MPC8547EVTAQGD - PowerQUICC III 1GHz SoC | NXP | Networking
N.º da peça: MPC8547EVTAQGD ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $265.5 | $2.655,00 |
| 100 | $240 | $24.000,00 |
| 250 | $225 | $56.250,00 |
| 500 | $210 | $105.000,00 |
MPC8547EVTAQGD Visão geral
A PowerQUICC III processor is a member of the Power Architecture communications-processor family, hierarchically classified as an embedded microprocessor (MPU) within the broader semiconductor category. PowerQUICC devices historically combine a PowerPC/e500 CPU core with integrated communications peripherals (Ethernet, ATM, HDLC, TDM, PCI), targeting routers, switches, wireless base stations, and other packet-processing equipment. By collapsing the CPU and datapath accelerators onto one die, PowerQUICC III simplifies board layout versus discrete CPU-plus-ASSP designs.
Key differentiating features of the MPC8547EVTAQGD include the 1000 MHz e500 core, hardware-accelerated security (SEC) for IPsec / SSL / 3DES / AES, four SerDes lanes configurable for PCI Express, Serial RapidIO, or dual GbE, a 64-bit DDR2 memory controller with ECC supporting up to 1 GB of registered memory, and dual integrated Gigabit Ethernet MACs. The extended-temperature silicon revision R3.0 also adds refinements to the local bus controller and CPM-style TDM interfaces.
Architecturally, the device separates host-side processing (e500 core, MMU, L1/L2 caches, DDR controller) from I/O-side communications engines, allowing deterministic packet handling independent of OS scheduling. The integrated SEC block offloads crypto operations from the CPU, sustaining line-rate throughput on encrypted traffic without software bottlenecks.
Typical applications include enterprise routers and switches, LTE/3G base-band cards, industrial control gateways, network-attached storage controllers, secure VPN appliances, and multi-service access platforms. For designs requiring deeper packet inspection, the MPC8547E family can pair with companion DSPs such as the MSC8144.
Designers should size the DDR2 controller termination and trace impedance per JEDEC DDR2 specifications, provide a stable 1.0 V core and 2.5 V I/O supply with adequate bulk decoupling, and observe the 783-ball FCBGA reflow profile (peak ~245 °C) for reliable assembly.
This page synthesizes distributor pricing, drop-in alternatives within the PowerQUICC III family, and practical design notes not consolidated in the manufacturer datasheet, helping engineers evaluate sourcing and second-source options.
Alternativas drop-in para MPC8547EVTAQGD — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MPC8547EVTAQGD (mesmo formato e footprint) — diferindo em Core Architecture, Memory Controller, Mounting Type, Ethernet, Package.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MPC8547EVTANGD
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MPC8547EVTALGD
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MPC8547ECVTAGD
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MPC8548EVTAQGD
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
P2020NXE2KFC
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MPC8547EVTAQGD Classificações máximas e características elétricas
| Core Architecture | Power Architecture e500 |
| Core Frequency | 1000 MHz |
| Silicon Revision | R3.0 |
| Faixa de temperatura de operação | 0 °C to +105 °C |
| L1 Cache | 32 KB I-cache + 32 KB D-cache |
| Memory Controller | 64-bit DDR2 with ECC |
| Integrated Ethernet | Dual Gigabit Ethernet (GbE) |
| PCI Support | PCI, PCI-X, PCI Express (PCIe) |
| Serial RapidIO (SRIO) | Yes |
| Security Engine (SEC) | Yes (IPsec, SSL, 3DES, AES) |
| Encapsulamento | 783-ball FCBGA |
| Tipo de montagem | Surface Mount (BGA) |
| Product Family | PowerQUICC III (MPC8547E series) |
Guia de Configuração de Pinos do MPC8547EVTAQGD 783-ball fcbga
Configuração de pinos para MPC8547EVTAQGD (pacote 783-ball fcbga). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MPC8547EVTAQGD.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MPC8547EVTAQGD é adequado para 6 aplicaçãos: Enterprise Router / Switch Control Plane, Wireless Base Station Baseband Card, Industrial IoT Gateway / Edge Router, Secure VPN / SSL Appliance, Network-Attached Storage (NAS) Controller, Multi-Service Access Platform (MSAN).
Enterprise Router / Switch Control Plane
The MPC8547EVTAQGD is well suited as the control-plane CPU in enterprise routers and L2/L3 switches where the e500 core at 1000 MHz handles routing-table updates, OSPF/BGP forwarding decisions, and management-plane traffic. The dual integrated Gigabit Ethernet MACs connect directly to line-card MACs, while the four SerDes lanes can be configured as PCI Express links to switching fabrics or Serial RapidIO links to DSP clusters, eliminating external bridge chips. Hardware-accelerated IPsec and SSL in the SEC engine sustain encrypted VPN throughput without CPU bottlenecks, a critical metric for site-to-site tunnel aggregation.
Recomendado
Wireless Base Station Baseband Card
In 3G/4G wireless base-station baseband cards, the MPC8547EVTAQGD serves as the main communications processor coordinating Layer-2 processing, ATM/TDM termination, and backhaul encryption. The on-chip security engine accelerates AES and 3DES ciphers required for air-interface ciphering (Kasumi, SNOW 3G offload via software), while PCI Express x4 links attach to dedicated DSPs such as the MSC8144 for Layer-1 PHY processing. The 0 °C to +105 °C temperature range supports outdoor radio-unit deployments in environmentally uncontrolled enclosures.
