MPC8545PXANGB - PowerPC e500 800MHz MPU 783-FCBGA | NXP
N.º da peça: MPC8545PXANGB ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $256.5 | $2.565,00 |
| 100 | $228 | $22.800,00 |
| 250 | $205.2 | $51.300,00 |
| 500 | $185.25 | $92.625,00 |
MPC8545PXANGB Visão geral
A PowerQUICC III microprocessor is a communications-centric SoC that combines a Power Architecture CPU core with integrated peripherals historically used in routing, switching, and protocol-processing applications. Within the broader taxonomy, it sits as a microprocessor -> embedded MPU -> Power Architecture SoC -> PowerQUICC family. The e500 core implements the Book E instruction set with hardware hypervisor and signal-processing extensions, allowing efficient handling of control-plane and packet-processing workloads.
Key features include an 800 MHz e500 core, 32-bit Power Architecture implementation, integrated peripherals for serial and packet I/O, on-chip L1 caches, and a 783-ball FCBGA package that exposes the full address/data bus plus communications interfaces. The combination of a programmable CPU and tightly coupled I/O enables the MPC8545PXANGB to handle both control-plane software stacks and high-throughput data movement without external co-processors in many designs.
The architecture uses a multi-level bus structure with separate system and peripheral buses, allowing concurrent instruction fetches, data accesses, and DMA transfers. Hardware coherency between the e500 core and integrated peripherals is maintained by the on-chip bus fabric, which simplifies software development for mixed control-and-data workloads.
Typical applications include wired networking routers and switches, industrial control boards, telecom base-station control cards, and embedded server appliances. The e500 ecosystem with Linux, VxWorks, and Green Hills INTEGRITY support makes the part well suited to long-lifecycle industrial designs.
When designing with this device, ensure the PCB can accommodate the 29x29 mm FCBGA land pattern with controlled-impedance routing for the DDR memory interface and proper thermal management. Firmware updates must be planned via the device's boot ROM and flash interface.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives within the MPC85xx family, and practical PCB/thermal design notes that go beyond the manufacturer datasheet.
Alternativas drop-in para MPC8545PXANGB — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MPC8545PXANGB
✅ Drop-In✓ Em estoque
$185.25 / unidade
Ver ficha técnica →MPC8548EPXAQGB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC8548EVJAUJD
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC8536CVJAULA
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC8545PXANGB Classificações máximas e características elétricas
| Processor Type | PowerPC e500 Microprocessor IC, MPC85xx PowerQUICC III |
| Core Count | 1 |
| Core Architecture | 32-bit Power Architecture e500 (Book E) |
| Maximum Core Frequency | 800 MHz |
| Core Supply Voltage | 1.1 V |
| Encapsulamento | 783-FCBGA (29x29 mm) |
| Tipo de montagem | Surface Mount (BGA) |
| Family | MPC85xx / PowerQUICC III |
| Instruction Set | Power Architecture Book E with signal-processing extensions |
| Memory Interface | DDR SDRAM controller (per MPC85xx family) |
| Status RoHS | Compliant (Pb-free) |
Guia de Configuração de Pinos do MPC8545PXANGB 783-fcbga (29x29 mm)
Configuração de pinos para MPC8545PXANGB (pacote 783-fcbga (29x29 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MPC8545PXANGB.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MPC8545PXANGB é adequado para 6 aplicaçãos: Wired Networking Routers and Switches, Telecom Base-Station Control Cards, Industrial Control and Automation Boards, Embedded Server and Storage Appliances, Defense and Aerospace Embedded Computing, Medical Imaging and Diagnostic Equipment.
Wired Networking Routers and Switches
The MPC8545PXANGB's e500 core at 800 MHz plus integrated PCI/PCI-X/PCI Express and multi-channel Ethernet MACs make it well suited for control-plane packet processing in mid-range routers and managed Layer 2/3 switches. The deterministic e500 Book E architecture and hardware crypto accelerators handle routing-table lookups, ACL processing, and IPsec forwarding with bounded latency, while the DDR SDRAM controller feeds packet buffers without external bridges. Power dissipation is the main thermal trade-off versus newer QorIQ Layerscape parts, but the mature Linux and VxWorks BSP ecosystem dramatically shortens time-to-market for production routers.
Recomendado
Telecom Base-Station Control Cards
Base-station control cards require deterministic real-time control alongside protocol processing, both of which the MPC8545PXANGB's e500 core delivers at 800 MHz. The integrated PCI Express and Ethernet interfaces connect to baseband and backhaul ASICs, while the on-chip UARTs, I2C, and SPI serve board management and shelf-management tasks. Compared with newer SoCs, the PowerQUICC III parts offer long-term availability and proven reliability in telecom environments where field lifetimes exceed 10 years, justifying the higher power dissipation. Hardware-accelerated CRC and crypto engines offload control-plane overhead from the e500 core.
