MPC8271VRTIEA - 400MHz PowerQUICC II MPU, 516-PBGA | NXP
N.º da peça: MPC8271VRTIEA ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $89.5 | $89,50 |
| 10 | $81.2 | $812,00 |
| 100 | $72.85 | $7.285,00 |
| 250 | $67.4 | $16.850,00 |
| 500 | $62.1 | $31.050,00 |
MPC8271VRTIEA Visão geral
A PowerQUICC II processor is a system-on-chip built around the PowerPC architecture, combining general-purpose computation with hardware-accelerated protocol processing. The MPC82xx family sits within the broader hierarchy of embedded microprocessors, communications processors, and SoCs from Power Semiconductors / NXP's networking portfolio, designed for wired/wireless infrastructure, industrial control, and storage routers where deterministic throughput on multiple serial channels is mandatory. The integrated CPM offloads protocol stacks from the CPU core, preserving MIPS for application, control-plane, or routing tasks.
Key features include 16KB instruction and 16KB data L1 caches, a 32-bit PCI interface compliant with PCI 2.2, dual 10/100 Mbps Fast Ethernet controllers, an integrated USB 1.1 device/host controller, a UTOPIA Level-2 interface for ATM/ADSL framers, and multi-channel HDLC for T1/E1 WAN links. The Memory Controller supports DDR SDRAM, 60x bus expansion, and local bus peripherals, while the Security Engine accelerates IPSec, 3DES, AES, SHA-1, and MD5. Power management is provided through multiple clock domains and a 1.5V core / 3.3V I/O split.
Typical applications include DSLAM line cards, multi-service access routers, T1/E1 channel banks, industrial serial-protocol gateways, and storage RAID controllers. The 516-pin PBGA delivers both the high pin count and signal integrity required for simultaneous PCI, Ethernet, and serial interfaces, while the 27x27 mm footprint keeps board area modest for high-density line-card layouts.
When designing with this processor, ensure 4-layer PCB stack-up with continuous ground plane under the BGA to maintain signal integrity for DDR and PCI signals. Decoupling requires 0.1 µF ceramic capacitors within 5 mm of every power pin and bulk tantalum/polymer capacitors on each supply rail. The JTAG boundary-scan chain must remain accessible for production test.
This page synthesizes distributor pricing, drop-in alternatives from the same PowerQUICC II family, and practical design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para MPC8271VRTIEA — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MPC8271VRTIEA (mesmo formato e footprint) — diferindo em Manufacturer, Package, RoHS Status, Core Architecture, Maximum Clock Frequency.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MPC8271ZQMIBA
✅ Drop-In✓ Em estoque
$12.85 / unidade
Ver ficha técnica →MPC8271VRIEPA
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MPC8248ZQTIEA
✅ Drop-In✓ Em estoque
$52.3 / unidade
Ver ficha técnica →MPC8247ZQTIEA
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$58.9 / unidade
Ver ficha técnica →MPC8271VRTEPA
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MPC8271VRTIEA Classificações máximas e características elétricas
| Manufacturer | NXP Semiconductors |
| Processor Type | MPC82xx PowerQUICC II 32-bit |
| Core Architecture | PowerPC G2_LE |
| Number of Cores | 1 |
| Core Clock Speed | 400 MHz |
| Performance | 760 MIPS |
| Core Voltage | 1.5 V |
| I/O Voltage | 3.3 V |
| L1 Instruction Cache | 16 KB |
| L1 Data Cache | 16 KB |
| Encapsulamento / Caixa | 516-PBGA (27x27 mm) |
| Temperatura de operação | 0°C to +105°C |
| Integrated Interfaces | PCI, USB, Fast Ethernet, UTOPIA, HDLC |
| Memory Controller | DDR SDRAM, 60x bus, Local bus |
| Security Engine | IPSec, 3DES, AES, SHA-1, MD5 |
| Status RoHS | Compliant (Lead-Free) |
| Packaging | Tray |
| Technology | 0.13 µm HiP7 CMOS |
Guia de Configuração de Pinos do MPC8271VRTIEA 516-pbga (27x27 mm)
Configuração de pinos para MPC8271VRTIEA (pacote 516-pbga (27x27 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MPC8271VRTIEA.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MPC8271VRTIEA é adequado para 6 aplicaçãos: DSLAM Line Card, Multi-Service Access Router, T1/E1 Channel Bank, Industrial Serial Protocol Gateway, Storage RAID Controller, VoIP Media Gateway.
