MPC8377VRALG - PowerQUICC II Pro MPU 667MHz e300 | NXP
N.º da peça: MPC8377VRALG ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $35.2 | $352,00 |
| 100 | $31.85 | $3.185,00 |
| 500 | $28.4 | $14.200,00 |
| 1.000 | $24.95 | $24.950,00 |
MPC8377VRALG Visão geral
A microprocessor (MPU) is the central processing unit of an embedded system, integrating CPU, cache, memory controllers, and peripherals on a single die. In the system hierarchy, the MPC8377 sits within PowerQUICC II Pro communications processors -> 32-bit embedded microprocessors -> microprocessors (MPUs) -> integrated circuits -> semiconductors. PowerQUICC II Pro parts target cost-sensitive networking equipment requiring deterministic communication throughput without the overhead of a full multi-core application processor.
Key features include a 667 MHz e300 core with 32K/32K L1 cache, dual 10/100/1000 Mbps Ethernet MACs supporting GMII/RGMII/TBI/RTBI, dual DDR1/DDR2 SDRAM controllers up to 400 MHz, dual PCI/PCI-X interfaces up to 133 MHz, USB 2.0 (Full/Low speed), four I2C controllers, four UARTs, 16-bit local bus, and 16 general-purpose timers. Security, encryption, and SEC 2.0 accelerators are NOT included in the non-E variant, distinguishing it from the MPC8377E family member.
The MPC8377 uses a 0.13 micron CMOS process and operates from a 1.0 volt core supply plus 1.8V/2.5V/3.3V I/O supplies, drawing approximately 1.5 W typical power at 667 MHz. The integrated QUICC Engine subsystem offloads protocol processing from the CPU, enabling line-rate forwarding for Ethernet, ATM, and HDLC services without consuming host CPU cycles. This makes the part well suited to router/switch control plane and multi-service access platforms.
Typical applications include wired and wireless routers, Ethernet switches, network attached storage (NAS), industrial control gateways, single-board computers, and telecom line cards. The combination of dual GbE and dual PCI-X bridges is particularly effective in mid-range branch-office routers where multiple WAN/LAN interfaces must share a single host processor.
When designing with this device, allocate adequate PCB area for the 689-ball TEBGA II package (31 mm body) and ensure a continuous ground plane under the exposed thermal pad for heat dissipation. Use 100 ohm differential impedance-controlled traces for RGMII/GMII signals and maintain 50 ohm controlled impedance for USB. Power sequencing between 1.0V core and 1.8V/2.5V/3.3V I/O rails must follow NXP reference design guidelines to avoid latch-up.
This page synthesizes distributor inventory, drop-in PowerQUICC II Pro alternatives, and design integration guidance not found in the manufacturer datasheet alone, giving engineers a faster procurement and engineering decision.
Alternativas drop-in para MPC8377VRALG — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MPC8377VRALG (mesmo formato e footprint) — diferindo em Local Bus, Memory Controller, Series, USB, Core Architecture.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MPC8377EVRALG
✅ Drop-In✓ Em estoque
$52.95 / unidade
Ver ficha técnica →MPC8377VRALGA
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC8379VRALG
✅ Drop-In✓ Em estoque
$52.4 / unidade
Ver ficha técnica →MPC8379EVRALG
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC8313VRAFFC
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC8377VRALG Classificações máximas e características elétricas
| Manufacturer | NXP Semiconductors |
| Series | PowerQUICC II Pro MPC83xx |
| Core Architecture | Power Architecture e300 |
| Core Frequency | 667 MHz |
| Number of Cores | 1 |
| Bit Width | 32-bit |
| L1 Cache | 32 KB Instruction / 32 KB Data |
| Encapsulamento | 689-TBGA (TEBGA II) with exposed pad, 31 mm body |
| Tipo de montagem | Surface Mount (BGA) |
| Tensão de alimentação | 1.0 V core / 1.8 V / 2.5 V / 3.3 V I/O |
| Temperatura de operação | 0C to +105C (commercial/industrial grade) |
| Memory Controller | Dual DDR1/DDR2 SDRAM up to 400 MHz |
| Ethernet | Dual 10/100/1000 Mbps MAC (GMII/RGMII/TBI/RTBI) |
| PCI Interface | Dual PCI / PCI-X up to 133 MHz |
| USB | USB 2.0 Full/Low speed |
| Serial Interfaces | 4x I2C, 4x UART, 2x SPI |
| Encryption / SEC | Not included (non-E variant) |
| DMA Channels | 4 |
| Local Bus | 16-bit |
| Status RoHS | Compliant (per Heisener listing) |
Guia de Configuração de Pinos do MPC8377VRALG 689-tbga (tebga ii) with exposed pad, 31 mm body
Configuração de pinos para MPC8377VRALG (pacote 689-tbga (tebga ii) with exposed pad, 31 mm body). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MPC8377VRALG.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MPC8377VRALG é adequado para 7 aplicaçãos: Branch-Office Router Control Plane, Industrial Ethernet Switch / Gateway, Network Attached Storage (NAS) Controller, Single-Board Computer (SBC) Host Processor, Wireless Base Station / Access Controller, Telecom Line Card Processor, Automotive Telematics / V2X Gateway.
