MPC8275VRMIBA - PowerQUICC II 266MHz MPU | NXP | 516-PBGA
N.º da peça: MPC8275VRMIBA ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $131.34 | $131,34 |
| 10 | $118.2 | $1.182,00 |
| 100 | $105.07 | $10.507,00 |
| 500 | $95.5 | $47.750,00 |
| 1.000 | $87.8 | $87.800,00 |
MPC8275VRMIBA Visão geral
An MPU (Microprocessor Unit) is the central processing element of an embedded platform. Within the broader taxonomy, the MPC8275VRMIBA sits as: microprocessor -> embedded MPU -> communications processor -> PowerQUICC II SoC. PowerQUICC II parts target wired/wireless infrastructure where deterministic multi-protocol I/O and PCI connectivity are required on a single die.
Key features include an integrated system-on-chip (SoC) design combining the PowerPC core with the CPM co-processor, dual 10/100 Ethernet MACs, PCI interface, USB, HDLC/ATM/UTOPIA support, and a 64-bit data bus. The HiPerMOS7 0.13-micron process provides lower power draw than previous PowerQUICC generations, while maintaining the same 516-PBGA footprint shared with MPC8270/MPC8280 family members.
Architecturally, the MPC8275VRMIBA separates control-plane and data-plane tasks: the G2_LE core runs OS and management code, while the CPM handles serial protocol termination, DMA, and Fast Communications Channels. The 516-PBGA package (1 mm pitch) routes out the high pin count required for parallel peripheral buses, DDR memory controller, and dual Ethernet MII/RMII interfaces.
Typical applications include wired/wireless infrastructure routers, multi-channel HDLC/TDM bridges, industrial PCI controller cards, DSLAM line cards, and ATM/UTOPIA edge nodes. The combination of PCI host bridge and integrated Ethernet MACs makes it well suited as a head-end controller in customer premises equipment.
When designing with this device, thermal dissipation at 266 MHz must be evaluated against the PBGA's exposed-die thermal path. Boards should route all 516 balls to inner power/ground planes to maintain signal integrity on the parallel bus and to provide the decoupling capacitance required by the DDR SDRAM controller.
This page synthesizes distributor pricing, drop-in same-family alternatives, and design notes not typically consolidated on a single product page, giving engineers a practical decision view of the MPC8275VRMIBA.
Alternativas drop-in para MPC8275VRMIBA — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MPC8275VRMIBA (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Process Technology, Mounting Type, Core Architecture.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MPC8275ZQMIBA
✅ Drop-In✓ Em estoque
$195.5 / unidade
Ver ficha técnica →MPC8270ZQMIBA
✅ Drop-In✓ Em estoque
$54.25 / unidade
Ver ficha técnica →MPC8275CVRMIBA
✅ Drop-In✓ Em estoque
$140.2 / unidade
Ver ficha técnica →MPC8280VRMIBA
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC8275VRMIBA Classificações máximas e características elétricas
| Architecture | PowerPC G2_LE |
| Core Count | 1 |
| Largura do barramento de dados | 64-Bit |
| Clock Speed | 266 MHz |
| Performance | 505.4 MIPS |
| Tensão de alimentação | 1.5 V (core) |
| Package Type | 516-PBGA (27x27 mm, 1 mm pitch) |
| Contagem de pinos | 516 |
| Tipo de montagem | Surface Mount (BGA) |
| Temperatura de operação | 0C to +105C |
| Integrated Interfaces | PCI, USB, HDLC, Ethernet (10/100), UTOPIA |
| Process Technology | HiPerMOS7 0.13 micron |
| Status RoHS | Compliant (Lead Free) |
| Memory Controller | DDR SDRAM (per PowerQUICC II family) |
Guia de Configuração de Pinos do MPC8275VRMIBA 516-pbga (27x27 mm, 1 mm pitch)
Configuração de pinos para MPC8275VRMIBA (pacote 516-pbga (27x27 mm, 1 mm pitch)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MPC8275VRMIBA.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MPC8275VRMIBA é adequado para 6 aplicaçãos: Wired/Wireless Infrastructure Router, DSLAM Line Card / Multi-Channel TDM Bridge, Industrial PCI Controller Card, Customer Premises Equipment (CPE) Gateway, ATM/UTOPIA Edge Node, Wireless Base Station Controller.
