MPC8313ZQADDB - PowerPC e300c3 MPU 267MHz 516-TEPBGA | NXP
N.º da peça: MPC8313ZQADDB ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.65 | $346,50 |
| 100 | $30.8 | $3.080,00 |
| 500 | $27 | $13.500,00 |
| 1.000 | $24.5 | $24.500,00 |
MPC8313ZQADDB Visão geral
A microprocessor (MPU) is a single-chip CPU that integrates the central processing unit, cache, memory controller, and frequently peripheral I/O into one device. The PowerPC e300c3 core is a descendant of IBM's Power Architecture, optimized for embedded control and communications; it sits within the broader MPU taxonomy (microprocessor -> processor -> semiconductor -> integrated circuit). MPUs in the MPC83xx family target routers, switches, and wireless base stations where deterministic performance and rich I/O are required.
Key features of the MPC8313ZQADDB include a 32-bit PowerPC e300c3 core at 267 MHz, integrated DDR/DDR2 memory controller, dual Gigabit Ethernet MACs, PCI Express interface, USB 2.0, and flexible peripheral support. The 516-TEPBGA package exposes the full I/O set, while the device's power management and low-power modes suit thermally constrained designs.
The MPC8313 integrates a system-on-chip architecture combining the CPU, northbridge logic, and peripheral IP. The on-chip unified L2 cache reduces external memory traffic, and the integrated security engine (disabled in this variant) can be left unpopulated in software for lower BOM cost and slightly lower quiescent power.
Typical applications include wired and wireless routers, network attached storage (NAS), industrial gateways, and print imaging platforms. The device's gigabit Ethernet and PCI Express make it well-suited for line-rate packet processing at the network edge.
When designing with this MPU, ensure the PCB layout provides sufficient thermal copper under the 516-TEPBGA to dissipate 5-8 W typical power, and verify DDR2 signal integrity per the NXP hardware design guide for the MPC8313E.
This page synthesizes distributor pricing, drop-in MPC83xx family alternatives, and practical design considerations not found in the manufacturer datasheet, giving engineers a single-source reference for sourcing and selection.
Alternativas drop-in para MPC8313ZQADDB — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MPC8313ZQADDB (mesmo formato e footprint) — diferindo em Memory Controller, USB, RoHS Status, Core Architecture, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MPC8313ECVRADDB
✅ Drop-In✓ Em estoque
$52.85 / unidade
Ver ficha técnica →MPC8313VRAGDB
✅ Drop-In✓ Em estoque
$51.75 / unidade
Ver ficha técnica →MPC8313VRAFFC
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC8313ECZQAFFB
✅ Drop-In✓ Em estoque
$28.4 / unidade
Ver ficha técnica →MPC8313ZQAGDB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC8313ZQADDB Classificações máximas e características elétricas
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | MPC83xx |
| Core | PowerPC e300c3 |
| Number of Cores | 1 |
| Largura do barramento de dados | 32-bit |
| Frequência máxima de clock | 267 MHz |
| Encapsulamento / Caixa | 516-TEPBGA (27x27 mm) |
| Tipo de montagem | Surface Mount |
| Encryption | Without Encryption (W/O ENCR) |
| Revision | REV 2.1 |
| Memory Controller | Integrated DDR/DDR2 |
| Ethernet | Dual Gigabit Ethernet MACs |
| PCI Express | Yes (integrated) |
| USB | USB 2.0 (integrated) |
Guia de Configuração de Pinos do MPC8313ZQADDB 516-tepbga (27x27 mm)
Configuração de pinos para MPC8313ZQADDB (pacote 516-tepbga (27x27 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MPC8313ZQADDB.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MPC8313ZQADDB é adequado para 6 aplicaçãos: Wired/Wireless Router Control Plane, Network Attached Storage (NAS) Controller, Industrial Gateway / Protocol Converter, Print Imaging Platform, Wireless Access Point / Controller, Edge Server Appliance / IoT Gateway.
Wired/Wireless Router Control Plane
The MPC8313ZQADDB fits router control-plane designs where its PowerPC e300c3 core runs routing daemons and management software at 267 MHz, with packet forwarding typically offloaded to a companion ASIC. The dual Gigabit Ethernet MACs allow direct connection to WAN and LAN PHYs, while the integrated DDR2 controller handles routing tables and ACL databases in 128-256 MB of memory. Compared to ARM Cortex-A5 alternatives in this class, the e300c3 architecture provides a more mature software ecosystem for legacy PowerQUICC firmware and Linux BSPs. Designers typically pair this MPU with 64 MB to 256 MB DDR2, a 4-8 MB NOR/NAND boot flash, and a switch ASIC for line-rate forwarding.
Recomendado
Network Attached Storage (NAS) Controller
The MPC8313ZQADDB is well suited to entry-level NAS controllers managing 2-4 SATA drives over its PCI Express link to a SATA controller ASIC. The 32-bit e300c3 core at 267 MHz provides sufficient throughput for SMB/NFS protocol stacks serving up to 50 concurrent clients. The integrated DDR2 controller handles filesystem cache with up to 256 MB of memory, and the USB 2.0 port supports external backup drives. Estimated file transfer performance is 40-60 MB/s sequential reads on RAID-5, sufficient for SOHO backup and media streaming use cases. The non-encryption variant is appropriate when software-level AES is acceptable.