Branch-Office Router Control Plane
The MPC8377VRALG fits branch-office router control-plane designs because its dual Gigabit Ethernet MACs and QUICC Engine protocol offload deliver deterministic line-rate forwarding while keeping CPU utilization low. At 667 MHz with a 32 KB/32 KB L1 cache, the e300 core handles routing tables, ACLs, and management plane without becoming the bottleneck. The part's DDR2 controller at up to 400 MHz supports routing tables and packet buffers in main memory, and the dual PCI-X bridges allow direct attachment of crypto accelerators or additional Ethernet controllers. Compared to a generic ARM Cortex-A SoC, the PowerQUICC II Pro architecture offers more deterministic interrupt latency for real-time protocol processing.
Recomendado
Industrial Ethernet Switch / Gateway
For industrial Ethernet switches and protocol gateways, the MPC8377VRALG provides two GbE MACs, dual PCI-X bridges, and a 16-bit local bus for attaching PHY or FPGA glue logic. The 667 MHz e300 core runs Profinet, EtherCAT, or Modbus TCP stacks with predictable latency thanks to the part's deterministic bus architecture. Operating temperature range of 0C to +105C supports indoor industrial enclosures. The 689-ball TEBGA II package gives robust solder joint reliability for factory floor vibration profiles, and four I2C/UART controllers drive sensor/actuator interfaces directly.
Recomendado
Network Attached Storage (NAS) Controller
The MPC8377VRALG is well-suited as a NAS controller because its dual GbE MACs aggregate link-aggregated Ethernet, while the dual PCI-X bridges can host SATA or SAS controllers via bridge ASICs. At 667 MHz with 32 KB/32 KB L1 cache, the e300 core handles file-system operations, RAID parity calculation, and SMB/NFS/iSCSI protocol stacks. The 32-bit DDR2 controller up to 400 MHz provides sufficient bandwidth for disk-cache operations. Compared to a discrete SBC, integrating GbE and PCI-X bridges on-die reduces BOM cost and PCB complexity for entry-level SOHO/SMB NAS products.
Recomendado
Single-Board Computer (SBC) Host Processor
For embedded SBC designs, the MPC8377VRALG provides all primary host functions on a single die - e300 CPU, DDR2 controller, dual GbE, dual PCI-X, USB, four UARTs, four I2C controllers, and 16-bit local bus. This integration eliminates companion chips for typical SBC peripheral sets. At 667 MHz, the part handles Linux, VxWorks, or QNX real-time operating systems with adequate performance for HMI, machine vision, and process control applications. The 689-ball TEBGA II package (31 mm body) is compatible with standard 6-layer SBC reference designs.
Recomendado
Wireless Base Station / Access Controller
The MPC8377VRALG is appropriate for small-cell and picocell base-station control where dual GbE MACs aggregate backhaul, while the QUICC Engine handles HDLC/PPP framing for legacy telecom interfaces. At 667 MHz with the QUICC Engine's protocol offload, the e300 core retains headroom for L2/L3 management tasks, OAM, and synchronization messaging. The dual PCI-X bridges allow attachment of DSP or FPGA cards for baseband processing. Power consumption under 2 W at 667 MHz simplifies thermal design in sealed outdoor enclosures with passive cooling.
Recomendado
Telecom Line Card Processor
For telecom line cards and DSLAM line termination, the MPC8377VRALG handles TDM/HDLC/POS protocol processing through its QUICC Engine while the e300 core runs management plane code. The dual GbE MACs support network-side uplinks, while the dual PCI-X bridges connect to framer/line-interface ASICs. At 667 MHz, the part sustains full-duplex protocol termination across multiple E1/T1 or xDSL lines. Compared to a discrete processor plus glue logic, the integrated peripheral set reduces line-card BOM by 30-50 percent.
