MPC8548PXATGD557 - PowerQUICC III 1.2GHz e500 SoC, 783-FCPBGA | NXP
N.º da peça: MPC8548PXATGD557 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $85 | $85,00 |
| 10 | $78 | $780,00 |
| 100 | $71.5 | $7.150,00 |
| 500 | $65 | $32.500,00 |
| 1.000 | $58 | $58.000,00 |
MPC8548PXATGD557 Visão geral
A PowerQUICC III processor belongs to the broader category of communications processors, which are microprocessors designed for wired and wireless networking equipment. Within the taxonomy, it sits between general-purpose microprocessors and dedicated network processors, providing both computational throughput (via the e500 core) and hardware-accelerated I/O (via integrated peripherals). PowerQUICC III devices are widely deployed in routers, switches, base stations, and industrial control systems where deterministic I/O and protocol handling are required.
Key features include a 32-bit e500 core with double-precision floating point, 512 KB of L2 cache, a DDR2 SDRAM controller with ECC supporting up to 1 GB of memory, four Gigabit Ethernet controllers with hardware acceleration, two PCI Express interfaces, two Serial RapidIO endpoints, and dual PCI/PCI-X controllers. The device supports hardware encryption via an integrated security engine (SEC 2.0), and provides 16-bit DDR2 memory support at up to 333 MHz.
The architectural approach combines a high-performance superscalar e500 core with tightly integrated peripherals, allowing the processor to handle both control-plane and data-plane tasks without external bridge chips. The hardware-accelerated packet processing and DMA engines offload network tasks from the core, freeing CPU cycles for protocol stacks and management functions.
Typical applications include enterprise routers and switches, wireless base station controllers, industrial networking equipment, network-attached storage (NAS) controllers, and factory automation systems requiring deterministic Ethernet communication. The wide operating temperature range of 0C to 105C (industrial grade) makes it suitable for harsh-environment deployments.
When designing with this processor, careful PCB layout is critical: the 783-ball FCBGA package requires high-density routing with microvia or build-up PCB technology, and the DDR2 memory interface demands matched-length traces and proper impedance control for reliable signal integrity at 333 MHz operation.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, including parametric comparisons against same-family NXP PowerQUICC III variants.
Alternativas drop-in para MPC8548PXATGD557 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MPC8548PXATGD557 (mesmo formato e footprint) — diferindo em Core Architecture, L2 Cache, Memory Controller, Mounting Type, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
Nenhuma alternativa drop-in disponível para este produto.
Solicitar alternativasMPC8548PXATGD557 Classificações máximas e características elétricas
| Manufacturer | NXP Semiconductors |
| Series | PowerQUICC III |
| Core Processor | PowerPC e500 |
| Number of Cores | 1 |
| Core Architecture | 32-Bit Power Architecture |
| Maximum Core Frequency | 1.2 GHz |
| Encapsulamento | 783-FCPBGA (29x29 mm) |
| L2 Cache | 512 KB |
| Memory Controller | DDR2 SDRAM with ECC, up to 1 GB |
| DDR2 Speed | Up to 333 MHz |
| Ethernet | 4 x 10/100/1000 Mbps (Gigabit) |
| PCI Express | 2 lanes |
| Serial RapidIO | Yes |
| PCI/PCI-X | Dual PCI/PCI-X controllers |
| Security Engine | SEC 2.0 (AES, DES, 3DES, SHA, MD5, RSA) |
| Temperatura de operação | 0C to +105C |
| Tipo de montagem | Surface Mount (BGA) |
| Nível MSL | 3 (per JEDEC J-STD-020) |
| Status RoHS | Compliant |
| Lead-Free | Yes |
Guia de Configuração de Pinos do MPC8548PXATGD557 783-fcpbga (29x29 mm)
Configuração de pinos para MPC8548PXATGD557 (pacote 783-fcpbga (29x29 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MPC8548PXATGD557.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MPC8548PXATGD557 é adequado para 7 aplicaçãos: Enterprise Router and Switch Control Plane, Wireless Base Station Controller, Network-Attached Storage (NAS) Controller, Industrial Networking and Factory Automation, Telecom Edge Router and DSLAM, Embedded Server and Appliance Platform, Military and Aerospace Communications.
Enterprise Router and Switch Control Plane
The MPC8548PXATGD557's 1.2 GHz e500 core, 4 Gigabit Ethernet MACs with TCP/IP acceleration, and dual PCI Express make it ideal as a control-plane processor in mid-range enterprise routers and Layer 2/3 switches. It can manage routing tables, run control protocols (OSPF, BGP), and forward exception packets while maintaining low latency for control traffic.
Recomendado
Wireless Base Station Controller
The integrated Serial RapidIO, dual PCI-X, and 4 Gigabit Ethernet ports enable the MPC8548PXATGD557 to serve as a baseband controller in 3G/4G wireless base stations. Hardware-accelerated packet classification and quality-of-service queues handle real-time voice and data traffic, while the DDR2 with ECC ensures data integrity for radio network controller protocols.
Recomendado
Network-Attached Storage (NAS) Controller
With dual PCI-X buses for connecting storage controllers, 4 Gigabit Ethernet ports for network aggregation, and DDR2 with ECC for reliable memory operation, the MPC8548PXATGD557 is well suited as a NAS controller processor. The 1.2 GHz core handles file system operations (NFS, CIFS, iSCSI) while hardware offloads accelerate TCP/IP and checksum computation.
