MPC5554MZP132 - 132MHz 2MB Flash Automotive MCU | NXP
N.º da peça: MPC5554MZP132 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $92.3818 | $92,38 |
| 10 | $92.3818 | $923,82 |
| 100 | $92.3818 | $9.238,18 |
| 500 | $92.3818 | $46.190,90 |
| 1.000 | $92.3818 | $92.381,80 |
MPC5554MZP132 Visão geral
A microcontroller is a programmable system-on-chip that executes firmware, reads sensors, controls actuators, and coordinates communication between electronic subsystems. The MPC5554 belongs to the MPC55xx Qorivva family and combines a Book E-compliant Power Architecture processor, flash memory, interfaces, and timing resources in one package. This integration reduces external component count and supports responsive closed-loop control in demanding automotive electronics.
The verified product information identifies a 132 MHz operating frequency, 2 MB flash organized as 2M x 8 bits, a 416-pin PBGA package, and a -40 to +125 °C operating-temperature range. The part is identified by NXP as automotive grade and positioned for engine-management applications. Its real-time processing capability is valuable when powertrain software must combine sensor acquisition, control algorithms, diagnostics, and communications within predictable timing constraints.
The e200z6 core provides the computational foundation for advanced vehicle control systems, while the large embedded flash configuration supports control software, calibration data, and diagnostics on-chip. Compared with smaller general-purpose controllers, this device offers substantially more integration for complex automotive control. The package is large, however, so PCB routing, via density, assembly capability, thermal management, and long-term sourcing require careful planning.
Typical uses include engine control units, powertrain controllers, transmission-related electronics, vehicle dynamics systems, and other safety-relevant automotive platforms. For these applications, firmware execution timing, communication peripherals, external memory behavior, electrical limits, and temperature performance must be validated against the manufacturer datasheet and the complete ECU requirements. The verified sources do not provide every peripheral, voltage, pin-function, or timing specification needed for a complete design review.
The principal design consideration is that a 416-pin PBGA requires a fine-pitch, high-density board layout and a package capable of handling substantial pin and thermal requirements. Pin assignment, power rails, decoupling, external interfaces, and programming should be implemented from the official documentation rather than inferred from a distributor summary. The NXP product page is the appropriate starting point for lifecycle notices, replacement information, and development support.
This page consolidates the verified distributor and manufacturer information, separates confirmed specifications from missing technical data, and explains why the MPC5554MZP132 is used in automotive real-time control. It also records the absence of verified drop-in alternatives rather than presenting unverified substitutes as production replacements.
Alternativas drop-in para MPC5554MZP132 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MPC5554MZP132 (mesmo formato e footprint) — diferindo em Package, Core Architecture, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MPC5554MZP132R2
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC5554MVR132
✅ Drop-In✓ Em estoque
$27.25 / unidade
Ver ficha técnica →MPC5553MZP132R2
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
TC1793F512F270EFABKX
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC5554MZP80
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC5554MZP132 Classificações máximas e características elétricas
| Product Type | 32-bit automotive microcontroller |
| Processor Core | e200z6 Power Architecture core |
| Operating Frequency | 132 MHz |
| Flash Memory | 2 MB (2M x 8) |
| Architecture | Book E-compliant Power Architecture |
| Encapsulamento | 416-pin plastic PBGA |
| Package Dimensions | 27 x 27 mm |
| Package Pitch | 1 mm |
| Package Material | Lead-free plastic |
| Package Outline | MS-034AAL-1 |
| Temperatura de operação | -40 °C to +125 °C |
| Automotive Grade | Automotive grade |
| Primary Application | Engine management and powertrain control |
| Instruction Set | 32-bit |
| Flash Organization | 2M x 8 bits |
| Tipo de montagem | Surface mount |
| Status do ciclo de vida | NRND |
Guia de Configuração de Pinos do MPC5554MZP132 ms-034aal-1
Configuração de pinos para MPC5554MZP132 (pacote ms-034aal-1). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MPC5554MZP132.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MPC5554MZP132 é adequado para 6 aplicaçãos: Engine Management Systems, Powertrain Control, Vehicle Dynamics Control, Transmission Control Units, Automotive Body and Chassis Electronics, Industrial and Transportation Control.
Engine Management Systems
The MPC5554MZP132 fits engine-management controllers because its e200z6 32-bit core operates at 132 MHz and its 2 MB embedded flash supports control software, calibration data, and diagnostics on-chip. The device is specifically identified by NXP for complex, real-time engine-management systems. Its verified -40 °C to +125 °C range supports harsh automotive environments, while the 416-pin PBGA exposes the interfaces required by a sophisticated ECU. Design work must still validate timing, peripheral configuration, electrical limits, and thermal behavior against the manufacturer datasheet rather than relying on general MCU assumptions.