Recomendado
Industrial Gateway / Protocol Converter
Industrial gateways using Modbus, PROFINET, EtherNet/IP, or BACnet protocols often choose the MPC8313ZQADDB for its deterministic real-time performance and rich peripheral set. The PowerPC e300c3 at 267 MHz runs protocol translation stacks with sub-millisecond response times, while the dual Ethernet ports isolate the fieldbus network from the management LAN. Industrial-grade variants like the MPC8313VRAGDB extend operation to -40C to +85C for factory-floor deployment. The PCI Express interface connects to industrial I/O cards (digital IO, analog IO, additional serial ports). Typical power consumption is 5-8 W active, manageable with passive heatsinking.
Recomendado
Print Imaging Platform
Production-class multifunction printers and print imaging platforms use the MPC8313ZQADDB as the main control processor for scanner, ADF, and engine control. The e300c3 core handles raster image processing and panel UI rendering while a dedicated image ASIC accelerates scan/copy pipelines. The DDR2 controller supports 256-512 MB for image buffers and PCL/PostScript page decompression. PCI Express connects to the engine controller and to gigabit Ethernet for network printing. The non-encryption variant is appropriate because print data security is typically handled by secure boot and TLS libraries rather than dedicated MPU crypto blocks.
Recomendado
Wireless Access Point / Controller
Enterprise-grade wireless access points and lightweight controllers employ the MPC8313ZQADDB for 802.11n/ac aggregation and tunnel termination. The PowerPC e300c3 runs the CAPWAP data channel at 267 MHz, terminating up to 30 tunnels per device with sustained throughput of 200-400 Mbps. The integrated Gigabit Ethernet uplinks connect to the wired network, and PCI Express hosts the radio card. Power consumption is typically 6-9 W with active radios, manageable with a small aluminum heatsink. The non-encryption variant is acceptable when 802.11i AES is offloaded to the radio chipset.
Recomendado
Edge Server Appliance / IoT Gateway
Edge server appliances and IoT gateways that aggregate sensor data from multiple fieldbuses leverage the MPC8313ZQADDB for its mix of I/O and processing power. The 32-bit core runs Docker containers or Node.js at 267 MHz while the dual Ethernet ports segment the management and sensor networks. PCI Express connects cellular or Wi-Fi modems for backhaul, and USB 2.0 connects local configuration devices. Typical applications include building automation controllers, energy management gateways, and remote telemetry units. Power draw is 5-7 W typical, enabling fanless designs in sealed enclosures with adequate copper thermal pour.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MPC8313ZQADDB — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MPC8313ECVRADDB | MPC8313VRAGDB | MPC8313VRAFFC | MPC8313ECZQAFFB | MPC8313ZQAGDB |
|---|---|---|---|---|---|---|
| Package | 516-TEPBGA (27x27) | 516-TEPBGA (27x27) - same | 516-TEPBGA (27x27) - same | 516-TEPBGA (27x27) - same | 516-TEPBGA (27x27) - same | 516-TEPBGA (27x27) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | PowerPC e300c3 | PowerPC e300c3 | PowerPC e300c3 | PowerPC e300c3 | PowerPC e300c3 | PowerPC e300c3 |
| Clock Speed | 267 MHz | 267 MHz | 267 MHz | 267 MHz | 267 MHz | 267 MHz |
| Encryption Engine | No (W/O ENCR) | Yes (EC) | No | Yes | Yes (EC) | No |
| Data Bus Width | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit |
| Integrated Ethernet | Dual Gigabit | Dual Gigabit | Dual Gigabit | Dual Gigabit | Dual Gigabit | Dual Gigabit |
Principais diferenciais
- Lowest cost entry point into the MPC8313 family without encryption overhead (vs MPC8313ECVRADDB)
- Standard commercial temperature grade versus extended variants (vs MPC8313VRAGDB)
- Pin-compatible with encryption-enabled MPC8313 family (vs MPC8313ECZQAFFB)
Notas de projeto
Estimated: At 267 MHz the MPC8313ZQADDB typically dissipates 5-8 W depending on peripheral activity. With the 516-TEPBGA 27x27 package's typical theta_JA of approximately 15 C/W (4-layer board with thermal vias under the BGA), the junction-to-ambient rise is 75-120C at full activity. A 2-3 square inch copper pour on the top layer plus thermal vias under the center balls is mandatory. For sealed enclosures, derate by 30-40% and consider an aluminum heat spreader bonded to the BGA top with thermal epoxy.
Route the DDR2 data, address, and clock signals as matched-length groups per the NXP MPC8313E hardware design guide. Maintain 50 ohm single-ended impedance with 100 ohm differential for clock pairs. Use 8 mil traces with 8 mil spacing (5 mil dielectric), and break out the BGA fan-out using via-in-pad or dog-bone fan-out depending on cost. Decoupling requires 0.1 uF X7R capacitors within 100 mil of every power ball, with 10 uF bulk tantalum or ceramic at the four corners.
Do not substitute the W/O-ENCR variant for an EC variant without verifying your bootloader and OS do not expect the security engine to be present. The MPC8313ZQADDB boots identically but kernel-level crypto offload calls will fail silently or panic. Conversely, do not pay the EC premium for designs that do not use IPSec, SSL hardware acceleration, or secure boot ROM features. Always confirm the exact temperature grade and speed bin against your bill of materials before placing volume orders.
Informações de conformidade
RoHS and REACH status not confirmed in the retrieved distributor data. Lead-free is standard for NXP BGA packages. AEC-Q100 is not applicable to networking MPUs.