Recomendado
Industrial IoT Gateway / Edge Router
For ruggedized industrial IoT gateways, the MPC8547EVTAQGD delivers deterministic packet handling for protocols such as PROFINET, EtherNet/IP, and Modbus TCP through its dual GbE MACs and PCI-based expansion. The hardware ECC on the DDR2 controller is essential for installations exposed to single-event upset risk, while the extended temperature rating covers factory-floor and outdoor cabinet environments. RapidIO links provide deterministic sub-microsecond latency for time-sensitive industrial control loops that Ethernet alone cannot guarantee.
Recomendado
Secure VPN / SSL Appliance
In SSL VPN and IPsec gateway appliances, the MPC8547EVTAQGD's integrated SEC engine accelerates bulk AES/3DES/SHA operations at line rate, offloading the e500 core for session-management tasks. The 1000 MHz core and 64-bit DDR2 controller with ECC maintain low-latency throughput for thousands of simultaneous tunnels, while PCI-X slots accommodate cryptographic accelerator cards for FIPS-validated deployments. The PowerQUICC III architecture's separation of host-side and I/O-side processing ensures crypto bottlenecks do not stall forwarding plane throughput.
Recomendado
Network-Attached Storage (NAS) Controller
As a NAS controller, the MPC8547EVTAQGD combines its 1000 MHz e500 core with the 64-bit DDR2 memory controller to drive RAID stacks over SATA or SAS expander backplanes attached via PCI-X. The dual GbE MACs enable link-aggregation or load-balancing configurations, while Serial RapidIO connectivity to coprocessor FPGAs accelerates deduplication and compression offload. Hardware ECC on the memory controller protects against bit-rot, critical for archival storage reliability over multi-year service intervals.
Recomendado
Multi-Service Access Platform (MSAN)
In carrier-grade Multi-Service Access Nodes, the MPC8547EVTAQGD aggregates TDM, ATM, and Ethernet traffic onto uplink backbones using its on-chip TDM interfaces, dual GbE MACs, and PCI-X expansion. The hardware-accelerated SEC engine terminates IPsec tunnels for secure enterprise access, while the four SerDes lanes configured as PCI Express links to DSP line cards support voice-over-IP and DSL processing. The 0 °C to +105 °C temperature rating meets NEBS-style telecom environmental requirements for central-office and street-cabinet installations.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MPC8547EVTAQGD — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MPC8547EVTANGD | MPC8547EVTALGD | MPC8547ECVTAGD | MPC8548EVTAQGD | P2020NXE2KFC |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-ball FCBGA | 783-ball FCBGA | 783-ball FCBGA | 783-ball FCBGA | 783-ball FCBGA | 689-ball FCBGA |
| Core Architecture | Power Architecture e500 (single-core) | Power Architecture e500 | Power Architecture e500 | Power Architecture e500 | Power Architecture e500v2 (dual-core) | |
| Integrated Security Engine (SEC) | Yes | Yes | Yes | Yes | Yes | |
| Memory Controller | DDR2 with ECC, 64-bit | DDR2 with ECC, 64-bit | DDR2 with ECC, 64-bit | DDR2 with ECC, 64-bit | DDR2/DDR3 with ECC, 64-bit |
Principais diferenciais
- Extended industrial temperature rating (0 °C to +105 °C) (vs MPC8547EVTANGD)
- PowerQUICC III silicon revision R3.0 with refined local-bus controller (vs MPC8547ECVTAGD)
- Dual integrated Gigabit Ethernet MACs (vs MPC8548EVTAQGD)
- On-chip hardware security engine (SEC) (vs P2020NXE2KFC)
Notas de projeto
Estimated: at 1000 MHz core clock the MPC8547EVTAQGD draws approximately 8-12 W from the 1.0 V core rail plus 2.5 V I/O, depending on SerDes lane utilization. Provide at least 4 x 22 µF ceramic plus 470 µF bulk decoupling within 25 mm of the BGA balls, and keep the 1.0 V and 2.5 V planes physically separated to avoid coupling high-speed I/O noise into the core supply.
Estimated: junction-to-ambient thermal resistance for the 783-ball FCBGA is approximately 12-15 °C/W on a 6-layer JEDEC test board with no airflow. At 10 W total dissipation, expect a 60-75 °C temperature rise; a heatsink or forced-air cooling is mandatory if the part is deployed above 2 W in a sealed enclosure.
Route DDR2 traces as 50 Ω differential/50 Ω single-ended matched-length pairs to within ±25 mils of the longest segment. Use 100 Ω differential impedance for Serial RapidIO and PCI Express lanes, and reference the SerDes signals to a continuous ground plane on layer 2 to control return-path discontinuities. The JTAG chain should be brought to a header for boundary-scan debug during prototype bring-up.
Do not exceed the absolute maximum voltage on DDR2 signals (2.9 V on 2.5 V I/O) during hot-plug events. Configure the reset configuration words (RCW) before deasserting HRESET, and verify the DDR2 calibration lock at POST before declaring the memory subsystem ready. Failure to lock DDR2 calibration is the most common bring-up issue on new MPC8547E designs.
Place the boot ROM, system clock, and reset supervisor within 50 mm of the e500 reset and JTAG balls. The four SerDes reference-clock inputs require 100 MHz ±50 ppm LVDS sources; route them with 100 Ω differential impedance and guard-band them from switching regulators and clock-data-recovery loops to minimize jitter accumulation.
Informações de conformidade
Compliance status for RoHS, REACH, halogen-free, and conflict minerals is not explicitly stated in the verified distributor listings; refer to the NXP product declaration documents or contact NXP directly. Lead-free packaging is standard for the FCBGA variant.
