MPC8547EVTAUJB - e500 MPU 1.333 GHz 783-FCBGA | NXP
N.º da peça: MPC8547EVTAUJB ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $193.93 | $193,93 |
| 10 | $174.5 | $1.745,00 |
| 100 | $155.1 | $15.510,00 |
| 500 | $139.8 | $69.900,00 |
| 1.000 | $124.5 | $124.500,00 |
MPC8547EVTAUJB Visão geral
A microprocessor (MPU) in this category is an integrated CPU complex that executes operating-system and application code from external memory, arbitrates peripheral I/O, and provides on-chip cache to reduce external memory accesses. The e500 core belongs to the Power Architecture family and occupies the broader taxonomy of embedded MPU -> 32-bit microprocessor -> SoC -> integrated circuit. PowerQUICC III parts such as the MPC8547e extend the legacy MPC8xx QUICCcommunications heritage with modern peripheral integration, making them a frequent choice for routers, switches, and line cards where deterministic performance and rich I/O are required.
Key headline specifications include a 1.333 GHz core clock, 32-bit Power Architecture e500 core, 783-ball FCBGA (29x29 mm) package, integrated DDR2 memory controller with ECC, dual Gigabit Ethernet controllers, a flexible 8-lane PCI Express interface, and integrated security engine support for encryption and hashing acceleration. The device operates across a -40C to +105C industrial-junction-temperature range, satisfying harsh-environment industrial embedded deployments.
The architecture combines the e500 superscalar core with an on-chip platform bus that fans out to multiple peripherals, allowing the SoC to service high-throughput data-plane functions without burdening software. Hardware acceleration for common encryption algorithms and parity-protected memory paths support reliable operation in long-life networking equipment, with security and reliability features mapped to the platform's typical telecom and industrial floor profiles.
Typical applications include enterprise routers, multi-layer LAN switches, network attached storage (NAS), industrial automation controllers, telecommunications line cards, and printer/imaging controllers. The PCI Express interface suits AMC and ATCA backplane designs, while the dual GbE controllers directly drive SGMII-attached PHYs in copper and fiber uplinks.
When designing with the MPC8547EVTAUJB, ensure a multilayer PCB with continuous reference planes for the DDR2 interface, route the SERDES pairs per the NXP reference design length-matching rules, and provide robust decoupling close to each FCBGA ball-group. A JTAG header is mandatory for production boundary-scan and code debug.
Alternativas drop-in para MPC8547EVTAUJB — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MPC8547EVTAUJB (mesmo formato e footprint) — diferindo em RoHS Status, Core Architecture, Ethernet, Maximum Core Frequency, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MPC8547EVTAUHC
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MPC8547EVTAQGB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC8547VTAQGB
✅ Drop-In✓ Em estoque
$72.4 / unidade
Ver ficha técnica →MPC8548EVTATGB
✅ Drop-In✓ Em estoque
$158.75 / unidade
Ver ficha técnica →MPC8569CVJAQLJB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC8547EVTAUJB Classificações máximas e características elétricas
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) |
| Product Family | PowerQUICC III / MPC85xx |
| Core Architecture | PowerPC e500 |
| Core Count | 1 |
| Largura do barramento de dados | 32-bit |
| Maximum Core Frequency | 1.333 GHz |
| L2 Cache | 512 KB |
| Encapsulamento | 783-FCBGA (29x29 mm) |
| Tipo de montagem | Surface Mount |
| Memory Controller | DDR2 with ECC |
| Ethernet | Dual Gigabit Ethernet MACs |
| PCI Express | Integrated (8-lane capable) |
| Status RoHS | Compliant (PB Free per datasheet designation) |
| Security Engine | Integrated (per family datasheet) |
Guia de Configuração de Pinos do MPC8547EVTAUJB 783-fcbga (29x29 mm)
Configuração de pinos para MPC8547EVTAUJB (pacote 783-fcbga (29x29 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MPC8547EVTAUJB.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MPC8547EVTAUJB é adequado para 6 aplicaçãos: Enterprise Routers, Multi-Layer LAN Switches, Network Attached Storage (NAS), Industrial Automation Controllers, Telecom Line Cards (ATCA/AMC), Printer/Imaging Controllers.
Enterprise Routers
The MPC8547EVTAUJB is a strong fit for enterprise routers due to its 1.333 GHz PowerPC e500 core and integrated peripherals that match L2/L3 forwarding requirements. The dual Gigabit Ethernet MACs (GMII/RGMII/SGMII) directly drive external PHYs for copper and fiber uplinks, while the DDR2 controller with ECC supports high-bandwidth routing-table lookups. Compared with discrete CPU-plus-ASIC designs, the SoC reduces BOM and PCB area. Real-world bench throughput for typical IPv4/IPv6 forwarding exceeds the per-packet budget for 1 Gbps line-rate on most access routers. NXP's reference design and PowerQUICC III SDK shorten firmware bring-up.
Recomendado
Multi-Layer LAN Switches
In managed multi-layer LAN switches the MPC8547EVTAUJB serves as the control-plane CPU, offloading Layer 2/3 forwarding to a switch fabric via its PCI Express interface (up to 8 lanes). Running an embedded Linux or VxWorks stack on the e500 core, the SoC handles SNMP, Spanning Tree, routing protocols, and ACL management. Its 512 KB L2 cache accelerates table-walk code paths. The 783-FCBGA package allows compact board integration even with the rich peripheral mix. NXP evaluation systems include complete PCIe-to-fabric reference designs.
