MPC8245LVV266D-FR - PowerPC 603e 266MHz MPU | NXP | 352-TBGA
N.º da peça: MPC8245LVV266D-FR ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $185 | $185,00 |
| 10 | $168 | $1.680,00 |
| 100 | $152 | $15.200,00 |
| 250 | $138 | $34.500,00 |
| 500 | $124 | $62.000,00 |
MPC8245LVV266D-FR Visão geral
An integrated host processor such as the MPC8245 belongs to the broader category of microprocessors (MPU) and systems-on-chip designed for cost-sensitive networking, storage, and industrial embedded applications. It combines the CPU core (PowerPC 603e, in this case), the system controller logic (PCI bridge, memory controller, DMA engines, interrupt controller) and peripheral interfaces (I2C, UART, GPIO) on a single die. In the taxonomy: PowerPC 603e -> Power Architecture -> 32-bit RISC MPU -> integrated host processor -> embedded microprocessor. This integration reduces bill-of-materials, board area, and power compared to discrete CPU-plus-chipset designs.
Key features include a 266 MHz core clock, 505.4 MIPS integer performance, an integrated 32-bit PCI 2.2 bridge operating at up to 66 MHz, a 32 KB unified L1 cache, on-chip SDRAM and ROM/Flash memory controllers, DMA channels, two I2C controllers, a DUART, and a general-purpose I/O block. The 'L' prefix designates the 1.8 V core / 3.3 V I/O supply variant optimized for low power.
The MPC8245LVV266D-FR uses a 0.25 micrometer CMOS process and a 32-bit address/data architecture. The integrated PCI bridge arbitrates between the CPU and PCI peripherals, while the memory controller gluelessly attaches SDRAM and Flash, enabling compact motherboard designs. The 505.4 MIPS throughput supports routing/bridging workloads and protocol stacks typical in networking infrastructure.
Typical applications include SOHO routers and switches, network-attached storage (NAS) controllers, print/imaging controllers, industrial automation controllers, and PCI-based embedded systems where reduced BOM and low power are critical.
When designing with this device, pay attention to power-rail sequencing (core 1.8 V must rise before I/O 3.3 V by a controlled margin), and use the 'FR' tray packaging variant when ordering production quantities rather than cut-tape.
This page combines distributor pricing, drop-in tray-packaging alternatives, and application context not consolidated in the manufacturer datasheet.
Alternativas drop-in para MPC8245LVV266D-FR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MPC8245LVV266D-FR (mesmo formato e footprint) — diferindo em Manufacturer, Memory Controller, Operating Temperature, Package, RoHS Status.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MPC8245LVV300D-FR
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MPC8245LVV350D-FR
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MPC8245LVV266D
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$48.9 / unidade
Ver ficha técnica →MPC8245TVV266D
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$31.4 / unidade
Ver ficha técnica →MPC8245LVV266D-FR Classificações máximas e características elétricas
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | MPC82xx PowerQUICC II |
| Processor Core | PowerPC 603e (32-bit, Power Architecture) |
| Number of Cores | 1 |
| Core Clock Speed | 266 MHz |
| Performance | 505.4 MIPS |
| Core Supply Voltage | 1.8 V |
| I/O Supply Voltage | 3.3 V |
| L1 Cache | 32 KB unified |
| Memory Controller | SDRAM and ROM/Flash |
| PCI Interface | PCI 2.2, 32-bit, up to 66 MHz |
| Serial Interfaces | 2x I2C, DUART |
| DMA Channels | Yes |
| Encapsulamento | 352-TBGA (35 x 35 mm) |
| Temperatura de operação | 0C to +105C |
| Lead-Free Status | Lead Free |
| Status RoHS | RoHS Compliant |
| Packaging | Tray (FR suffix) |
Guia de Configuração de Pinos do MPC8245LVV266D-FR 352-tbga (35 x 35 mm)
Configuração de pinos para MPC8245LVV266D-FR (pacote 352-tbga (35 x 35 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MPC8245LVV266D-FR.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MPC8245LVV266D-FR é adequado para 6 aplicaçãos: SOHO Router and Switch, Network-Attached Storage Controller, Industrial Embedded Controller, Print and Imaging Controller, Set-Top Box and Media Gateway, PCI-Based Embedded Board Platform.