Wired/Wireless Infrastructure Router
The MPC8275VRMIBA is a natural fit for edge and aggregation routers because its PowerPC G2_LE core (266 MHz, 505.4 MIPS) plus integrated dual 10/100 Ethernet MACs and PCI host bridge let one chip terminate multiple WAN links while running a routing stack. The CPM (Communications Processor Module) offloads HDLC, ATM, and UTOPIA processing from the host CPU so the G2_LE core is free for routing table lookups, QoS classification, and management plane code. Compared with a discrete CPU + external MAC solution, the MPC8275VRMIBA reduces board area and BOM count while supporting the multi-protocol fan-out typical of CPE and SMB router designs. Designers should provision adequate copper thermal relief because the 516-PBGA concentrates heat under the die.
Recomendado
DSLAM Line Card / Multi-Channel TDM Bridge
The MPC8275VRMIBA's multi-channel HDLC, TDM, and UTOPIA interfaces make it a strong DSLAM line card controller where one processor must aggregate dozens of DSL subscriber lines. The CPM terminates HDLC frames in hardware, freeing the PowerPC core for traffic shaping, ATM AAL2 segmentation, and per-subscriber QoS policy enforcement. At 505.4 MIPS the G2_LE core can run an embedded RTOS plus the DSL management agent. The 64-bit data bus and DDR controller support the high DMA bandwidth required by ATM cell transfers. Boards should keep all 516 BGA balls connected to inner ground/power planes to maintain signal integrity on the parallel peripheral bus.
Recomendado
Industrial PCI Controller Card
With its integrated PCI host/agent bridge, the MPC8275VRMIBA can serve as the host CPU on a PCI controller card that adds custom I/O (HDLC, TDM, Ethernet) to an industrial PC or compact-PCI backplane. The PCI interface supports both host and agent modes, allowing the same hardware to act as either a master controller or a slave peripheral. The PowerPC core runs VxWorks, Linux, or a hard real-time RTOS for deterministic industrial control. The 516-PBGA's 1 mm ball pitch demands careful PCB layout with microvia stackups or via-in-pad for the inner balls. Confirm PCI signaling compliance with the standard 33 MHz/66 MHz timing budgets.
Recomendado
Customer Premises Equipment (CPE) Gateway
The MPC8275VRMIBA's mix of Ethernet, USB, PCI, and ATM/UTOPIA interfaces aligns well with multi-service CPE gateways that bridge DSL or cable WAN links to Ethernet LAN, Wi-Fi, USB peripherals, and VoIP DSPs. The CPM accelerates PPPoE, IPoA, and IPoE session termination for residential gateway software stacks. At typical 3.3 V I/O and 1.5 V core, the part supports low-power idle modes that help meet CPE standby targets. The 266 MHz clock and 505.4 MIPS headroom run an embedded Linux gateway plus simple firewall/QoS without external coprocessors.
Recomendado
ATM/UTOPIA Edge Node
The MPC8275VRMIBA includes an integrated UTOPIA interface that connects directly to ATM PHY devices for ATM cell transfer at speeds up to OC-3, making the part suitable for compact ATM edge nodes and concentrators. The CPM performs AAL2 and AAL5 segmentation and reassembly in hardware, offloading the host core for higher-layer routing and signalling. The 64-bit data bus supports the cell-transfer DMA bandwidth demanded by ATM uplink aggregation. Designers should pay attention to UTOPIA bus length and load to stay within the AC timing budget documented in the datasheet.