Recomendado
Powertrain Control
The MPC5554MZP132 is appropriate for powertrain control platforms that require deterministic real-time computation and substantial integrated flash. Its 132 MHz e200z6 processor can execute acquisition, control, and diagnostic tasks in one automotive MCU, reducing the need for separate logic devices. The 2 MB flash configuration provides room for application firmware and calibration data, but memory maps, boot requirements, and peripheral timing must be confirmed from the official datasheet. The large PBGA package also demands advanced PCB assembly and thermal validation.
Recomendado
Vehicle Dynamics Control
The MPC5554MZP132 can serve as the central controller in vehicle-dynamics and chassis-related electronics where sensor processing, actuator commands, diagnostics, and communications must be coordinated. Its 32-bit Power Architecture core and 132 MHz frequency provide a suitable real-time processing platform, while 2 MB embedded flash supports application code and calibration storage. The verified data does not enumerate every communication or safety peripheral, so engineers must confirm the required interfaces and any safety qualification from the NXP documentation before selecting it for a new safety-related design.
Recomendado
Transmission Control Units
The MPC5554MZP132 is suitable for transmission electronic control units requiring fast deterministic processing, embedded firmware storage, and operation across a wide temperature range. Its 132 MHz e200z6 core can coordinate gear-state inputs, actuator outputs, diagnostics, and vehicle-network tasks, while the 2 MB flash supports embedded control logic. Compatibility depends on the specific transmission control strategy, pin multiplexing, memory requirements, and external circuitry. The 416-pin PBGA footprint makes board-layout and assembly planning more demanding than for a small-lead-count MCU.
Recomendado
Automotive Body and Chassis Electronics
The MPC5554MZP132 can be evaluated for body and chassis electronics that need a high-performance 32-bit control platform, local flash storage, and real-time input/output handling. Its 132 MHz processing capability and 2 MB embedded flash provide resources beyond basic body modules, while the -40 °C to +125 °C specification supports harsh installation environments. However, the verified material does not provide a complete peripheral list or safety classification, so suitability for brake, steering, restraint, or other safety-critical functions requires formal NXP documentation review and system-level qualification.
Recomendado
Industrial and Transportation Control
The MPC5554MZP132 may be useful in transportation or industrial control equipment requiring deterministic 32-bit processing and broad temperature tolerance. Its 132 MHz core and 2 MB embedded flash provide enough resources for sophisticated sequencing, monitoring, diagnostics, and control software. The part is nevertheless automotive-oriented, so non-vehicle use should begin with a complete review of electrical limits, environmental requirements, software startup behavior, and supply status. Its 416-pin PBGA requires a manufacturing process capable of fine-pitch assembly and adequate inspection.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MPC5554MZP132 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MPC5554MZP132R2 | MPC5554MVR132 | MPC5553MZP132R2 | TC1793F512F270EFABKX | MPC5554MZP80 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | Infineon Technologies | NXP Semiconductors |
Principais diferenciais
- High-frequency Power Architecture control platform (vs MPC5554MZP80)
- Automotive-oriented system positioning (vs TC1793F512F270EFABKX)
- Substantial embedded program storage (vs MPC5554MVR132)
- Established verified package identity (vs MPC5553MZP132R2)
Notas de projeto
The verified package is a 416-pin, 1 mm-pitch PBGA measuring 27 x 27 mm. Use the manufacturer land pattern and assembly process documentation for escape routing, via structure, solder-mask definition, and paste volume. Do not substitute a generic BGA footprint. Because the verified material does not provide the complete pin table, validate all 416 connections against the official datasheet before releasing the PCB.
Place power connections and decoupling according to the manufacturer reference design and datasheet requirements. The verified sources do not provide the complete supply-voltage limits, current ratings, pin names, or decoupling values, so no capacitor value or regulator selection should be inferred. Verify every power rail, ground reference, sequencing requirement, and startup condition before schematic release.
A 416-pin PBGA can create substantial thermal and electrical complexity even when the application is not thermally dense. Estimate junction temperature only after obtaining the correct package thermal model and actual power data from the manufacturer documentation. Route heat through the PCB design, maintain adequate exposed copper where specified, and validate the ECU in its enclosure and operating environment.
Do not treat MPC5554MZP132R2, MPC5554MVR132, MPC5553MZP132R2, or TC1793F512F270EFABKX as approved drop-in replacements based on search results alone. Confirm package drawings, pin names, electrical limits, memory architecture, clocking, peripherals, qualification, software startup, and lifecycle notices. A same-package name does not establish pin-to-pin or software compatibility.
Preserve signal-integrity margins on every external interface and keep sensitive routing away from noisy switching nodes and aggressive return-current paths. The supplied data does not identify interface types or recommended terminations, so use the manufacturer reference design and board stack-up guidance. Review the complete pin multiplexing matrix because automotive MCUs commonly combine multiple functions on configurable pins.
Informações de conformidade
The verified package listing describes the device as lead-free plastic and automotive grade. No explicit RoHS, REACH, AEC-Q100, halogen-free, or conflict-minerals statement is provided, so those fields remain unknown.
