MPC8572ELVTAVND - PowerQUICC III 1.5GHz Dual-Core MPU | NXP
N.º da peça: MPC8572ELVTAVND ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $295 | $295,00 |
| 10 | $268.5 | $2.685,00 |
| 100 | $245 | $24.500,00 |
| 500 | $220 | $110.000,00 |
| 1.000 | $198 | $198.000,00 |
MPC8572ELVTAVND Visão geral
A microprocessor (MPU) is an integrated processor that contains the central processing unit, memory management, and peripheral interfaces on a single die. Within the semiconductor taxonomy, an MPU is a sub-class of digital IC, and the PowerQUICC III family specifically targets embedded communications infrastructure where deterministic packet processing and high-speed I/O integration reduce system BOM. The MPC8572E extends this lineage with hardware cryptography and an enhanced double-precision floating-point unit, positioning it for secure networking workloads.
Key features of the MPC8572ELVTAVND include dual e500 cores with double-precision FPU, integrated DDR2 memory controllers with ECC, four GbE MACs (SGMII/RGMII), PCI Express x8, Serial RapidIO, two triple-speed Ethernets, hardware-accelerated security (AES, DES, Kasumi), and 32 KB I-cache and 32 KB D-cache per core. The 1023-FCBGA (33x33 mm) package exposes 1023 solder balls and is rated for industrial junction temperatures.
The architectural innovation lies in its hierarchical bus fabric (CoreNet platform) that allows coherent cores to share L2 cache (1 MB) and high-bandwidth I/O without contention. The hardware security engine offloads cryptographic workloads at line rate, enabling VPN, IPsec, and SSL inspection without CPU utilization penalty.
Typical applications include multi-service routers, LTE/UMTS base stations, secure gateways, network attached storage controllers, industrial control planes, and defense/aerospace packet processors. The MPC8572E is widely used where MIPS-class deterministic performance, real-time I/O, and embedded security must coexist on one die.
When designing with this device, allocate a four-layer PCB minimum with continuous reference planes for the high-speed DDR2 interface. Thermal design is critical since the 33x33 mm BGA can dissipate 10-20 W under full dual-core load. Boundary scan via IEEE 1149.1 JTAG is mandatory for production test.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para MPC8572ELVTAVND — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MPC8572ELVTAVND (mesmo formato e footprint) — diferindo em Core Architecture, Manufacturer, Memory Controller, Operating Temperature, Mounting Type.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MPC8572ELVTAULE
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MPC8572EVTAVND
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MPC8572EPXAVND
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$191.67 / unidade
Ver ficha técnica →MPC8572ECPXAVND
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$365 / unidade
Ver ficha técnica →MPC8572ELVTAVND Classificações máximas e características elétricas
| Manufacturer | NXP USA Inc. (formerly Freescale) |
| Part Family | PowerQUICC III MPC85xx |
| Core Architecture | PowerPC e500, dual-core |
| Largura do barramento de dados | 32-bit |
| Maximum Clock Speed | 1.5 GHz |
| Operating Voltage | 1.8 V / 2.5 V / 3.3 V |
| Process Technology | 0.09 um (90 nm) CMOS |
| Encapsulamento / Caixa | 1023-FCBGA (33x33 mm) |
| L2 Cache | 1 MB shared |
| L1 Cache (per core) | 32 KB I-cache + 32 KB D-cache |
| Memory Controller | Dual DDR2 with ECC |
| Ethernet | 4x GbE (SGMII/RGMII) + 2x TSEC |
| High-Speed I/O | PCI Express x8, Serial RapidIO |
| Security Engine | AES, DES, 3DES, Kasumi, SHA-1/256 |
| Tipo de montagem | Surface Mount (BGA) |
| Temperatura de operação | 0C to +85C (commercial) |
Guia de Configuração de Pinos do MPC8572ELVTAVND 1023-fcbga (33x33 mm)
Configuração de pinos para MPC8572ELVTAVND (pacote 1023-fcbga (33x33 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MPC8572ELVTAVND.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MPC8572ELVTAVND é adequado para 6 aplicaçãos: Multi-Service Router Control Plane, LTE / UMTS Base Station Baseband, Secure VPN Gateway / SSL Appliance, Network Attached Storage Controller, Industrial Control Plane Processor, Defense / Aerospace Packet Processor.
Multi-Service Router Control Plane
The MPC8572ELVTAVND's dual e500 cores at 1.5 GHz and integrated DDR2 controllers deliver deterministic packet-classification performance for multi-service routers. Its hardware security engine offloads IPsec and SSL inspection at line rate, while the four GbE MACs aggregate multiple WAN interfaces without external PHY switches. The CoreNet platform fabric ensures non-blocking traffic between cores, security accelerator, and high-speed I/O. Power dissipation under dual-core routing workloads remains within the 33x33 mm FCBGA thermal envelope when paired with forced-air cooling. Designers can consolidate routing, QoS, and encryption onto a single die.
Recomendado
LTE / UMTS Base Station Baseband
The MPC8572ELVTAVND serves as a baseband processor in LTE and UMTS Node B equipment, where its dual cores handle MAC-layer scheduling, RLC segmentation, and HARQ processing. PCI Express x8 links to dedicated DSP or FPGA accelerators for PHY-layer FFT and channel coding, while Serial RapidIO provides deterministic latency to RF front-end cards. Hardware Kasumi and Snow cipher engines accelerate cellular network authentication. The 1023-FCBGA footprint supports the high-density backplane designs typical of telecom equipment racks.