DSLAM Line Card
The MPC8271 VRTIEA's integrated UTOPIA Level-2 interface, dual 10/100 Ethernet MACs, and multi-channel HDLC controllers make it well suited for central-office DSLAM line cards aggregating subscriber lines into the access network. At 400 MHz the PowerPC G2_LE core delivers 760 MIPS, ample for forwarding-plane and per-line shaping tasks, while the CPM offloads ATM segmentation and reassembly. Pin-compatible drop-in variants allow OEMs to bin parts by port count without PCB rework.
Recomendado
Multi-Service Access Router
Multi-service routers that aggregate T1/E1, Frame Relay, ATM, and Ethernet services benefit from the MPC8271VRTIEA's combination of PCI 2.2, dual Ethernet, USB 1.1, and serial SCC channels. The CPM handles up to four HDLC channels for WAN links at line rate, freeing the 760 MIPS PowerPC core for routing table lookups and IPSec encryption through the integrated Security Engine. The 516-PBGA package provides the pin density required for all interfaces simultaneously.
Recomendado
T1/E1 Channel Bank
T1/E1 channel banks demultiplexing 24/32 DS0 channels require deterministic real-time serial handling. The MPC8271VRTIEA's multi-channel HDLC controllers, dual SCCs, and the on-chip TDM interface handle T1/E1 framing and per-channel processing without software overhead. The 0 to +105°C junction temperature range supports the thermally constrained central-office environment, while the 1.5V core / 3.3V I/O split keeps power dissipation manageable for fan-less line cards.
Recomendado
Industrial Serial Protocol Gateway
Industrial gateways translating Modbus, Profibus, DNP3, and similar serial protocols to IP networks benefit from the MPC8271VRTIEA's multiple SCC serial channels plus Fast Ethernet. At 400 MHz the PowerPC core runs protocol stacks and web servers with low latency, while the CPM offloads per-channel framing. The 0 to +105°C temperature range and 27x27 mm PBGA package suit sealed industrial enclosures where fans are not permitted. Pin-compatible same-family variants allow scaling CPU performance to gateway tier.
Recomendado
Storage RAID Controller
RAID controllers benefit from the MPC8271VRTIEA's PCI 2.2 host interface, dual 10/100 Ethernet for management/iSCSI, and the integrated Security Engine for IPSec acceleration of replication links. The 760 MIPS PowerPC core handles RAID5/6 parity calculation at SATA line rates through PCI-attached disk controllers. Same-package variants like the MPC8248ZQTIEA were specifically optimized for storage, offering stronger PCI bandwidth at the cost of fewer serial channels.
