MPC8248VRMIBA - PowerQUICC II 266MHz 32-Bit MPU | NXP
N.º da peça: MPC8248VRMIBA ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $78.5 | $78,50 |
| 10 | $72.1 | $721,00 |
| 100 | $64.85 | $6.485,00 |
| 500 | $56.2 | $28.100,00 |
| 1.000 | $49.95 | $49.950,00 |
MPC8248VRMIBA Visão geral
A microprocessor (MPU) is a single-chip CPU optimized for embedded control and data-plane tasks, distinct from a microcontroller (MCU) by typically lacking on-chip flash and offering higher external memory throughput. The MPC82xx PowerQUICC II family sits in the taxonomy: PowerPC core -> embedded MPU -> communications processor -> networking SoC. It targets routers, DSLAM line cards, RAID controllers, and industrial control where deterministic serial-protocol handling matters more than raw application-processor performance.
Key features include a 32-bit Power Architecture core with separate 16 KB instruction and data caches, dual 10/100/1000 Mbps Ethernet MAC support via the CPM, two USB 1.1 hosts (some derivatives), a 64-bit PCI interface, integrated SEC 2.0 crypto acceleration, and DRAM/SDRAM controller supporting up to 1 GB of addressable memory. The CPM offloads RISC-based serial protocols (HDLC, UART, SPI, I2C, ATM) from the main core, which is the architectural advantage of the PowerQUICC line versus a generic PowerPC.
Typical applications include SMB routers, residential gateways, frame-relay and ATM access multiplexers, RAID storage controllers, and industrial serial-protocol bridges. The 0 to 105 °C operating range suits both environmentally controlled enclosures and outdoor telecom cabinets. Where higher throughput is needed, NXP positions the PowerQUICC III MPC8560 family as the upward migration path; the lower-cost MPC8247 is the trimmed sibling for less demanding designs.
When designing with this part, allocate sufficient PCB area for the 27x27 mm BGA with full ball array fanout; ensure 4-layer or better stack-up to maintain SI on the 64-bit PCI and DDR memory buses. Confirm replacement options against current NXP product-change notices before committing to new production.
Alternativas drop-in para MPC8248VRMIBA — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MPC8248VRMIBA (mesmo formato e footprint) — diferindo em Process Technology, PCI Interface, Core Architecture, Operating Temperature, Package.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MPC8248VRTIEA
✅ Drop-In✓ Em estoque
$62.5 / unidade
Ver ficha técnica →MPC8272VRMIBA
✅ Drop-In✓ Em estoque
$52.95 / unidade
Ver ficha técnica →MPC8247CVRMIBA
✅ Drop-In✓ Em estoque
$19.95 / unidade
Ver ficha técnica →MPC8247CZQMIBA
✅ Drop-In✓ Em estoque
$21.45 / unidade
Ver ficha técnica →MPC8271VRMIBA
✅ Drop-In✓ Em estoque
$53.4 / unidade
Ver ficha técnica →MPC8248VRMIBA Classificações máximas e características elétricas
| Core Architecture | PowerPC G2_LE (32-bit) |
| Core Frequency | 266 MHz |
| Performance | 505.4 MIPS |
| Series | MPC82xx PowerQUICC II |
| Number of Cores | 1 |
| Co-Processors | CPM (Communications), SEC (Security) |
| Process Technology | 0.13 µm HiP7 |
| Core Supply Voltage | 1.5 V |
| I/O Supply Voltage | 3.3 V |
| Encapsulamento | 516-ball TEPBGA (27x27 mm) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | 0 °C to +105 °C |
| Memory Controller | DRAM, SDRAM |
| PCI Interface | 64-bit PCI |
| Ethernet Support | Dual 10/100/1000 Mbps MAC (via CPM) |
| USB Support | USB 1.1 host |
| Status RoHS | RoHS Compliant (Lead-Free) |
Guia de Configuração de Pinos do MPC8248VRMIBA 516-ball tepbga (27x27 mm)
Configuração de pinos para MPC8248VRMIBA (pacote 516-ball tepbga (27x27 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MPC8248VRMIBA.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MPC8248VRMIBA é adequado para 6 aplicaçãos: SMB / SOHO Networking Router, DSLAM Line-Card Controller, RAID / Storage Controller, Industrial Serial-Protocol Bridge, Wireless Base-Station Controller, Automotive Telematics Gateway (Legacy).
SMB / SOHO Networking Router
The MPC8248VRMIBA fits SMB router designs where 266 MHz PowerPC throughput drives NAT, routing, and firewall state tables while the integrated CPM handles Ethernet MAC, PPPoE, and HDLC WAN offload. Its dual 10/100/1000 MAC support lets engineers route two ISP links without an external switch, and the 64-bit PCI bus connects to crypto accelerators or DSL/ADSL PHY cards. Compared with an ARM-based router SoC, the PowerQUICC II still wins on deterministic serial-protocol latency for legacy leased-line and frame-relay deployments.
Recomendado
DSLAM Line-Card Controller
The MPC8248VRMIBA suits DSLAM line-card aggregation where it serves as the uplink controller terminating ATM and HDLC traffic from many subscriber ports. The CPM RISC engine offloads cell segmentation/reassembly so the main PowerPC core handles routing and QoS queues without bottlenecking. At 266 MHz and 505 MIPS, it can sustain multiple E1/T1 aggregates plus Fast Ethernet uplinks. The 0–105 °C range matches outdoor cabinet thermal envelopes without active cooling.
