MKL17Z64VDA4 - 48MHz Cortex-M0+ MCU, 64KB Flash | NXP
N.º da peça: MKL17Z64VDA4 ✓ AtivoMKL17Z64VDA4 Visão geral
A microcontroller unit (MCU) is a single integrated circuit that combines a processor core, memory, and programmable peripherals into one chip, forming the lowest level of the embedded computing hierarchy (MCU -> embedded processor -> microprocessor -> SoC). The Kinetis KL family from NXP sits in the ultra-low-power tier of this hierarchy, targeting battery-operated and space-constrained designs where every microamp of current matters.
Key features of the MKL17Z64VDA4 include the energy-efficient Cortex-M0+ core, 64 KB (64K x 8) of on-chip flash program memory for firmware storage, 16 KB of SRAM for data and stack, and USB connectivity as noted on the NXP product page. The extremely small 36-XFBGA package with 0.5 mm ball pitch enables placement on the underside of dense PCBs, freeing board area for sensors, radios, or displays in wearables and IoT end nodes.
Technically, the device belongs to the Kinetis KL1x general-purpose ultra-low-power family, which provides additional memory, communications, and analog peripheral options beyond the entry-level KL0x family. The 48 MHz Cortex-M0+ executes Thumb instruction set code with a two-stage pipeline, delivering efficient real-time control with a compact gate count and correspondingly low dynamic and static power consumption.
Typical applications include battery-powered wearable devices, smart sensors and IoT end nodes, portable medical accessories, and compact human-interface controllers where small footprint and low standby power dominate the selection criteria.
When designing with a 3.5 x 3.5 mm BGA, plan the PCB with via-in-pad or escape routing to all 36 balls, and budget rework capability carefully since BGA inspection requires X-ray equipment.
This page synthesizes distributor availability data, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, with all pricing referenced as of 2026-10-18.
Alternativas drop-in para MKL17Z64VDA4 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
MKL27Z64VDA4
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MK32Z64VDA4
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MKL17Z64VDA4 Classificações máximas e características elétricas
| Core Processor | ARM Cortex-M0+ |
| Core Size | 32-Bit |
| Frequência máxima de clock | 48 MHz |
| Flash Memory | 64 KB (64K x 8) |
| SRAM | 16 KB |
| Product Family | Kinetis KL1 (KL17) |
| Encapsulamento | 36-XFBGA (3.5 x 3.5 mm) |
| Package Alias | MAPBGA-36 |
| Tipo de montagem | Surface Mount |
| USB | Yes (per NXP product page) |
| Connectivity | USB |
| Status do ciclo de vida | Active |
Guia de Configuração de Pinos do MKL17Z64VDA4 mapbga-36
Configuração de pinos para MKL17Z64VDA4 (pacote mapbga-36). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MKL17Z64VDA4.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MKL17Z64VDA4 é adequado para 6 aplicaçãos: Wearable and Portable Devices, IoT Sensor End Nodes, Portable Medical Accessories, Human Interface and Touch Controllers, Battery-Powered Metering and Data Loggers, Compact Embedded Control and Actuation.
Wearable and Portable Devices
The MKL17Z64VDA4 is a strong fit for wearables because its 36-ball XFBGA package occupies only 3.5 x 3.5 mm of PCB area, allowing the MCU to sit beneath a battery, sensor flex, or display connector in a ring, band, or patch. The 48 MHz Cortex-M0+ delivers enough throughput for sensor fusion pre-processing while remaining in ARM's most energy-efficient core class, and 64 KB flash plus 16 KB SRAM accommodate acquisition and BLE-adjacent sensor firmware. Designers should budget for BGA escape routing on 4+ layer boards and use low-power sleep modes between samples to maximize battery life.
Recomendado
IoT Sensor End Nodes
Battery-powered IoT end nodes benefit from the MKL17Z64VDA4's combination of an energy-efficient 48 MHz Cortex-M0+ core and a minimal 3.5 x 3.5 mm footprint that co-locates cleanly with MEMS sensors and radio modules. The 64 KB flash holds protocol stacks for simple nodes, while 16 KB SRAM buffers sensor samples between radio wake-ups. According to NXP, the family targets battery-operated embedded applications, and the ultra-low-power KL1x architecture reduces sleep-state consumption so a coin cell can power the node for months to years depending on duty cycle. USB capability additionally supports factory programming and test fixtures.
Recomendado
Portable Medical Accessories
Portable medical accessories such as glucose-loggers, pulse sensors, and adherence monitors require small, efficient controllers with adequate memory for measurement firmware. The MKL17Z64VDA4 offers 64 KB flash and 16 KB SRAM, a 48 MHz Cortex-M0+ core for filtering and calibration math, and USB for docking-station data upload - a connectivity option explicitly noted on the NXP product page. Its 36-XFBGA package (3.5 x 3.5 mm) supports miniature disposable or reusable form factors. Medical designers should validate the device's temperature and qualification data against their regulatory requirements and consider NXP longevity commitments for long product lifecycles.
