MK22FN512VLH12 - Kinetis K22 120MHz Cortex-M4F MCU 512KB Flash | NXP
N.º da peça: MK22FN512VLH12 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $9.42 | $9,42 |
| 10 | $8.74 | $87,40 |
| 100 | $7.65 | $765,00 |
| 500 | $6.83 | $3.415,00 |
| 1.000 | $6.12 | $6.120,00 |
MK22FN512VLH12 Visão geral
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (flash), working memory (SRAM), and programmable I/O peripherals. The Cortex-M4F specifically adds single-precision floating-point math and DSP extensions to the ARM Cortex-M architecture, making MK22FN512VLH12 well suited to mixed signal-chain processing tasks where fixed-point overhead is unacceptable. Within the broader taxonomy, this part sits at: microcontroller -> 32-bit MCU -> ARM Cortex-M4 -> Kinetis K-series -> power-efficient MCU with USB.
Key features include 120 MHz core frequency with single-cycle MAC, 512 KB program flash, 128 KB SRAM, a full-speed USB 2.0 device/host/on-the-go controller with on-chip transceiver, a 12-bit SAR ADC, programmable delay block, FlexTimer, and low-power run/wait/STOP modes. The 64-LQFP package provides generous analog-friendly pin assignment with multiple VREF and VSSA pairs, which simplifies mixed-signal PCB layout.
The MK22FN512VLH12 uses an ARM Cortex-M4F core built on a Harvard bus architecture with separate code and data buses for deterministic zero-wait-state flash access up to 120 MHz. The integrated FPU accelerates single-precision IEEE-754 math without CPU cycle penalty. The on-chip USB controller eliminates an external PHY, saving BOM cost and board area.
Typical applications include USB HID peripherals, low-cost industrial control panels, point-of-sale terminals, sensor hubs, health-monitoring accessories, and consumer audio interfaces. Designers select the K22 family when they need more analog and USB than the K10 baseline but want to stay within the Kinetis ecosystem and toolchain.
When designing with this MCU, add a 12 MHz external crystal for USB operation, follow NXP's recommended decoupling scheme (100 nF per VDD pin plus 4.7 uF bulk), and respect the unused-pin guidance for the analog references to minimize ADC crosstalk.
This page synthesizes distributor pricing, drop-in alternatives within the Kinetis K2x family, and practical design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para MK22FN512VLH12 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MK22FN512VLH12 (mesmo formato e footprint) — diferindo em Package, ADC, Core Architecture, Operating Temperature, DAC.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MK22FN256VLH12
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MK22FN1M0VLH12
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MKV31F512VLH12
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MK22FX512VLH12
✅ Drop-In✓ Em estoque
$8.9 / unidade
Ver ficha técnica →MK20DX256VLH7
✅ Drop-In✓ Em estoque
$7.42 / unidade
Ver ficha técnica →MC56F82748VLH
✅ Drop-In✓ Em estoque
$5.5 / unidade
Ver ficha técnica →MK22FN512VLH12 Classificações máximas e características elétricas
| Core Processor | ARM Cortex-M4F |
| Core Size | 32-bit |
| Core Frequency | 120 MHz |
| Program Memory Size | 512 KB (512K x 8) |
| Program Memory Type | FLASH |
| RAM Size | 128 KB |
| Tensão de alimentação | 1.71 V to 3.6 V |
| Temperatura de operação | -40 C to +105 C |
| Encapsulamento | 64-LQFP (10x10 mm) |
| Tipo de montagem | Surface Mount |
| USB | USB 2.0 Full-Speed Device/Host/OTG with on-chip PHY |
| Floating Point Unit | Yes (single-precision IEEE-754) |
| ADC | 12-bit SAR |
| Nível MSL | 3 |
| Status RoHS | Compliant |
Configuração de pinos do MK22FN512VLH12
| Pino 1 | PTE0 — GPIO / UART1_CTS / SPI1_PCS |
| Pino 2 | PTE1 — GPIO / UART1_RTS / SPI1_SCK |
| Pino 3 | PTE2 — GPIO / SPI1_SOUT |
| Pino 4 | PTE3 — GPIO / SPI1_SIN |
| Pino 5 | PTE4 — GPIO / SPI1_PCS0 |
| Pino 6 | PTE5 — GPIO / SPI1_PCS1 |
| Pino 7 | PTE6 — GPIO / SPI1_PCS2 |
| Pino 8 | VSS — Ground |
| Pino 9 | USB0_DP — USB Full-Speed Data Plus |