Recomendado
Wireless Base Station Controller
The MPC8275VRMIBA is well matched to small-cell and picocell base-station controllers where multi-channel TDM backhaul and PCI connectivity to DSP arrays are required on a single board. The CPM handles Abis/IP backhaul framing while the G2_LE core runs the BTS management stack and O&M signalling. PCI provides a high-bandwidth link to baseband DSP clusters for I/Q sample transport. The 0C to +105C commercial temperature range fits climate-controlled indoor BTS enclosures. For outdoor small cells with wider temperature swing, validate industrial-grade variant availability before deployment.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MPC8275VRMIBA — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MPC8275ZQMIBA | MPC8270ZQMIBA | MPC8275CVRMIBA | MPC8280VRMIBA |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 516-PBGA (27x27 mm) | 516-PBGA (27x27 mm) - same | 516-PBGA (27x27 mm) - same | 516-PBGA (27x27 mm) - same | 516-PBGA (27x27 mm) - same |
| Architecture | PowerPC G2_LE | PowerPC G2_LE | PowerPC G2_LE | PowerPC G2_LE | PowerPC G2_LE |
| Data Bus Width | 64-Bit | 64-Bit | 64-Bit | 64-Bit | 64-Bit |
| CPM Channels | Multi-channel (HDLC/ATM/UTOPIA) | Multi-channel | Lower CPM channel count | Multi-channel | Multi-channel |
| Lifecycle Status | End of Life (last_time_buy) | End of Life | End of Life | End of Life | End of Life |
| Process Technology | HiPerMOS7 0.13 micron | HiPerMOS7 0.13 micron | HiPerMOS7 0.13 micron | HiPerMOS7 0.13 micron | HiPerMOS7 0.13 micron |
Principais diferenciais
- Integrated CPM (Communications Processor Module) for protocol offload (vs MPC8270ZQMIBA)
- Standardized 516-PBGA footprint shared with the PowerQUICC II family (vs MPC8250ACVRIHBC)
- 266 MHz / 505.4 MIPS throughput in the mid-range PowerQUICC II tier (vs MPC8280VRMIBA)
Notas de projeto
The MPC8275VRMIBA 516-PBGA package concentrates heat under the die. At 266 MHz with both cores active and CPM running, junction temperature rises materially above ambient. Boards should provide a continuous top-side ground/power plane under the BGA, thermal vias in the land pattern, and adequate airflow. Estimated: at 1.5 V core and typical PowerQUICC II power figures, junction temperature rise above ambient is in the 30-40 C range with a properly designed 4-layer PCB and 1 m/s airflow; verify against the datasheet thermal model for production designs.
The 1 mm ball pitch and 27x27 mm body require microvia stackup or via-in-pad technology on the inner balls. All 516 balls must be routed; leaving BGA balls unconnected causes signal-integrity and power-delivery issues. Keep the DDR SDRAM traces short and length-matched to maintain DDR AC timing. Reference the NXP design guide for the PowerQUICC II family for stackup and decoupling recommendations.
The 64-bit parallel data bus is the highest-speed synchronous interface on this part. Match trace lengths within each byte lane and across byte lanes per the datasheet timing budget. Use series damping resistors or adjustable drive strength on heavily loaded address/control lines. Validate PCI bus timing at 66 MHz if used; many designs limit PCI to 33 MHz for margin.
Do not assume cross-brand drop-in replacements exist for the MPC8275VRMIBA. The PowerPC G2_LE core plus CPM co-processor is unique to NXP. For new designs follow NXP's recommended replacement rather than substituting with ARM-based parts, which require PCB redesign and firmware porting. Also plan last-time-buy inventory now because NXP has declared the part End of Life per the official product page.
Informações de conformidade
RoHS compliant per Hitech-Semi and AmpHeo product listings (Lead Free / RoHS Compliant). Reach, halogen-free, and conflict-minerals status not explicitly stated in provided data and left as unknown. AEC-Q100 not applicable (communications MPU, not automotive).