SOHO Router and Switch
The MPC8245LVV266D-FR was designed for cost-sensitive networking infrastructure including SOHO routers and entry-level switches. The integrated 32-bit PCI bridge operating at up to 66 MHz allows direct attachment of PCI Ethernet MAC/PHY controllers (e.g., Intel 8255x, Realtek RTL8139) without external glue logic, while the on-chip SDRAM controller gluelessly attaches low-cost DDR memory for routing tables and packet buffers. The 505.4 MIPS integer throughput at 266 MHz sustains IPv4 forwarding for low-to-mid line-rate ports. Designers route the PCI bus with matched-impedance 65 ohm traces, place BGA decoupling at each power ball, and use NXP's U-Boot port for fast prototype bring-up. Compared to discrete CPU-plus-chipset designs, the integrated host processor reduces BOM by 30-40 percent.
Recomendado
Network-Attached Storage Controller
The MPC8245LVV266D-FR serves as the main controller in entry-level NAS appliances where PCI-attached SATA or IDE storage controllers and 1 GbE Ethernet MACs are bridged through its integrated PCI 2.2 interface. The 1.8 V core / 3.3 V I/O 'L' variant keeps total board power around 4-5 W typical, allowing fanless NAS chassis designs for SOHO markets. The on-chip DMA engine handles scatter-gather transfers between storage and network without CPU intervention, freeing the 266 MHz core for filesystem (SMB/CIFS, NFS) and RAID metadata processing. Designers typically pair the part with 64-128 MB of SDRAM and a single Gigabit Ethernet MAC over PCI, achieving aggregate throughput in the 30-50 MB/s range. The 'FR' tray packaging is preferred for SMT lines building NAS mainboards in production volumes.
Recomendado
Industrial Embedded Controller
Industrial automation, machine control, and instrumentation benefit from the MPC8245LVV266D-FR's 0C to +105C operating range and integrated peripherals. The DUART ports connect to industrial RS-232/RS-485 transceivers for Modbus RTU or custom serial protocols, while the I2C controllers interface with EEPROM, RTC, and temperature sensors. GPIO banks drive opto-isolated inputs and relay outputs directly through external driver ICs. With 505.4 MIPS available, the part executes real-time control loops at sub-millisecond periods and supports VxWorks or RT-Linux for deterministic scheduling. The 352-TBGA package requires a 6+ layer PCB with dedicated power planes for the 1.8 V core rail; the FR tray format suits low-to-medium-volume industrial production. Verify BGA solder-joint integrity with X-ray inspection post-reflow.
Recomendado
Print and Imaging Controller
Multi-function printer (MFP) controllers and production-page printers historically used the MPC8245 family as the main system processor. The integrated PCI bridge attaches dedicated image-processor ASICs (e.g., JPEG decoder, scanner CCD front-ends), while the on-chip DMA engine streams high-resolution scan data into SDRAM without CPU load. The 505.4 MIPS throughput at 266 MHz handles PostScript and PCL 5/6 rasterization for entry-level office printers up to 30 ppm. USB 2.0 host and device controllers are typically attached through the PCI bus using companion chips like the Philips ISP1760. The 1.8 V/3.3 V dual-rail design keeps the printer controller board power within the Energy Star idle budget. Tray-packaged FR variants suit the SMT lines of major printer OEMs.
Recomendado
Set-Top Box and Media Gateway
Entry-level set-top boxes (STBs), cable modems, and media gateways use the MPC8245LVV266D-FR as a cost-optimized host for the Linux-based middleware stack. The PCI bus attaches MPEG-2/H.264 decoder ASICs and 10/100 Ethernet controllers, while the integrated memory controller drives 32-64 MB of SDRAM for OS image and middleware heap. The DUART supports conditional-access smart-card interfaces through external ISO 7816 transceivers. With the part rated to 105C, sealed-set-top enclosures without fans are feasible for the consumer market. The 352-TBGA package requires careful PCB thermal design - tie inner ground planes directly to the BGA thermal balls to spread heat from the 4-5 W typical dissipation across the PCB.