Recomendado
Network Attached Storage (NAS)
The MPC8547EVTAUJB fits NAS controller designs where its DDR2 controller with ECC handles cache memory and its dual GbE supports multi-LAN aggregation (LACP). The 1.333 GHz e500 core runs SMB/NFS stacks, while the PCI Express interface links to SATA or SAS controllers. PowerQUICC III parts are valued in NAS for deterministic IO behavior under RAID rebuild workloads. The 783-FCBGA package maintains mechanical compatibility across NAS product tiers, enabling single PCB layouts to host different SKUs.
Recomendado
Industrial Automation Controllers
Industrial automation controllers benefit from the MPC8547EVTAUJB's industrial-junction-temperature range, embedded peripherals, and long product lifecycle support typical of NXP embedded MPUs. The e500 core runs IEC 61131 deterministic soft-PLC or Linux real-time extensions, while the GbE and PCIe ports handle EtherCAT master/profinet gateway cards. The 783-FCBGA package with proper thermal design supports fanless DIN-rail enclosures. Long-term NXP supply continuity (10+ years per family roadmap) matches industrial OEM lifecycles.
Recomendado
Telecom Line Cards (ATCA/AMC)
The MPC8547EVTAUJB is widely deployed on ATCA and AMC telecom line cards, where its integrated PCI Express controller connects to payload-network ASICs and its GbE MACs carry control-plane traffic. The Power Architecture e500 core runs carrier-grade Linux and IPsec/TLS stacks, while the DDR2 with ECC protects control-plane memory. The 783-FCBGA package meets the high-density mechanical envelope of ATCA mezzanine modules. NXP reference designs include full PICMG-compliant AMC schematics for first-pass success.
Recomendado
Printer/Imaging Controllers
High-end office printers and production imaging controllers leverage the MPC8547EVTAUJB for its combination of e500 processing throughput, GbE for network I/O, and PCIe to attach image-pipeline ASICs. The DDR2 with ECC keeps large page buffers reliable under thermal stress. Compared with discrete architectures, the integrated SoC simplifies multi-function-printer board layouts. The 783-FCBGA package is well-suited to compact mainboards shared across printer model tiers.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MPC8547EVTAUJB — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MPC8547EVTAUHC | MPC8547EVTAQGB | MPC8547VTAQGB | MPC8548EVTATGB | MPC8569CVJAQLJB |
|---|---|---|---|---|---|---|
| Package | 783-FCBGA (29x29 mm) | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 |
| Core Count | 1 | 1 | 1 | 1 | 1 | 1 |
| Integrated GbE | Yes (Dual) | Yes (Dual) | Yes (Dual) | Yes (Dual) | Yes (Dual) | Yes (Multiple) |
| PCI Express | Yes (up to 8 lanes) | Yes (up to 8 lanes) | Yes (up to 8 lanes) | Yes (up to 8 lanes) | Yes (up to 8 lanes) | Yes (up to 8 lanes) |
| RoHS | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Principais diferenciais
- Highest speed grade within the MPC8547e family (vs MPC8547EVTAUHC)
- MPC8547e integrated security engine (vs MPC8547VTAQGB)
- Lower-cost alternative within same package (vs MPC8569CVJAQLJB)
Notas de projeto
The 783-FCBGA (29x29 mm) substrate requires a multilayer PCB (typically 8-12 layers) with continuous GND and PWR reference planes directly under the BGA. Use microvia-in-pad or stacked-via technology to escape the fine-pitch ball grid; conventional through-via fan-outs do not provide sufficient escape routing density. Match DDR2 trace lengths to within +/-25 mil per the NXP reference design length-matching rules, and add series-termination resistors at the SDRAM clock output.
Estimated: at full-load utilization the SoC dissipates roughly 8-12 W depending on peripheral activation. The 783-FCBGA package theta_J-A typically falls in the 8-12 C/W range with proper thermal via arrays beneath the die; without vias, junction-to-ambient can exceed 25 C/W. Bond the BGA to a copper spreader or use a heatsink fin-stack for fanless industrial enclosures.
SERDES pairs (PCIe, SGMII) require 85-100 ohm differential impedance with intra-pair length matching under 5 mil. Reference the NXP AN3645 application note for PCIe layout and the AN3533 SERDES routing guide. Avoid routing SERDES over PWR plane splits; keep a continuous GND reference beneath the entire pair length.
Follow the NXP MPC8547e power-sequencing specification: bring up the core VDD before IO VDD, and hold HRESET during voltage ramp until clocks are stable. Use a multi-rail PMIC such as the NXP/Freescale MC34712 or equivalent to enforce sequencing. Decouple each VDD ball with 100 nF plus 10 uF bulk capacitors placed within 50 mil of the ball.
Boot configuration word is sampled from the local bus at POR; verify pull-resistor values on the LGPL/other cfg pins match the desired boot source (NOR, NAND, EEPROM, PCIe). A wrong pull-up/down configuration is a common board-bring-up issue. Also verify JTAG TAP chain order before using boundary-scan tools.
Informações de conformidade
Datasheet suffix 'PB Free' indicates lead-free / RoHS compliance per NXP part-number convention. AEC-Q100 not applicable for this MPU; long-term industrial temperature rating is covered by NXP industrial-grade marking scheme.