MKL26Z64VFM4 - 48MHz Cortex-M0+ 64KB USB MCU | NXP
N.º da peça: MKL26Z64VFM4 ✓ Ativo| Qtd. | Preço unitário | Total |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
MKL26Z64VFM4 Visão geral
A microcontroller unit (MCU) is a single integrated circuit that combines a processor core, memory, and programmable peripherals into one chip, sitting at the heart of embedded systems. Within the power-management hierarchy of embedded semiconductors, the Kinetis KL2x family belongs to NXP's Kinetis L series of ultra-low-power MCUs built on the ARM Cortex-M0+ core, the most energy-efficient member of the ARM Cortex-M processor line.
Key features include the 48 MHz Cortex-M0+ core with single-cycle fast GPIO, 64 KB of on-chip flash memory and 8 KB of SRAM, and a full-speed USB 2.0 On-the-Go controller. Uniquely in this class, the KL2x sub-family adds a crystal-less USB device controller, eliminating the external crystal and its cost for USB device applications. The part operates from a 1.8 V, 2.5 V, or 3.3 V supply, supporting battery-powered designs.
The KL26 architecture leverages NXP's low-leakage process technology with multiple low-power modes, allowing the core, peripherals, and clocks to be independently gated for microamp-level sleep currents. The comprehensive peripheral set includes serial communication interfaces (UART, SPI, I2C), ADC, and TPM timers.
Typical applications include portable and battery-powered devices, USB HID devices and USB sensors, human-interface equipment, and small industrial control nodes where USB connectivity and low power are essential.
Design consideration: the crystal-less USB feature requires proper reference-clock configuration per NXP application notes; verify USB compliance in your final layout. Plan flash and SRAM budgets early, since 8 KB of RAM is modest for stacks plus USB buffers.
This page synthesizes distributor availability, pin-compatible alternatives, and practical design guidance not found in the manufacturer datasheet.
Alternativas drop-in para MKL26Z64VFM4 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MKL26Z64VFM4 (mesmo formato e footprint) — diferindo em Flash Memory, Package, Product Family, SRAM.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MKL26Z128VFM4
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MKL26Z32VFM4
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MKL16Z64VFM4
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MKL15Z64VFM4
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MKL04Z32VFM4
✅ Drop-In✓ Em estoque
$1.15 / unidade
Ver ficha técnica →MKL26Z64VFM4 Classificações máximas e características elétricas
| Core Processor | ARM Cortex-M0+ |
| Core Size | 32-bit |
| Frequência máxima de clock | 48 MHz |
| Flash Memory | 64 KB (64K x 8) |
| SRAM | 8 KB |
| Tensão de alimentação | 1.8 V / 2.5 V / 3.3 V |
| USB Controller | USB 2.0 full-speed OTG with crystal-less USB device |
| Encapsulamento | 32-HVQFN (5x5 mm) with exposed pad |
| Tipo de montagem | Surface Mount |
| Product Family | Kinetis KL2x (Kinetis L) |
| Connectivity | USB, UART, SPI, I2C |
| Status RoHS | Compliant |
| Packaging | Tray |
| Status do ciclo de vida | Active |
Guia de Configuração de Pinos do MKL26Z64VFM4 32-hvqfn (5x5 mm) with exposed pad
Configuração de pinos para MKL26Z64VFM4 (pacote 32-hvqfn (5x5 mm) with exposed pad). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MKL26Z64VFM4.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MKL26Z64VFM4 é adequado para 6 aplicaçãos: USB HID Devices and Peripherals, Portable and Battery-Powered Devices, USB Sensors and Data Loggers, Industrial Control Nodes, Human Interface Equipment, IoT Endpoint and Embedded Sensing Nodes.
USB HID Devices and Peripherals
The MKL26Z64VFM4 fits USB HID applications such as keyboards, mice, game controllers, and USB sensors because it integrates a full-speed USB 2.0 device controller with crystal-less USB operation, removing the external crystal that a discrete USB design would require and cutting BOM cost. The 48 MHz Cortex-M0+ core handles HID report generation with ample margin, while 64 KB flash stores the USB stack and application logic. Placed on a 3.3 V rail with SWD debug access, the MCU enumerates directly on the host without extra clock components; the main trade-off is the 8 KB SRAM budget, which limits the number of concurrent endpoints and buffer depths in composite-device designs.
Recomendado
Portable and Battery-Powered Devices
NXP positions the Kinetis KL2x family explicitly as ultra-low-power MCUs for portable applications, and the MKL26Z64VFM4 exemplifies this with its Cortex-M0+ core, multiple low-power modes, and 1.8 V/2.5 V/3.3 V operation directly compatible with single-cell lithium or two-cell alkaline supplies via small regulators. In a wearable or handheld instrument, the MCU spends most time in a deep-sleep state with peripheral gating and wakes on RTC, pin, or peripheral events, so average current is dominated by sleep specifications rather than the 48 MHz active current. The 5x5 mm HVQFN saves board area, and designers should reserve GPIO and ADC channels for battery-voltage monitoring to implement fuel-gauging in firmware.
Recomendado
USB Sensors and Data Loggers
The MKL26Z64VFM4 suits USB-connected sensor nodes and data loggers: the ADC digitizes analog sensor outputs, the I2C and SPI interfaces read digital sensors, and the USB device controller streams data to a host without a separate USB-to-serial bridge chip, eliminating one IC from the design. Crystal-less USB removes the timing crystal, so only decoupling and sensor passives surround the MCU on a compact 5x5 mm footprint. Firmware typically implements USB CDC or vendor-specific classes for host communication. The engineering consideration is SRAM allocation: USB buffers must coexist with logging buffers in the 8 KB SRAM, so streaming designs should throttle records to flash or host rather than buffering large batches locally.