Recomendado
Industrial Networking and Factory Automation
The industrial 0C to 105C operating temperature range, deterministic Ethernet support (via QoS queues), and dual PCI-X for motion controller cards make the MPC8548PXATGD557 suitable for factory floor switches and PLCs. Its hardware-accelerated protocol handling ensures low-latency communication for EtherNet/IP, PROFINET, and Modbus TCP gateways in industrial automation systems.
Recomendado
Telecom Edge Router and DSLAM
The combination of 4 Gigabit Ethernet ports, dual PCI-X for line-card interfaces, and PCI Express for uplink aggregation allows the MPC8548PXATGD557 to function as a service processor in DSLAMs, optical line terminators (OLTs), and edge routers. Integrated SEC 2.0 in the 'E' variant provides IPsec acceleration for secure VPN termination at the network edge.
Recomendado
Embedded Server and Appliance Platform
The 1.2 GHz e500 core with hardware virtualization support, 512 KB L2 cache, and high-bandwidth peripheral integration make the MPC8548PXATGD557 a strong embedded server platform. It can run Linux with KVM-style virtualization, manage network appliances (firewalls, UTM), or serve as a secure gateway processor when the SEC 2.0 variant is used for cryptographic offload.
Recomendado
Military and Aerospace Communications
The wide operating temperature range, rugged BGA package, and integrated hardware cryptography (in SEC variants) make the MPC8548PXATGD557 suitable for military radio gateways, secure communications terminals, and avionics networking. Its deterministic performance and ECC memory support meet reliability requirements for defense and aerospace platforms with established PowerQUICC software bases.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MPC8548PXATGD557 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MPC8548EVTATGD | MPC8548PXAUQ | MPC8548PXATGB | MPC8547EVTATGD557 |
|---|---|---|---|---|---|
| Package | 783-FCPBGA (29x29 mm) | 783-FCPBGA (29x29 mm) - same | 783-FCPBGA (29x29 mm) - same | 783-FCPBGA (29x29 mm) - same | 783-FCPBGA (29x29 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Frequency | 1.2 GHz | 1.2 GHz | 0.8 GHz (-33%) | 1.0 GHz (-17%) | 1.2 GHz |
| Security Engine (SEC 2.0) | No (P variant) | Yes (E variant) | No (P variant) | No (P variant) | Yes (E variant) |
| Gigabit Ethernet Ports | 4 | 4 | 4 | 4 | 3 |
| PCI Express Lanes | 2 | 2 | 2 | 2 | 2 |
| Memory Controller | DDR2 with ECC, up to 333 MHz | DDR2 with ECC, up to 333 MHz | DDR2 with ECC, up to 333 MHz | DDR2 with ECC, up to 333 MHz | DDR2 with ECC, up to 333 MHz |
| L2 Cache | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| Operating Temperature | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
Principais diferenciais
- Single-package drop-in upgrade path across the MPC8548 family (vs MPC8547EVTATGD557)
- Hardware-accelerated TCP/IP and quality-of-service queues (vs MPC8548PXATGB)
- Integrated DDR2 controller with hardware ECC scrubbing (vs MPC8548EVTATGD)
Notas de projeto
The 783-FCPBGA package with 1 mm ball pitch requires high-density PCB technology with microvia build-up. Use at least an 8-layer stackup with dedicated ground and power planes. Route all signal layers as stripline or microstrip with controlled impedance (50 ohm single-ended, 100 ohm differential). Matched-length routing within 25 mils is mandatory for the DDR2 data lanes operating at 333 MHz.
The MPC8548PXATGD557 at 1.2 GHz core frequency dissipates approximately 5-8W typical power under full load with all peripherals active. The FCPBGA package exposes the die through the top surface; a heatsink with thermal interface material is recommended for industrial-grade deployments. Maintain junction temperature below 110C for long-term reliability in enclosed chassis without forced airflow.
The DDR2 memory controller supports 333 MHz operation, requiring careful attention to signal integrity. Place DDR2 termination resistors (50 ohm to VTT) within 200 mils of the memory device. Use fly-by topology for DDR2 address/command/control signals with VTT termination at the end of each branch. Decouple each DDR2 chip with 0.1uF and 10uF ceramic capacitors within 100 mils of the supply pins.
Common pitfalls when designing with the MPC8548 include: incorrect boot configuration (the cfg_rcw_src pins must match the reset configuration word source), missing PORESET sequencing (RESET requires a specific assertion duration), and improper JTAG chain population (TCK must be properly pulled down). Verify all power supply rails (1.0V core, 1.5V DDR2 VTT, 2.5V DDR2, 3.3V I/O) ramp in the correct sequence per the datasheet.
Separate analog and digital ground planes if using the integrated PHYs or external PHY interfaces. Place the 25 MHz system reference clock oscillator within 500 mils of the MPC8548 SYSCLK pins with guard traces around the clock routing. Keep the SerDes reference clock (typically 125 MHz for Gigabit Ethernet or 156.25 MHz for PCI Express) on an inner stripline layer with continuous ground reference on both sides.
Informações de conformidade
RoHS and lead-free compliant per NXP product documentation. AEC-Q100 not applicable - this is an industrial/communications-grade part. Halogen-free status not specified in available data.