Recomendado
Human Interface and Touch Controllers
Compact HID devices - wireless mice, presenters, and capacitive-touch panels - leverage the MKL17Z64VDA4's Kinetis L-family touch-sensing support and native USB device capability in a 3.5 x 3.5 mm BGA that hides beneath a flex or main board. The 48 MHz Cortex-M0+ scans touch electrodes and services USB endpoints without a heavier core, and 64 KB flash retains descriptors, firmware, and calibration tables. Because BGA assembly complicates prototyping, evaluate the same firmware on a QFN-packaged KL17 sibling during development, then commit the DA4 BGA for production density.
Recomendado
Battery-Powered Metering and Data Loggers
Standalone data loggers for temperature, flow, or energy metering need long sleep periods, periodic wake-ups, and sufficient RAM to buffer records. The MKL17Z64VDA4's ultra-low-power Kinetis KL1x architecture supports low static consumption between samples, while the 48 MHz Cortex-M0+ completes conversion, scaling, and timestamping quickly so the CPU returns to sleep. The 16 KB SRAM stores thousands of compact records, and USB enables field data retrieval from the logger - a capability NXP highlights for this part. The 36-XFBGA footprint fits multi-layer logger PCBs alongside battery holders and memory.
Recomendado
Compact Embedded Control and Actuation
Space-constrained control boards - small motor drivers, valve controllers, and actuator interfaces - use the MKL17Z64VDA4's 48 MHz Cortex-M0+ for closed-loop timing tasks and its GPIO resources for PWM and status signaling within a 3.5 x 3.5 mm footprint. The 64 KB flash supports field-updatable control firmware, and the ultra-low-power design suits battery-backup scenarios. Designers must implement BGA escape routing and via-in-pad on at least four layers, and follow NXP datasheet decoupling guidance, placing 100 nF ceramics at each power/ground ball pair to ensure clean supply during PWM switching events.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MKL17Z64VDA4 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MKL27Z64VDA4 | MK32Z64VDA4 | STM32L052T8Y7TR |
|---|---|---|---|---|
| Package | 36-XFBGA (3.5 x 3.5 mm) | 36-XFBGA (3.5 x 3.5 mm) - same DA4 footprint | 36-XFBGA (3.5 x 3.5 mm) - same DA4 footprint | 36-WLCSP - different ballout, not drop-in |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | STMicroelectronics |
| Core | ARM Cortex-M0+ 32-bit | ARM Cortex-M0+ 32-bit | ARM Cortex-M0+ 32-bit | ARM Cortex-M0 32-bit |
| Flash Memory | 64 KB | 64 KB | 64 KB | 64 KB |
Principais diferenciais
- Native USB in an ultra-small 36-ball BGA (vs STM32L052T8Y7TR)
- Higher clock speed in the same footprint (vs STM32L052T8Y7TR)
- Drop-in KL-family sister part for non-USB designs (vs MKL27Z64VDA4)
Notas de projeto
The 36-ball XFBGA (3.5 x 3.5 mm) footprint requires careful escape routing: use via-in-pad with filled and capped vias for the inner balls, or dog-bone escapes on the perimeter if your fab supports only fine-line track/space of 4 mil or better. A minimum 4-layer stack is recommended so power and ground planes sit directly beneath the BGA. Verify the ball map against the Kinetis KL17 datasheet pinout chapter before finalizing the land pattern.
BGA solder joints on the MKL17Z64VDA4 cannot be inspected visually; include X-ray or acoustic inspection in your assembly quality plan, and ensure your CM supports 0.5 mm-class BGA reflow profiles. For firmware development and debugging, prototype on the same die in a QFN package (e.g., MKL17Z64VFM4) using a standard SWD header, then migrate to the DA4 BGA for production boards to avoid reworking BGA debug connections.
Although exact supply current figures are not in the captured data, Kinetis KL-family parts are designed around aggressive power modes; implement the datasheet's low-power stop and VLPS modes with proper wake sources, and place 100 nF ceramic decoupling capacitors as close as possible to every VDD/VSS ball pair on the bottom side of the board. Estimated: even a few hundred microamps of average current can dominate a coin-cell budget, so measure actual mode currents on your bench firmware rather than relying on estimates.
Informações de conformidade
The NXP product page lists an Environmental Quality section but specific RoHS/REACH statuses were not captured in the verified data snapshot. Consult the NXP product page for current compliance certificates.