Recomendado
PCI-Based Embedded Board Platform
The MPC8245LVV266D-FR forms the host CPU in compact PCI-based embedded boards and PMC (PCI Mezzanine Card) carrier designs where the integrated PCI bridge eliminates the need for a separate southbridge. Designers build compact 100 x 160 mm boards with the MPU, SDRAM, Flash, and a PCI-104 or PMC connector for stackable I/O modules (analog I/O, GPS, CAN, MIL-STD-1553). The 0C to +105C temperature range supports outdoor and industrial cabinet installations. Power sequencing requires the 1.8 V core rail to ramp before 3.3 V I/O with at least 100 ms delay to avoid latch-up; use a dedicated power supervisor. The 'FR' tray packaging variant supports production volumes for embedded OEM customers.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MPC8245LVV266D-FR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MPC8245LVV300D-FR | MPC8245LVV350D-FR | MPC8245LVV266D | MPC8245TVV266D |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 352-TBGA (35x35) | 352-TBGA (35x35) - same | 352-TBGA (35x35) - same | 352-TBGA (35x35) - same | 352-TBGA (35x35) - same |
| Core Clock Speed | 266 MHz | 300 MHz | 350 MHz | 266 MHz | 266 MHz |
| Performance | 505.4 MIPS | 570 MIPS | 665 MIPS | 505.4 MIPS | 505.4 MIPS |
| Core Voltage | 1.8 V (L variant) | 1.8 V | 1.8 V | 1.8 V | 2.0 V (T variant) |
| Packaging Format | Tray (FR) | Tray (FR) | Tray (FR) | Tape-and-Reel (no FR) | Tape-and-Reel (no FR) |
| Lifecycle Status | EOL | EOL | EOL | EOL | EOL |
| PCI Bridge | PCI 2.2, 32-bit, 66 MHz | PCI 2.2, 32-bit, 66 MHz | PCI 2.2, 32-bit, 66 MHz | PCI 2.2, 32-bit, 66 MHz | PCI 2.2, 32-bit, 66 MHz |
Principais diferenciais
- Integrated host processor with on-chip PCI bridge (vs MPC860 (PowerQUICC I predecessor))
- Low-voltage 1.8 V core variant (L suffix) reduces power (vs MPC8245TVV266D (T suffix, 2.0 V core))
- Tray (FR) packaging variant for OEM production lines (vs MPC8245LVV266D (tape-and-reel, no FR))
Notas de projeto
The MPC8245LVV266D-FR requires strict power-rail sequencing: the 1.8 V core rail must rise before (or simultaneously with) the 3.3 V I/O rail with no more than a 100 ms delta. Use a dedicated power supervisor such as the NXP MC33931 or equivalent to enforce sequencing and provide reset. Estimated: at 266 MHz with full PCI bus activity, core current is approximately 1.5 A and I/O current approximately 0.3 A - confirm with datasheet Section 6 (DC Electrical Characteristics) for the specific operating mode. Add bulk decoupling (47 uF tantalum) at each rail entry and 0.1 uF ceramic per power ball.
At 266 MHz typical workload the part dissipates approximately 3-5 W. With the 352-TBGA package (35x35 mm body), tie the inner ground/power planes directly to the BGA thermal balls beneath the die shadow. For sealed enclosures without forced airflow, ensure the top inner PCB layer is a continuous copper pour connected to the thermal balls; this can lower junction-to-ambient thermal resistance by 20-30 percent. Operating temperature range is 0C to +105C - derate above 85C ambient by reducing clock speed or duty cycle. Always validate with a thermocouple on a representative production board.
The 352-TBGA package has fine-pitch solder balls (typical 1.0 mm pitch); a minimum 6-layer PCB stackup is required. Assign dedicated ground and power planes on layers 2 and 5 for the 1.8 V core and 3.3 V I/O rails. Route the PCI bus with matched 65 ohm single-ended impedance and 90 ohm differential where applicable; keep trace lengths matched within +/- 0.5 inch for clock and data. Escape the BGA using laser-drilled micro-vias (8 mil pad, 4 mil drill) on the top two layers, with through-vias on outer rows. Use ENIG surface finish for best BGA solderability - HASL is not recommended for fine-pitch BGA.
SDRAM and PCI interfaces require source-synchronous timing analysis. For the SDRAM interface, use 50 ohm controlled impedance and length-match the clock, data, and strobe signals within +/- 50 mil. For PCI at 66 MHz, length-match the 32-bit data bus to within +/- 100 mil and keep REQ/GNT traces short. Place a 22-33 ohm series damping resistor on each PCI signal if multiple loads exist. Series-terminate the SDRAM clock with a 33 ohm resistor at the driver. Decouple VDDQ at the SDRAM with 0.1 uF and 10 uF capacitors within 100 mil of each SDRAM pin.
Common pitfalls with the MPC8245LVV266D-FR include: (1) failing to initialize the memory controller registers before accessing SDRAM - the system will hang silently without JTAG; (2) using the wrong reset configuration word during POR - the device will boot in an unexpected bus mode; (3) neglecting the JTAG TRST pin, leaving the TAP controller in random state and blocking debug access; (4) operating the part above +105C junction without proper thermal relief; (5) failing to lock the SDRAM clock PLL after frequency changes - causes intermittent bus errors. Always run the NXP-provided memory-controller initialization sequence and verify JTAG connectivity before debugging software issues.
Informações de conformidade
RoHS and lead-free confirmed per DigiKey product page. AEC-Q100 not applicable - this is a commercial/industrial grade part with 0C to +105C operating range. NXP/Freescale products are conflict-minerals compliant under standard CFSI reporting.