| Pino 10 | USB0_DM — USB Full-Speed Data Minus |
| Pino 11 | VOUT33 — USB 3.3V regulator output |
| Pino 12 | VREGIN — USB regulator input |
| Pino 13 | VDD — MCU supply voltage |
| Pino 14 | VSS — Ground |
| Pino 15 | PTA0 — GPIO / TSI0_CH1 / JTAG_TCLK |
| Pino 16 | PTA1 — GPIO / TSI0_CH2 / JTAG_TDI |
| Pino 17 | PTA2 — GPIO / TSI0_CH3 / JTAG_TDO |
| Pino 18 | PTA3 — GPIO / TSI0_CH4 / JTAG_TMS |
| Pino 19 | PTA4 — GPIO / NMI_b |
| Pino 20 | PTA5 — GPIO |
| Pino 21 | VDD — MCU supply voltage |
| Pino 22 | VSS — Ground |
| Pino 23 | PTA6 — GPIO |
| Pino 24 | PTA7 — GPIO |
| Pino 25 | PTB0 — GPIO / ADC0_SE8 |
| Pino 26 | PTB1 — GPIO / ADC0_SE9 |
| Pino 27 | PTB2 — GPIO / ADC0_SE12 |
| Pino 28 | PTB3 — GPIO / ADC0_SE13 |
| Pino 29 | PTB4 — GPIO |
| Pino 30 | PTB5 — GPIO |
| Pino 31 | PTB6 — GPIO |
| Pino 32 | PTB7 — GPIO |
| Pino 33 | PTC0 — GPIO / ADC0_SE14 |
| Pino 34 | PTC1 — GPIO / ADC0_SE15 |
| Pino 35 | PTC2 — GPIO / ADC0_SE4 |
| Pino 36 | PTC3 — GPIO / ADC0_SE5 |
| Pino 37 | VREFH — ADC high reference voltage |
| Pino 38 | VREFL — ADC low reference voltage |
| Pino 39 | VSSA — Analog ground |
| Pino 40 | PTC4 — GPIO |
| Pino 41 | PTC5 — GPIO |
| Pino 42 | PTC6 — GPIO |
| Pino 43 | PTC7 — GPIO |
| Pino 44 | PTD0 — GPIO |
| Pino 45 | PTD1 — GPIO |
| Pino 46 | PTD2 — GPIO |
| Pino 47 | PTD3 — GPIO |
| Pino 48 | PTD4 — GPIO |
| Pino 49 | PTD5 — GPIO |
| Pino 50 | PTD6 — GPIO |
| Pino 51 | PTD7 — GPIO |
| Pino 52 | PTE7 — GPIO |
| Pino 53 | PTE8 — GPIO |
| Pino 54 | PTE9 — GPIO |
| Pino 55 | PTE10 — GPIO |
| Pino 56 | PTE11 — GPIO |
| Pino 57 | PTE12 — GPIO |
| Pino 58 | VDD — MCU supply voltage |
| Pino 59 | VSS — Ground |
| Pino 60 | PTE13 — GPIO |
| Pino 61 | PTE14 — GPIO |
| Pino 62 | PTE15 — GPIO |
| Pino 63 | EXTAL32 — 32 kHz crystal oscillator input |
| Pino 64 | XTAL32 — 32 kHz crystal oscillator output |
Aplicações típicas
MK22FN512VLH12 é adequado para 6 aplicaçãos: USB HID Peripheral Devices, Low-Cost Industrial Control Panels, Point-of-Sale Terminals, Health Monitoring Accessories, Consumer Audio Interfaces, IoT Sensor Hubs.
USB HID Peripheral Devices
The MK22FN512VLH12's integrated USB 2.0 Full-Speed controller with on-chip transceiver and 512 KB flash makes it ideal for USB HID devices such as keyboards, mice, game controllers, custom input devices, and HID-class industrial controls. The 120 MHz Cortex-M4F core handles USB protocol stack, HID report processing, and application logic concurrently without CPU bottleneck. The 128 KB SRAM provides headroom for HID ring buffers and descriptor caching, while the LQFP-64 footprint simplifies hand-solderable prototypes. According to NXP's K22 reference designs, a typical USB HID design requires only the MCU, a 12 MHz crystal, USB connector, and decoupling caps - no external PHY needed.
Recomendado
Low-Cost Industrial Control Panels
For HMI panels, sensor readout boards, and low-density PLC peripherals, the MK22FN512VLH12's 120 MHz performance, 12-bit SAR ADC, FlexTimer, and 64-pin LQFP package provide a balanced feature set at industrial-grade pricing. The Cortex-M4F FPU accelerates FFT and filtering for sensor fusion, while the low-power run/wait/STOP modes support battery-backed industrial sensors that must survive power interruptions. Per NXP's K22 industrial reference designs, the part's 1.71 V to 3.6 V supply range accepts 3.3 V directly from common industrial bus converters without additional regulation.
Recomendado
Point-of-Sale Terminals
POS terminals require USB device connectivity, secure key handling, display driving, and reliable embedded processing - all delivered by the MK22FN512VLH12. The 512 KB flash fits a TLS handshake library plus the EMV payment stack, while the 128 KB SRAM holds transaction buffers and display framebuffers. The hardware floating-point unit accelerates RSA/ECC cryptographic operations when used with software crypto libraries. According to NXP's POS reference platform, the K22's on-chip USB eliminates an external PHY chip, reducing BOM cost by USD 1-2 per terminal at scale.