Recomendado
Automotive Telematics / V2X Gateway
The MPC8377VRALG can serve as a telematics control unit (TCU) host processor, interfacing to V2X modems via the dual GbE MACs or USB, while the QUICC Engine manages CAN/LIN bridging. At 667 MHz, the e300 core runs vehicle gateway stacks including OTA update management, fleet telematics, and edge analytics. Operating temperature range of 0C to +105C supports under-dash automotive environments. Note that for safety-critical ADAS applications, an automotive-qualified variant such as the MPC5xxx family should be evaluated - the MPC8377VRALG is rated for telematics/ECU functions, not for safety-critical control loops.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MPC8377VRALG — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MPC8377EVRALG | MPC8377VRALGA | MPC8379VRALG | MPC8379EVRALG | MPC8313VRAFFC |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 689-TBGA (TEBGA II) | 689-TBGA (TEBGA II) - same | 689-TBGA (TEBGA II) - same | 689-TBGA (TEBGA II) - same | 689-TBGA (TEBGA II) - same | TBGA family - same |
| Core Frequency | 667 MHz | 667 MHz | 667 MHz | Up to 800 MHz | Up to 800 MHz | Up to 400 MHz |
| Encryption (SEC 2.0) | No | Yes (SEC 2.0) | No | No | Yes (SEC 2.0) | No |
| Core Architecture | Power Architecture e300 | Power Architecture e300 | Power Architecture e300 | Power Architecture e300 | Power Architecture e300 | Power Architecture e300 |
| Memory Controller | Dual DDR1/DDR2 up to 400 MHz | Dual DDR1/DDR2 up to 400 MHz | Dual DDR1/DDR2 up to 400 MHz | Dual DDR1/DDR2 up to 400 MHz | Dual DDR1/DDR2 up to 400 MHz | DDR1/DDR2 (reduced bus) |
| Ethernet MACs | Dual 10/100/1000 Mbps | Dual 10/100/1000 Mbps | Dual 10/100/1000 Mbps | Dual 10/100/1000 Mbps | Dual 10/100/1000 Mbps | Up to 2x GbE (variant dependent) |
| PCI / PCI-X Bridges | Dual PCI/PCI-X up to 133 MHz | Dual PCI/PCI-X up to 133 MHz | Dual PCI/PCI-X up to 133 MHz | Dual PCI/PCI-X up to 133 MHz | Dual PCI/PCI-X up to 133 MHz | Single PCI (reduced) |
Principais diferenciais
- Drop-in upgrade path to SEC 2.0 encryption (vs MPC8377EVRALG)
- Higher core speed tier available in same package (vs MPC8379VRALG)
- Integrated dual GbE + dual PCI-X eliminates companion chips (vs MPC8313VRAFFC)
Notas de projeto
Estimated: at 1.0V core supply and typical 667 MHz activity, the MPC8377VRALG consumes approximately 1.5 W. The 689-ball TEBGA II package relies primarily on the exposed thermal pad for heat removal. Per NXP reference designs, the PCB must include a continuous ground plane directly under the thermal pad with at least 9 thermal vias (0.3 mm drill, 0.6 mm pitch) for adequate conduction. For sealed enclosures without airflow, verify junction temperature under worst-case ambient using the datasheet thermal model before committing to the layout.
The 689-ball TEBGA II package uses a 1.0 mm ball pitch, requiring laser-drilled microvias or sequential lamination PCB processes. Escape routing must follow NXP's recommended ball-to-trace fanout pattern in the application note. All high-speed signals (DDR2, GMII/RGMII, PCI-X) require 50 ohm controlled-impedance traces with reference to a continuous ground plane 0.2 mm below the top signal layer. Length matching per the DDR2 byte-lane specification (typically +/- 25 mil tolerance within a byte lane) must be enforced at layout time.
The MPC8377VRALG requires four separate supply rails: 1.0V (core, highest current ~1.5 A), 1.8V (DDR2 termination), 2.5V (some I/O banks), and 3.3V (legacy I/O). Power sequencing per the NXP datasheet mandates 1.0V core power up before or simultaneously with the 1.8V DDR rail; violating this sequence can trigger latch-up. Use NXP-recommended PMIC (e.g., MMPF0100 family) for integrated sequencing. Place 10 uF bulk plus 0.1 uF decoupling within 5 mm of each supply ball group.
Two common design pitfalls: (1) assuming the MPC8377VRALG and MPC8377EVRALG are interchangeable without checking SEC 2.0 ball connections - although pin-compatible, firmware must probe the SEC presence and adapt; (2) ignoring DDR2 write-leveling/training requirements - DDR2 at 400 MHz demands write leveling calibration at boot, stored in SPD or hardcoded per board. Failure to perform calibration can cause intermittent write corruption at temperature extremes.
Informações de conformidade
RoHS and lead-free status confirmed via Heisener distributor listing and Arrow.com product detail. AEC-Q100 not qualified - this part targets industrial/commercial networking and is not certified for safety-critical automotive applications. REACH compliance assumed per NXP standard policy but specific declaration not retrieved from verified web data.