Recomendado
Industrial Control Nodes
In industrial automation nodes such as small actuators, monitoring points, and machine-interface panels, the MKL26Z64VFM4 provides UART, SPI, and I2C connectivity for field communication plus TPM timers for PWM output to drives and indicators. Operating from the common 3.3 V or 5 V-derived 3.3 V rail, the 48 MHz Cortex-M0+ delivers deterministic response for simple control loops, and the flash-based memory allows field firmware updates over USB or UART bootloaders. The HVQFN exposed pad should be soldered to a solid ground plane for thermal and EMI performance in electrically noisy cabinets. Designers should verify the operating temperature grade on the NXP page against cabinet ambient conditions before committing the design.
Recomendado
Human Interface Equipment
Touch buttons, rotary encoders, LED indicators, and small displays are natural fits for the MKL26Z64VFM4: its single-cycle GPIO toggling at 48 MHz supports fast scanning of key matrices and bit-banged display interfaces, while TPM channels generate PWM dimming for backlights and indicators. The USB device controller lets the same product connect to a PC for configuration or as a USB HID endpoint, a differentiator versus USB-less KL1x parts. Firmware commonly uses the NXP touch-sensing library on the ADC channels for capacitive buttons. The design trade-off is that 8 KB SRAM limits large frame buffers, so this part pairs best with serial-interface displays rather than full framebuffer TFT panels.
Recomendado
IoT Endpoint and Embedded Sensing Nodes
For IoT endpoints that gateways connect over USB or serial, the MKL26Z64VFM4 serves as the local sensing and control MCU: I2C and SPI links to environmental sensors, ADC for analog channels, and the 64 KB flash holding protocol firmware. When paired with an external radio module over UART or SPI, the MCU handles sampling schedules, calibration, and low-power duty cycling while sleeping in Kinetis low-power modes between events. The 1.8 V capability allows direct connection to energy-harvesting or single-cell supplies through small LDOs. Because the part has no integrated RF, total system power depends heavily on the radio's sleep current, so select a companion radio with microamp standby for battery-powered endpoints.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MKL26Z64VFM4 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MKL26Z128VFM4 | MKL26Z32VFM4 | MKL16Z64VFM4 | MKL15Z64VFM4 | MKL04Z32VFM4 |
|---|---|---|---|---|---|---|
| Package | 32-HVQFN (5x5 mm) EP | 32-HVQFN (5x5 mm) - same | 32-HVQFN (5x5 mm) - same | 32-HVQFN (5x5 mm) - same | 32-HVQFN (5x5 mm) - same | 32-HVQFN (5x5 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | ARM Cortex-M0+ 48 MHz | ARM Cortex-M0+ 48 MHz | ARM Cortex-M0+ 48 MHz | ARM Cortex-M0+ 48 MHz | ARM Cortex-M0+ 48 MHz | ARM Cortex-M0+ 48 MHz |
| Flash Memory | 64 KB | 128 KB | 32 KB | 64 KB | 64 KB | 32 KB |
| USB Controller | Full-speed USB OTG + crystal-less USB device | Full-speed USB OTG + crystal-less USB device | Full-speed USB OTG + crystal-less USB device | Crystal-less USB device (no OTG) | No USB | No USB |
| Supply Voltage | 1.8 V / 2.5 V / 3.3 V | 1.8 V / 2.5 V / 3.3 V | 1.8 V / 2.5 V / 3.3 V | 1.8 V / 2.5 V / 3.3 V | 1.8 V / 2.5 V / 3.3 V | 1.8 V / 2.5 V / 3.3 V |
| Lifecycle Status | Active | Active | Active | Active | Active | Active |
Principais diferenciais
- USB OTG plus crystal-less USB device in a 32-pin package (vs MKL16Z64VFM4)
- Integrated USB in the same footprint as non-USB parts (vs MKL15Z64VFM4)
- Balanced 64 KB flash for USB-class applications (vs MKL26Z32VFM4)
Notas de projeto
When using crystal-less USB, follow the NXP KL26 sub-family datasheet and NXP USB application notes for internal reference clock trimming and USB compliance settings; do not assume default reset clock configuration is USB-compliant. Also budget the 8 KB SRAM carefully: the USB stack, endpoint buffers, and application stack share it, and overflow silently corrupts data. Reserve flash space for a bootloader if field updates over USB are planned, since 64 KB fills quickly with USB middleware plus application code.
The HVQFN-32 exposed pad on the package bottom is the primary ground connection and must be soldered to a solid ground plane via an array of small vias for reliable grounding and thermal performance. Place 0.1 uF ceramic decoupling capacitors at each VDD pin within 2 mm of the package, plus one bulk 4.7-10 uF capacitor near the supply entry. Keep the USB D+/D- differential pair 90 ohm matched-length routed away from switching signals; confirm USB routing guidance in NXP reference designs for the Freedom KL25Z/KL26Z development boards.
The MKL26Z64VFM4 accepts 1.8 V, 2.5 V, or 3.3 V supplies. When powering from a switching regulator, add an RC filter or ferrite bead to VDD to keep supply ripple out of ADC measurements. For battery designs, exploit the Kinetis L low-power modes: gate unused peripheral clocks and use wake-on-pin/RTC so average current is dominated by sleep current rather than the 48 MHz active current. Verify exact sleep-mode currents in the datasheet data sheet tables for your selected voltage and temperature before writing power budgets, since figures vary with mode and clock configuration.
Informações de conformidade
NXP product page lists the part as Active with Environmental Quality data supporting RoHS compliance. REACH, halogen-free, and conflict-minerals declarations should be obtained from official NXP environmental certificates.