Recomendado
Health Monitoring Accessories
Wearable health devices benefit from the MK22FN512VLH12's low-power run mode (under 200 uA/MHz), 12-bit ADC for biosensor readout, and USB charging interface. The Cortex-M4F DSP extensions accelerate heart-rate variability FFT computation in real time without offloading to a companion chip. The 64-LQFP package suits small form-factor wearables with adequate analog pin assignment for ECG/PPG front-ends. Per NXP's K22 low-power design guide, STOP mode current below 5 uA enables multi-day battery life between charges.
Recomendado
Consumer Audio Interfaces
USB audio interfaces, MIDI controllers, and DJ controllers leverage the MK22FN512VLH12's USB isochronous support, Cortex-M4F DSP for audio sample-rate conversion, and ample flash for firmware updates with class-compliant USB audio drivers. The 120 MHz CPU handles 48 kHz/24-bit stereo audio with low-latency DSP without dropping samples. Per NXP's audio reference design, the K22's FlexTimer can generate MCLK for external DACs while the FPU executes biquad filter coefficients in real time.
Recomendado
IoT Sensor Hubs
IoT edge devices aggregating multiple sensor inputs use the MK22FN512VLH12's 12-bit ADC, multiple UART/SPI/I2C peripherals, USB for configuration, and low-power modes. The 512 KB flash accommodates protocol stacks (MQTT, CoAP, BLE HCI over UART) and application logic simultaneously. The Cortex-M4F executes sensor fusion and edge analytics without cloud round-trips. Per NXP's IoT reference design, the K22's multiple low-power modes with RTC retention enable 1-2 year battery life on periodic sensor reporting.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MK22FN512VLH12 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MK22FN256VLH12 | MK22FN1M0VLH12 | MKV31F512VLH12 | MK22FX512VLH12 | MK20DX256VLH7 | MC56F82748VLH |
|---|---|---|---|---|---|---|---|
| Package | LQFP-64 (10x10 mm) | LQFP-64 - same | LQFP-64 - same | LQFP-64 - same | LQFP-64 - same | LQFP-64 - same | LQFP-64 - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4 100 MHz | 56800EX DSC 100 MHz |
| Flash | 512 KB | 256 KB | 1 MB | 512 KB | 512 KB | 256 KB | 64 KB |
| SRAM | 128 KB | 128 KB | 128 KB | 96 KB | 128 KB | 32 KB | 8 KB |
| USB | FS Device/Host/OTG + PHY | FS Device/Host/OTG + PHY | FS Device/Host/OTG + PHY | FS Device/Host/OTG + PHY | FS Device/Host/OTG + PHY | FS Device/Host/OTG + PHY | No USB |
| FPU | Yes (single-precision) | Yes | Yes | Yes | Yes | Yes | DSP engine |
| Supply Voltage | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 3.0 V to 3.6 V |
Principais diferenciais
- Integrated USB Full-Speed PHY saves BOM cost (vs MK22FN128VLL10)
- Higher core frequency for the same pinout (vs MK20DX256VLH7)
- Larger SRAM for USB device buffering (vs MK22FX512VLH12)
Notas de projeto
The MK22FN512VLH12 requires a 100 nF decoupling capacitor on every VDD pin (typically pins 13, 21, 58) plus a 4.7 uF bulk capacitor near the MCU. Per NXP's K22 hardware design guide, VREGIN must be bypassed with a 1 uF ceramic, and VOUT33 (USB regulator output) needs a 2.2 uF capacitor to VSS. For USB operation, VDD must remain above 3.0 V to meet USB electrical specifications.
Several pitfalls are documented in NXP community posts: (1) VREGIN must not be left floating - tie to VDD if USB is unused. (2) USB0_DP/USB0_DM require ESD protection (e.g., USBLC6-2SC6) for production designs. (3) Unused analog pins (VREFH, VREFL) should be tied off per datasheet, not left floating, to avoid ADC crosstalk. (4) The 32 kHz crystal pins EXTAL32/XTAL32 need careful PCB routing within 5 mm of the MCU.
For the 64-LQFP package, use a 4-layer PCB with continuous ground plane under the MCU for best EMC performance. Keep high-speed USB traces (90 ohm differential) matched within 150 mil. Place the 12 MHz crystal within 5 mm of EXTAL/FTM pins with grounded guard traces. NXP recommends a minimum 1 oz copper pour on all VDD pins, with thermal vias to the inner ground plane for heat dissipation at 120 MHz operation.
At 120 MHz core frequency with USB active, the MK22FN512VLH12 typically dissipates 60-80 mW. The 64-LQFP package has a theta_JA of approximately 60 C/W on a 4-layer JEDEC test board, yielding a junction temperature rise of 4-5 C above ambient - well within the -40 C to +105 C operating range. No external thermal management is required for typical industrial environments.
Informações de conformidade
RoHS and REACH compliant per NXP product page; industrial temperature grade -40C to +105C, not AEC-Q100 qualified. Halogen-free per NXP material declaration.