Recomendado
RAID / Storage Controller
The MPC8248VRMIBA works as a RAID controller host CPU where its PCI-X/PCI 64-bit interface drives SATA or Fibre Channel I/O controllers while the PowerPC core runs RAID parity, scrubbing, and rebuild algorithms. The SEC 2.0 block accelerates AES for encrypted volumes with negligible host overhead, and SDRAM controller supports large cache DIMMs for write-back buffers. Engineers value the deterministic interrupt response compared with general-purpose x86 controller boards.
Recomendado
Industrial Serial-Protocol Bridge
The MPC8248VRMIBA bridges legacy industrial protocols (Modbus, PROFIBUS, CAN, RS-485 multi-drop) to Ethernet in factory-automation gateways. The CPM handles multiple HDLC/UART channels concurrently, while the PowerPC core runs the TCP/IP stack and web HMI server. Robust 0–105 °C operation tolerates cabinet proximity to motors and heaters. The integrated SEC engine secures factory telemetry without burdening the main CPU.
Recomendado
Wireless Base-Station Controller
The MPC8248VRMIBA operates as a base-station controller for small-cell 2G/3G systems where timing-critical baseband signaling, Abis/IP transport, and O&M converge. The CPM drives TDM/E1 links to the BTS while the PowerPC core handles IPsec tunnels via the SEC block. 505 MIPS at 266 MHz is sufficient for pico-cell user-plane processing up to ~50 simultaneous calls. The PCI bus accepts WDM framer companion chips without external glue logic.
Recomendado
Automotive Telematics Gateway (Legacy)
In legacy telematics control units, the MPC8248VRMIBA aggregates CAN/LIN bus traffic and bridges to cellular 3G modems. The 0–105 °C temperature range covers automotive cabin and under-hood-adjacent enclosures. The SEC engine secures OTA firmware updates and V2X payloads. Note: for new automotive designs, NXP recommends i.MX8 or S32K families — the MPC8248VRMIBA remains in use only in long-lifecycle service parts.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MPC8248VRMIBA — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MPC8248VRTIEA | MPC8272VRMIBA | MPC8247CVRMIBA | MPC8247CZQMIBA | MPC8271VRMIBA |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 516-Pin TEPBGA (27x27) | 516-Pin TEPBGA (27x27) - same | 516-Pin TEPBGA (27x27) - same | 516-Pin TEPBGA (27x27) - same | 516-Pin TEPBGA (27x27) - same | 516-Pin TEPBGA (27x27) - same |
| Core Architecture | PowerPC G2_LE | PowerPC G2_LE | PowerPC G2_LE | PowerPC G2_LE | PowerPC G2_LE | PowerPC G2_LE |
| Co-Processors | CPM, SEC | CPM, SEC | CPM, SEC | CPM (reduced) | CPM (reduced) | CPM, SEC (dual) |
| Operating Temperature | 0 to +105 °C | -40 to +85 °C | 0 to +105 °C | 0 to +105 °C | 0 to +105 °C | 0 to +105 °C |
| Process Technology | 0.13 µm HiP7 | 0.13 µm HiP7 | 0.13 µm HiP7 | 0.13 µm HiP7 | 0.13 µm HiP7 | 0.13 µm HiP7 |
| Lifecycle Status | Last Time Buy (EOL) | Last Time Buy (EOL) | Last Time Buy (EOL) | Last Time Buy (EOL) | Last Time Buy (EOL) | Last Time Buy (EOL) |
Principais diferenciais
- Integrated SEC 2.0 crypto accelerator on-die (vs MPC8247CVRMIBA)
- Full dual-Gigabit Ethernet MAC support via CPM (vs MPC8272VRMIBA)
- Higher-integration sibling available in same footprint (vs MPC8247CVRMIBA)
Notas de projeto
The 516-ball TEPBGA at 27x27 mm relies on the PCB copper pour and internal ground planes to dissipate the 2.0–2.5 W core power. Estimated: at θJA ~15 °C/W on a 4-layer JEDEC board, full-load junction temperature rise is ~37 °C above ambient. For sealed enclosures, add thermal vias under the BGA and verify with a thermal probe before locking the enclosure design.
Route the 64-bit PCI bus with controlled-impedance traces (90 Ω differential for PCI-X, 100 Ω for USB) and matched lengths to within ±8 mils. The SDRAM address/command bus must be length-matched to ±25 mils and isolated from switching I/O. Use 4 or more PCB layers with dedicated ground planes — 2-layer boards will fail SI compliance on PCI at 66 MHz. Decouple each VCC/VSS pair with 0.1 µF X7R plus a 10 µF tantalum bulk capacitor.
Do NOT mistake the PowerQUICC II for a drop-in upgrade of older MPC860 designs — bus protocols and boot-ROM interfaces differ. Verify that your JTAG/COP debug pod supports the OnCE interface of the G2_LE core. Last-time-buy constraints mean any prototype mismatch must be caught during initial bring-up — there is no second fab run available. Order evaluation samples at least 9 months before production to absorb engineering changes.
Informações de conformidade
RoHS compliant and lead-free per NXP product documentation. Halogen-free organic substrate. AEC-Q100 not applicable — for automotive, NXP recommends i.MX or S32K families.