Recomendado
Industrial Control and Automation Boards
Industrial controllers need a deterministic real-time CPU, rich I/O, and long product lifecycles, all of which the MPC8545PXANGB provides at 800 MHz. The e500 core runs VxWorks, INTEGRITY, or RT-Linux with sub-millisecond interrupt latency, while the integrated peripherals (PCI, Ethernet, UART, SPI, I2C) connect to motor drives, sensors, and HMIs without external bridge chips. The 783-FCBGA package, sized at 29x29 mm, is appropriate for industrial SBC form factors. Long-life availability through NXP's extended-lifecycle programs is the key advantage versus merchant silicon.
Recomendado
Embedded Server and Storage Appliances
The MPC8545PXANGB's 800 MHz e500 core, integrated Ethernet MACs, and PCI/PCI-X/PCI Express lanes fit small-form-factor storage controllers and headless file/print appliances where x86 cost or power is excessive. The DDR SDRAM controller hosts up to 1 GB of system memory, while the integrated MACs and PCI Express links connect to SATA, SAS, or 10 GbE controllers for storage I/O. Linux and NetBSD support allow reuse of standard NAS and SAN software stacks. Compared with ARM SoCs, the MPC8545PXANGB delivers more deterministic I/O latency at the cost of higher power dissipation.
Recomendado
Defense and Aerospace Embedded Computing
Defense subsystems favour processors with long-term availability, extended temperature grades, and proven reliability, all characteristics of the MPC8545 family. The MPC8545PXANGB at 800 MHz handles sensor aggregation, navigation data processing, and bus interfacing in ruggedized VME or VPX boards. Conduction-cooled chassis rely on the FCBGA package's exposed die for direct heat-sink attach. The Power Architecture ecosystem with INTEGRITY-178 and LynxOS-178 certifications is a major advantage versus newer SoCs without safety-certified BSPs. Cryptographic accelerators support secure comms at the hardware level.
Recomendado
Medical Imaging and Diagnostic Equipment
Medical imaging peripherals (ultrasound front-ends, endoscopy controllers, patient monitors) benefit from the MPC8545PXANGB's deterministic 800 MHz compute, hardware crypto, and PCI Express links to imaging ASICs. The e500 core runs FDA-cleared RTOS stacks such as INTEGRITY or VxWorks for IEC 62304 compliance. Long-term silicon availability (10+ years) is critical for medical device certification maintenance, and the PowerQUICC III roadmap supports this lifecycle. Compared with general-purpose ARM parts, the e500's hardware memory coherency and bus fabric simplify multi-master designs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MPC8545PXANGB — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MPC8548EPXAQGB | MPC8548EVJAUJD | MPC8536CVJAULA |
|---|---|---|---|---|
| Package | 783-FCBGA (29x29 mm) | 783-FCPBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | PowerPC e500 32-bit | PowerPC e500 32-bit | PowerPC e500 32-bit | PowerPC e500 32-bit |
| Core Voltage | 1.1 V | 1.1 V - same | 1.1 V - same | 1.1 V - same |
| Family | MPC8545 / PowerQUICC III | MPC8548 / PowerQUICC III | MPC8548 / PowerQUICC III | MPC8536 / PowerQUICC III |
| Operating Temperature | -40C to +105C (industrial) | -40C to +105C | Extended (-40C to +125C) | -40C to +105C |
Principais diferenciais
- Balanced 800 MHz compute with rich integrated I/O (vs MPC8536CVJAULA)
- Lower-frequency MPC85xx variant for cost-sensitive designs (vs MPC8548EPXAQGB)
- Mature long-life PowerQUICC III platform (vs Newer NXP Layerscape / QorIQ processors)
Notas de projeto
The 783-FCBGA package exposes the silicon die through the BGA substrate, allowing a heat spreader or heat sink to be attached with thermal interface material for conduction cooling. Estimated: at 800 MHz and typical PowerQUICC III power of 6-10 W (depending on peripheral utilization), a heat spreader is required to keep junction temperature below 105C in industrial environments. Use the JEDEC-standard junction-to-ambient thermal resistance value from the NXP datasheet and verify with the application thermal model before locking the PCB stack-up.
The 783-FCBGA at 29x29 mm uses 1.0 mm ball pitch with rows on a 1.27 mm escape grid; PCB design must use HDI microvia stacks with laser-drilled vias and a 6-8 layer stack-up for controlled-impedance DDR and Ethernet routing. Matched-length routing is required for DDR SDRAM address/command and Ethernet MII/GMII signals. Reference the NXP MPC8545 Design Checklist and the Freescale/NXP hardware specifications document for the exact via pattern, antipad geometry, and breakout recommendations.
The MPC8545PXANGB requires multiple supply rails: 1.1 V for the e500 core, 1.2-2.5 V for DDR termination, and 3.3 V for I/O and analog. Power-up sequencing is mandatory and must follow the order defined in the NXP MPC8545 hardware specifications, with monotonic ramp rates and reset hold times per the data sheet. Estimated: total board power is approximately 10-15 W at full utilization, so the PMIC must deliver 15 W continuous and respect the inrush limit. Use NXP-recommended load switches and supervisors to enforce the sequence.
Informações de conformidade
RoHS compliant per NXP product page and distributor listings. Halogen-free status not explicitly stated in the verified data; verify lot-by-lot before halogen-sensitive builds. AEC-Q100 not applicable - this is an industrial/embedded MPU, not an automotive-qualified IC.