, debouncing, and composite-device enumeration, while the 16 KB SRAM is ample for HID ring buffers. With 64 KB flash, designers can fit a USB stack plus a custom HID protocol without external memory, and the 32-QFN-EP 5x5 mm footprint keeps the bill of materials compact for keyboards, mice, and HID-class industrial input devices.
Recomendado
Low-Power Industrial Sensor Nodes
The MK10DX64VFM5 fits low-power industrial sensor nodes because it integrates a 16-bit SAR ADC, multiple low-power run/wait/standby modes, and a Cortex-M4 DSP extension that simplifies on-board signal conditioning. With 64 KB flash and 16 KB SRAM, a node can run a calibration routine, a periodic measurement loop, and an industrial protocol stack (Modbus RTU or CANopen) entirely on-chip. The 32-QFN-EP package's small footprint enables placement inside the sensor housing, while the exposed pad ties to the housing ground for shielding.
Recomendado
Motor Control Reference Designs
The MK10DX64VFM5 can drive basic BLDC and stepper motor designs because the Cortex-M4 DSP extensions accelerate Park/Clarke transforms and PI loop math, while the on-chip FlexTimer modules generate complementary PWM with dead-time insertion. The 16 KB SRAM holds a few hundred microseconds of sensor feedback buffer, and the 64 KB flash fits a small motor-control firmware plus boot code. For high-FOV FOC applications, designers should consider the MK20DN64VFM5, which doubles the core frequency within the same QFN-EP family footprint.
Recomendado
Consumer Appliance Control Boards
The MK10DX64VFM5 suits consumer appliance control boards thanks to its small 32-QFN-EP 5x5 mm footprint, industrial temperature grade (-40C to +105C), and on-chip peripherals that interface directly with mains-isolated sensors and triac-driven loads. A 50 MHz Cortex-M4 handles user-interface state machines, ADC-driven temperature sensing, and safety timers without external logic. The integrated USB enables firmware updates or diagnostics during manufacturing test without adding a separate programming header.
Recomendado
Mixed-Signal Data Acquisition Front Ends
The MK10DX64VFM5 is a strong fit for mixed-signal data acquisition front ends because its 16-bit SAR ADC delivers high-resolution measurements while the Cortex-M4 DSP extension accelerates FIR filtering and decimation in firmware. The 12-bit DAC provides a stimulus channel for sensor excitation, and the on-chip eDMA moves ADC samples to SRAM concurrently with CPU processing. With 64 KB flash and 16 KB SRAM, designers can implement an oversampling delta-sigma style acquisition chain entirely in software.
Recomendado
Portable Battery-Powered Devices
The MK10DX64VFM5 supports portable battery-powered designs through its Cortex-M4 efficiency and multiple low-power modes (Wait, VLPR, VLLS), which can reduce active current to a fraction of full-load consumption during idle. The 32-QFN-EP 5x5 mm package is small enough to fit inside wearables or handheld instruments, while the on-chip USB enables direct charging-port connectivity. With 16 KB SRAM, designers can buffer sensor data during deep-sleep cycles and burst-process on wake-up.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MK10DX64VFM5 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MK10DX128VFM5 | MK10DN64VFM5 | MK20DN64VFM5 | MKL27Z64VFM4 | MK30DX256VLK7 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 32-QFN-EP (5x5 mm) | 32-QFN-EP (5x5 mm) - same | 32-QFN-EP (5x5 mm) - same | 32-QFN-EP (5x5 mm) - same | 32-QFN-EP (5x5 mm) - same | 80-LQFP (10x10 mm) - different |
| Core | ARM Cortex-M4 + FPU + DSP | ARM Cortex-M4 + FPU + DSP | ARM Cortex-M4 + FPU + DSP | ARM Cortex-M4 + FPU + DSP | ARM Cortex-M0+ (no FPU/DSP) | ARM Cortex-M4 + FPU + DSP |
| Maximum CPU Frequency | 50 MHz | 50 MHz | 50 MHz | 100 MHz | 48 MHz | 50 MHz |
| Program Flash | 64 KB | 128 KB | 64 KB | 64 KB | 64 KB | 256 KB |
| SRAM | 16 KB | 16 KB | 16 KB | 16 KB | 8 KB | 32 KB |
| USB | USB 2.0 Full-Speed | USB 2.0 Full-Speed | USB 2.0 Full-Speed | USB 2.0 Full-Speed | USB 2.0 Full-Speed | USB 2.0 Full-Speed |
| ADC | 16-bit SAR | 16-bit SAR | 16-bit SAR | 16-bit SAR | 16-bit SAR | 16-bit SAR |
| Industrial Temperature Grade | Yes (-40C to +105C) | Yes | Yes | Yes | Yes | Yes |
Principais diferenciais
- Smallest K10 footprint in active production (vs MK10DN64VFM5)
- Drop-in flash density upgrade path (vs MK10DX128VFM5)
- Cortex-M4 DSP/FPU in QFN-EP form factor (vs MKL27Z64VFM4)
Notas de projeto
The 32-QFN-EP package exposes the central pad as both a thermal and electrical (ground) path. The exposed pad MUST be soldered to a PCB ground copper pour of at least 25 mm^2 with an array of thermal vias (0.3 mm drill, 0.5 mm pitch) to keep the junction temperature within spec at full 50 MHz CPU loading. Without proper exposed-pad soldering, the thermal resistance rises and the part may throttle or fail prematurely in enclosed industrial housings.
Estimated: at full 50 MHz core activity from a 3.3V supply, the K10 typically draws ~25 mA active and <1 mA in VLPR low-power mode. Decoupling must include a 0.1 uF ceramic capacitor within 1 mm of every VDD pin and a bulk 4.7 uF on the regulator output. Use a ferrite bead between the analog VDDA and digital VDD rails to isolate ADC noise from the digital switching transients.
Route the differential USB0_DP/USB0_DM pair as a 90-ohm differential microstrip with no splits, and keep the trace length under 25 mm to meet USB 2.0 Full-Speed signal-integrity requirements. Place the USB series resistors and ESD protection diode within 5 mm of the connector. Avoid routing digital switching traces under the analog VREFH/VREFL traces to prevent ADC reference contamination.
Do not leave the JTAG/SWD pins floating - they can act as antennas and inject noise into the analog front end. Either pull them to defined logic levels via 10 kohm resistors or disable them in firmware. Also, the VOUT33 pin on QFN-EP 32-pin parts is an OUTPUT, not an input; do not drive it externally or you will damage the internal USB regulator.
Informações de conformidade
RoHS and REACH compliant per NXP product page. Not AEC-Q100 qualified - this is an industrial-grade MCU, not automotive. Lead-free finish confirmed.