Recomendado
VoIP Media Gateway
VoIP media gateways translating between TDM voice trunks and IP packets benefit from the MPC8271VRTIEA's HDLC controllers for E1/T1 trunks, Fast Ethernet for IP-side traffic, and the integrated Security Engine for SRTP. The 760 MIPS PowerPC core runs RTP stack and DSP-like packetization, while the CPM handles trunk framing at DS0 granularity. The 516-PBGA footprint is shared with other MPC82xx family members, enabling PCB reuse across gateway tiers.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MPC8271VRTIEA — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MPC8271ZQMIBA | MPC8271VRIEPA | MPC8248ZQTIEA | MPC8247ZQTIEA |
|---|---|---|---|---|---|
| Package | 516-PBGA (27x27 mm) | 516-PBGA (27x27 mm) - same | 516-PBGA (27x27 mm) - same | 516-PBGA (27x27 mm) - same | 516-PBGA (27x27 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | PowerPC G2_LE | PowerPC G2_LE | PowerPC G2_LE | PowerPC G2_LE | PowerPC G2_LE |
| Core Frequency | 400 MHz | 266 MHz | 400 MHz | 400 MHz | 266 MHz |
| Performance | 760 MIPS | ~510 MIPS | 760 MIPS | ~760 MIPS | ~510 MIPS |
| CPM Focus | Comms (HDLC, UTOPIA, Ethernet) | Comms (same as VR variant) | Comms (same as VR variant) | Storage (stronger PCI, fewer serial) | Entry storage/comms hybrid |
| Operating Temperature | 0°C to +105°C | 0°C to +105°C | -40°C to +85°C (industrial) | 0°C to +105°C | 0°C to +105°C |
| Lifecycle Status | EOL | EOL | EOL | EOL | EOL |
| RoHS | Compliant | Compliant | Compliant | Compliant | Compliant |
Principais diferenciais
- 400 MHz / 760 MIPS for high-throughput comms routing (vs MPC8271ZQMIBA)
- Communications-optimized CPM with UTOPIA + HDLC (vs MPC8248ZQTIEA)
- Extended 0 to +105°C junction temperature (vs MPC8271VRIEPA)
Notas de projeto
The 516-pin PBGA at 27x27 mm requires a 4-layer minimum PCB stack-up (6-layer preferred) with a continuous ground plane directly beneath the BGA. All DDR traces must be length-matched within 25 mils and routed on inner layers between reference planes. Decoupling: place one 0.1 µF X7R ceramic within 5 mm of every power pin, plus bulk tantalum or polymer capacitors on each 1.5 V and 3.3 V rail at the BGA edges. Failure to maintain reference planes will result in severe DDR signal-integrity degradation.
Estimated: at 400 MHz, the MPC8271VRTIEA's core power dissipation is approximately 1.5-2.5 W depending on CPM utilization. With the 516-PBGA's typical theta-JA of roughly 18-22 °C/W on a 4-layer PCB, junction temperature rise above ambient is approximately 27-55 °C - within the 105 °C junction limit but with modest margin. For sealed enclosures without airflow, derate to 266 MHz (drop to MPC8271ZQMIBA) or reduce CPM channel count to maintain thermal headroom.
The MPC8271VRTIEA uses sequenced power rails: 3.3 V must come up before or simultaneously with 1.5 V core, and must remain valid while the core rail is on. Use NXP-recommended power sequencing supervisor or discrete RC delay to ensure proper ordering. Inrush current during core voltage ramp can spike to 2-3 A; bulk capacitors on the 1.5 V rail must be sized accordingly (220-680 µF polymer recommended). The DDR I/O rail may be 2.5 V depending on DRAM choice.
PCI 2.2 signals require source-series termination (22-33 Ω) at the MPC8271VRTIEUEnd when trace lengths exceed 1.5 inches. DDR SDRAM traces require D1-Dv/di matching and series-Rs on clock and strobe pairs. Ethernet MII/RMII signals must be length-matched to under 50 mm. The JTAG TCK should be series-terminated if the boundary-scan chain exceeds 4 inches total length.
Do not confuse the 516-PBGA (27x27 mm) with smaller PowerQUICC packages - footprint incompatibility will require PCB rework. Verify the silicon revision mark against the datasheet revision; earlier revisions may lack Security Engine or USB features. The 'V' temperature suffix is 0 to +105°C junction; confirm this meets your deployment ambient plus self-heating margin. For -40°C applications, use the 'I' industrial suffix variant (MPC8271VRIEPA) which is drop-in pin-compatible.
Informações de conformidade
RoHS compliant per DigiKey and DigChip product listings. Lead-free. AEC-Q100 not applicable - this is a communications processor, not an automotive-qualified IC. Halogen-free status not stated in available data.