Recomendado
Secure VPN Gateway / SSL Appliance
For IPsec VPN concentrators and SSL inspection appliances, the MPC8572ELVTAVND's integrated security engine delivers AES-256 and 3DES at multi-gigabit rates without CPU involvement. Dual GbE ports handle WAN aggregation, while the DDR2 controllers sustain packet buffers for encrypted traffic bursts. The e500 cores manage routing tables, IKE negotiation, and policy enforcement. Power envelope scales with security workload, peaking near 18 W under sustained IPsec throughput. Embedded Linux with strongSwan or OpenSSL maps cleanly onto the hardware crypto offload.
Recomendado
Network Attached Storage Controller
NAS controllers benefit from the MPC8572ELVTAVND's dual-core throughput for RAID parity calculation, NFS/SMB file serving, and iSCSI offload. PCI Express connects to SAS/SATA controller ICs for disk arrays, while GbE MACs aggregate multi-gigabit network uplinks. The 1 MB L2 cache and DDR2-800 bandwidth handle metadata operations for large storage pools. The hardware crypto engine accelerates encrypted filesystems such as LUKS or ZFS with AES-NI-equivalent offload. Watch for thermal budget under RAID rebuild workloads.
Recomendado
Industrial Control Plane Processor
In industrial automation and SCADA systems, the MPC8572ELVTAVND provides deterministic control-plane processing with deterministic GbE and RapidIO connectivity to remote I/O racks. Its extended temperature capability with proper heatsinking suits factory-floor enclosures. Hardware-assisted security protects OT networks from intrusion. The 32-bit e500 cores run real-time operating systems such as VxWorks or RT-Linux for sub-millisecond control loops. ECC on DDR2 ensures memory reliability in electrically noisy industrial environments.
Recomendado
Defense / Aerospace Packet Processor
For tactical communications, signal intelligence, and avionics databuses, the MPC8572ELVTAVND's hardware security engine provides FIPS-validated AES and SHA acceleration. Its PCI Express and Serial RapidIO interfaces interoperate with FPGA-based signal-processing pipelines, while dual GbE handles encrypted backbone traffic. ECC-protected DDR2 mitigates single-event upsets in avionics environments. Software portability across the PowerQUICC III family simplifies DO-178B and MIL-STD-810 qualification reuse across platforms.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MPC8572ELVTAVND — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MPC8572ELVTAULE | MPC8572EVTAVND | MPC8572EPXAVND | MPC8572ECPXAVND |
|---|---|---|---|---|---|
| Package | 1023-FCBGA (33x33) | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Count | 2 (dual e500) | 2 (dual e500) | 2 (dual e500) | 2 (dual e500) | 2 (dual e500) |
| Hardware Security Engine | AES/DES/3DES/Kasumi/SHA | AES/DES/3DES/Kasumi/SHA | AES/DES/3DES/Kasumi/SHA | AES/DES/3DES/Kasumi/SHA | AES/DES/3DES/Kasumi/SHA |
| DDR2 Memory Controller | Dual channel with ECC | Dual channel with ECC | Dual channel with ECC | Dual channel with ECC | Dual channel with ECC |
Principais diferenciais
- Dual e500 cores at 1.5 GHz vs family variants (vs MPC8572ELVTAULE)
- Extended temperature grade for industrial deployments (vs MPC8572EVTAVND)
- Integrated hardware security engine with Kasumi/Snow ciphers (vs MPC8548E single-core part)
Notas de projeto
The MPC8572ELVTAVND dissipates 10-20 W under dual-core load at 1.5 GHz. The 33x33 mm FCBGA requires a multilayer PCB with thermal vias under the die pad and, in most chassis designs, forced-air cooling. Estimated: with theta_JA of approximately 1.0 C/W using a 12-layer board with thermal vias, junction temperature rises about 15C per 10W above ambient. Maintain junction below 125C with 15C margin under worst-case ambient.
Allocate a minimum 4-layer PCB with continuous ground and power planes for the DDR2 interface. Route DDR2 traces with matched lengths within 25 mil tolerance and 50 ohm controlled impedance. Place decoupling capacitors as close as possible to each power pin: 0.1 uF ceramic for high-frequency, 10 uF bulk per supply rail. The FCBGA land pattern requires NSMD pads with 0.5 mm pitch and solder mask defined or non-solder mask defined per IPC-7351.
The PCI Express x8 and Serial RapidIO interfaces require 100 ohm differential impedance with intra-pair skew under 5 mil. Use AC-coupling capacitors on transmit pairs near the MPC8572ELVTAVND balls. Reference clock routing must be guarded by ground vias and maintain 50 ohm single-ended impedance. For SGMII GbE links, follow the NXP reference design layout exactly - any deviation can cause link training failures at 1.25 Gbaud.
Do not skip the power-sequencing requirements of the 1.8 V, 2.5 V, and 3.3 V rails - the datasheet mandates a specific sequence to prevent latch-up. Always populate the JTAG test access port even in production designs for boundary scan per IEEE 1149.1. The CFG pins (reset configuration) must be pulled correctly at POR or the device will not start. Reset clears using reset commonly the board will not boot - verify the cfg_rcw_src selection.
Informações de conformidade
RoHS status for the MPC8572ELVTAVND was not present in the Verified Web Data snippets and is marked unknown. Lead-free (Pb-free) construction is consistent with modern NXP PowerQUICC III production per distributor listings. REACH and halogen-free status to be confirmed via the NXP product compliance letter.